DISPLAY APPARATUS
    3.
    发明申请
    DISPLAY APPARATUS 审中-公开

    公开(公告)号:US20190206903A1

    公开(公告)日:2019-07-04

    申请号:US16228213

    申请日:2018-12-20

    CPC classification number: H01L27/3244 H01L51/0097 H01L51/5268 H01L51/5275

    Abstract: A display apparatus is disclosed, which may endure deformation by an external force. The display apparatus includes a flexible substrate (110) including a plurality of pores (115); and a pixel array layer (PL) provided on a first surface of the flexible substrate (110), wherein the plurality of pores are (115) provided to be concave from a second surface opposite to the first surface of the flexible substrate (110).

    ORGANIC LIGHT EMITTING DISPLAY DEVICE
    5.
    发明申请

    公开(公告)号:US20190157608A1

    公开(公告)日:2019-05-23

    申请号:US16260194

    申请日:2019-01-29

    Abstract: A flexible organic light emitting device including a flexible substrate having an active area and a pad area; an organic light emitting diode layer disposed on the active area; an adhesive layer disposed on the organic light emitting diode layer; an encapsulation substrate disposed on the adhesive layer; a cover layer disposed between the active area and the pad area; and a back film disposed on a lower surface of the flexible substrate, futher the encapsulation substrate has a curved upper surface outside the active area, also the cover layer decreases in thickness from the active area toward the pad area.

    ORGANIC LIGHT EMITTING DISPLAY DEVICE
    6.
    发明申请

    公开(公告)号:US20170170425A1

    公开(公告)日:2017-06-15

    申请号:US15373848

    申请日:2016-12-09

    Abstract: An organic light emitting display device is discussed. The organic light emitting display device according to an embodiment includes an organic light emitting diode layer provided at an active area of a base substrate; an encapsulation layer encapsulating the organic light emitting diode layer to protect the organic light emitting diode layer; an adhesive layer in the encapsulation layer and provided on the organic light emitting diode layer to cover upper and side surfaces of the organic light emitting diode layer; and an encapsulation substrate in the encapsulation layer and provided on the adhesive layer. The encapsulation substrate is provided to have different thicknesses at the active area and outside the active area.

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