公开(公告)号：US10529874B2

公开(公告)日：2020-01-07

申请号：US15951379

申请日：2018-04-12

Applicant: LG Electronics Inc.

Inventor： Younho Heo ,  Soohyun Kim ,  Hyun Lee ,  Changhyun Jeong

IPC: H01L31/0224 ,  H01L31/02 ,  H01L31/18 ,  H01L31/0216 ,  H01L31/0304

Abstract: According to an aspect of the present invention, there is provided a method for manufacturing a compound semiconductor solar cell, comprising: forming a sacrificial layer on one surface of a mother substrate; forming a compound semiconductor layer on the sacrificial layer; forming a first protective layer formed of a compound semiconductor on the compound semiconductor layer; depositing a second passivation layer on the first passivation layer; attaching a first lamination film on the second protective layer; separating the compound semiconductor layer, the first and second protective layers, and the first lamination film from the mother substrate by performing an ELO process to remove the sacrificial layer; forming a back electrode on the compound semiconductor layer; attaching a second lamination film on the back electrode; removing the first lamination film; removing the second protective layer; removing the first protective layer; and forming a front electrode on the compound semiconductor layer.

公开(公告)号：US12176225B2

公开(公告)日：2024-12-24

申请号：US17621107

申请日：2019-07-09

Applicant: LG ELECTRONICS INC.

Inventor： Changhyun Jeong ,  Seongmin Moon ,  Changseo Park ,  Donghae Oh

IPC: H01L21/67 ,  H01L21/683 ,  H01L25/075 ,  H01L23/00

Abstract: Discussed is an assembly board including: a base portion; a plurality of assembly electrodes extending in one direction and disposed on the base portion at predetermined intervals; a dielectric layer stacked on the base portion to cover the plurality of assembly electrodes; and barrier ribs stacked on the dielectric layer and defining cells in which semiconductor light emitting diodes are seated at the predetermined intervals along an extending direction of the plurality of assembly electrodes so as to overlap a portion of the plurality of assembly electrodes, wherein the plurality of assembly electrodes include first electrodes and second electrodes disposed on different planes on the base portion, and wherein the first electrodes are disposed on one surface of the base portion, and the second electrodes are disposed on one surface of the dielectric layer.