公开(公告)号：US10607515B2

公开(公告)日：2020-03-31

申请号：US16415770

申请日：2019-05-17

Applicant: LG ELECTRONICS INC.

Inventor： Changseo Park ,  Seongmin Moon ,  Bongchu Shim ,  Kiseong Jeon ,  Hyunwoo Cho

IPC: G09F9/33 ,  H01L27/15 ,  H01L33/62 ,  H01L33/44

Abstract: The present disclosure relates to a display device using semiconductor light emitting devices and a fabrication method thereof, and the display device according to the present disclosure can include a plurality of semiconductor light emitting devices, a first wiring electrode and a second wiring electrode respectively extended from the semiconductor light emitting devices to supply an electric signal to the semiconductor light emitting devices, a plurality of pair electrodes disposed on the substrate, and provided with a first electrode and a second electrode configured to generate an electric field when an electric current is supplied, and a dielectric layer formed to cover the pair electrodes, wherein the first wiring electrode and the second wiring electrode are formed on an opposite side to the plurality of the pair electrodes with respect to the semiconductor light emitting devices.

公开(公告)号：US12176225B2

公开(公告)日：2024-12-24

申请号：US17621107

申请日：2019-07-09

Applicant: LG ELECTRONICS INC.

Inventor： Changhyun Jeong ,  Seongmin Moon ,  Changseo Park ,  Donghae Oh

IPC: H01L21/67 ,  H01L21/683 ,  H01L25/075 ,  H01L23/00

Abstract: Discussed is an assembly board including: a base portion; a plurality of assembly electrodes extending in one direction and disposed on the base portion at predetermined intervals; a dielectric layer stacked on the base portion to cover the plurality of assembly electrodes; and barrier ribs stacked on the dielectric layer and defining cells in which semiconductor light emitting diodes are seated at the predetermined intervals along an extending direction of the plurality of assembly electrodes so as to overlap a portion of the plurality of assembly electrodes, wherein the plurality of assembly electrodes include first electrodes and second electrodes disposed on different planes on the base portion, and wherein the first electrodes are disposed on one surface of the base portion, and the second electrodes are disposed on one surface of the dielectric layer.

公开(公告)号：US11798921B2

公开(公告)日：2023-10-24

申请号：US17530155

申请日：2021-11-18

Applicant: LG ELECTRONICS INC.

Inventor： Changseo Park ,  Jinhyung Lee ,  Jungsub Kim ,  Seongmin Moon ,  Younho Heo

IPC: H01L25/075 ,  H01L33/00 ,  H01L21/683 ,  H01L33/62

CPC classification number: H01L25/0753 ,  H01L21/6835 ,  H01L33/0093 ,  H01L33/62 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2933/0066

Abstract: Discussed is an assembly substrate used for a display device manufacturing method of mounting semiconductor light-emitting diodes on the assembly substrate at preset positions using electric field and magnetic field. The assembly substrate includes a base portion, a plurality of assembly electrodes on the base portion, a dielectric layer on the base portion to cover the assembly electrodes, a barrier wall on the base portion, and a metal shielding layer on the base portion, wherein the metal shielding layer overlaps the barrier wall.

公开(公告)号：US11211366B2

公开(公告)日：2021-12-28

申请号：US16834315

申请日：2020-03-30

Applicant: LG ELECTRONICS INC.

Inventor： Changseo Park ,  Jinhyung Lee ,  Jungsub Kim ,  Seongmin Moon ,  Younho Heo

IPC: H01L25/075 ,  H01L33/00 ,  H01L21/683 ,  H01L33/62

Abstract: The present disclosure relates to an assembly substrate used for a display device manufacturing method in which semiconductor light-emitting diodes are placed on the assembly substrate at preset positions using electric field and magnetic field. Specifically, the assembly substrate includes a base portion, a plurality of assembly electrodes extending in one direction and disposed on the base portion, a dielectric layer stacked on the base portion to cover the assembly electrodes, a barrier wall formed on the base portion and having a plurality of recesses for guiding the semiconductor light-emitting diodes to the preset positions, and a metal shielding layer formed on the base portion, wherein the metal shielding layer overlaps the barrier wall so that an electric field formed between the assembly electrodes is shielded.