公开(公告)号：US20250034365A1

公开(公告)日：2025-01-30

申请号：US18709264

申请日：2022-11-10

Applicant: LG ELECTRONICS INC. ,  INHA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION

Inventor： Junseok LEE ,  Dongjoo YOU ,  Jeayoul JOUNG ,  Seongmoon CHO ,  Jinkyun LEE ,  Seungsoo CHOI ,  Minkyu CHOI

IPC: C08K9/08 ,  B29C43/22 ,  C08F292/00 ,  C08J5/18

Abstract: The present embodiment provides a composite film in which a plurality of composite inorganic particles, which are inorganic particles having a fluoropolymer coating film formed therein, are sintered to form a plane shape. Therefore, the low dielectric inorganic particle composite film may reduce signal loss by being hybridized with an interlayer insulator in a high-frequency 5G area. The low dielectric inorganic particles may minimize transmission loss by enhancing dielectric properties when applied to a 5G smartphone substrate and an IF cable, since the composite film used as an interlayer insulator for a communication substrate material comprises only the inorganic particles. In addition, application of the low dielectric inorganic particles may be expanded to vehicles, construction, and IoT products which will use 5G communication in the future.

公开(公告)号：US20230257580A1

公开(公告)日：2023-08-17

申请号：US18012525

申请日：2020-06-23

Applicant: LG ELECTRONICS INC. ,  INHA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION

Inventor： Junseok LEE ,  Dongjoo YOU ,  Seongmoon CHO ,  Jinkyun LEE ,  Sejin LEE

IPC: C08L79/08 ,  C08K3/36 ,  C08K5/5415 ,  C08K7/26 ,  C08K9/06

CPC classification number: C08L79/08 ,  C08K3/36 ,  C08K5/5415 ,  C08K7/26 ,  C08K9/06

Abstract: The present disclosure relates to polyimide and a preparation method thereof. The polyimide according to an embodiment of the present disclosure comprises: silica having pores; and a fluorinated alkyl chain attached to the surface of the silica having pores, and is prepared by mixing a dispersion solution comprising the silica having pores and an organic solution comprising a polyimide precursor. Accordingly, hygroscopicity is reduced, and dispersibility can be enhanced.

公开(公告)号：US20220169807A1

公开(公告)日：2022-06-02

申请号：US17536604

申请日：2021-11-29

Applicant: LG ELECTRONICS INC.

Inventor： Junseok LEE ,  Dongjoo YOU ,  Seongmoon CHO ,  Jinkyun LEE ,  Seongsoo CHOI

IPC: C08J5/18 ,  C08K3/36 ,  C08K7/26

Abstract: The present invention is applicable to a field of a substrate for a high-frequency circuit, and relates, for example, to a composite polyimide film, a producing method thereof, and a printed circuit board using the same. More specifically, the composite polyimide film includes a film matrix including polyimide; and a plurality of filler particles dispersed in the film matrix, wherein each of the filler particles includes an inorganic particle, and a fluorine polymer coating formed on the inorganic particle.