RESIN SHEET
    2.
    发明申请

    公开(公告)号:US20230090587A1

    公开(公告)日:2023-03-23

    申请号:US17792615

    申请日:2021-01-15

    Abstract: A resin sheet is made using a resin composition containing a thermosetting component (A) and a thermally conductive filler (C). The thermosetting component (A) contains a maleimide resin. A thermal diffusion rate of the thermally cured resin sheet is 1.0×10−6 m2/s or more. When a cross section (P) of the resin sheet taken by cutting the resin sheet in a vertical direction to a surface of the resin sheet is observed in an area (P1), a condition represented by a numerical formula (F1) below is satisfied, the area (P1) being defined by a square whose sides are four times as large as a thickness of the resin sheet and including two surfaces of the resin sheet, 0.25≤Ld/Lt≤1  (F1) where Ld is a vertical length of a filler particle having a largest cross-sectional diameter in the vertical direction of the thermally conductive filler (C), and Lt is a length of the resin sheet.

    RESIN SHEET
    3.
    发明申请

    公开(公告)号:US20230064310A1

    公开(公告)日:2023-03-02

    申请号:US17792575

    申请日:2021-01-15

    Abstract: A resin sheet is made using a resin composition containing a thermosetting component (A). The thermosetting component (A) contains a maleimide resin. A thermal diffusion rate of the thermally cured resin sheet is 1.0 × 10-6 m2/s or more. The resin sheet has a thickness in a range from 5 µm to 120 µm .

    RESIN SHEET
    4.
    发明申请

    公开(公告)号:US20220145151A1

    公开(公告)日:2022-05-12

    申请号:US17441688

    申请日:2020-03-17

    Abstract: A resin sheet is made of a resin composition containing a (A) heat-curable component. The (A) heat-curable component contains a (A1) first maleimide resin. The (A1) first maleimide resin is a maleimide resin having two or more maleimide groups in one molecule, at least a pair of the maleimide groups being bonded by a binding group whose main chain includes four or more methylene groups.

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