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    Packaging for an interferometric modulator
    1.
    发明授权
    Packaging for an interferometric modulator 有权
    用于干涉式调制器的包装

    公开(公告)号：US07164520B2

    公开(公告)日：2007-01-16

    申请号：US10844819

    申请日：2004-05-12

    申请人： Lauren Fay Palmateer ,  Brian James Gally ,  William J. Cummings ,  Manish Kothari ,  Clarence Chui

    发明人： Lauren Fay Palmateer ,  Brian James Gally ,  William J. Cummings ,  Manish Kothari ,  Clarence Chui

    IPC分类号： G02F1/03

    CPC分类号： G02B26/001

    摘要： A package is made of a transparent substrate having an interferometric modulator and a back plate. A non-hermetic seal joins the back plate to the substrate to form a package, and a desiccant resides inside the package. A method of packaging an interferometric modulator includes providing a transparent substrate and manufacturing an interferometric modulator array on a backside of the substrate. A back plate is provided and a desiccant is applied to the back plate. The back plate is sealed to the backside of the substrate with a back seal in ambient conditions, thereby forming a package

    摘要翻译： 封装由具有干涉式调制器和背板的透明基板制成。 非气密密封件将背板连接到基板以形成包装，并且干燥剂驻留在包装内。 封装干涉式调制器的方法包括提供透明衬底并在衬底的背面制造干涉式调制器阵列。 设置背板，并将干燥剂施加到背板上。 背板在环境条件下用背密封件密封到基板的背面，从而形成封装

    Method of manufacture for microelectromechanical devices
    2.
    发明授权
    Method of manufacture for microelectromechanical devices 有权
    微机电装置的制造方法

    公开(公告)号：US07704772B2

    公开(公告)日：2010-04-27

    申请号：US12271793

    申请日：2008-11-14

    申请人： Ming-Hau Tung ,  Brian James Gally ,  Manish Kothari ,  Clarence Chui ,  John Batey

    发明人： Ming-Hau Tung ,  Brian James Gally ,  Manish Kothari ,  Clarence Chui ,  John Batey

    IPC分类号： H01L21/00

    CPC分类号： B81C1/00579 ,  B81B3/0008 ,  Y10T428/12542

    摘要： A method of manufacturing a microelectromechanical device includes forming at least two conductive layers on a substrate. An isolation layer is formed between the two conductive layers. The conductive layers are electrically coupled together and then the isolation layer is removed to form a gap between the conductive layers. The electrical coupling of the layers mitigates or eliminates the effects of electrostatic charge build up on the device during the removal process.

    摘要翻译： 一种制造微机电装置的方法包括在基板上形成至少两个导电层。 在两个导电层之间形成隔离层。 导电层电耦合在一起，然后去除隔离层以在导电层之间形成间隙。 这些层的电耦合可减轻或消除在去除过程中静电积累在器件上的影响。

    METHOD OF MANUFACTURE FOR MICROELECTROMECHANICAL DEVICES
    4.
    发明申请
    METHOD OF MANUFACTURE FOR MICROELECTROMECHANICAL DEVICES 有权
    微电子设备制造方法

    公开(公告)号：US20090068781A1

    公开(公告)日：2009-03-12

    申请号：US12271793

    申请日：2008-11-14

    申请人： Ming-Hau Tung ,  Brian James Gally ,  Manish Kothari ,  Clarence Chui ,  John Batey

    发明人： Ming-Hau Tung ,  Brian James Gally ,  Manish Kothari ,  Clarence Chui ,  John Batey

    IPC分类号： H01L21/00

    CPC分类号： B81C1/00579 ,  B81B3/0008 ,  Y10T428/12542

    摘要： A method of manufacturing a microelectromechanical device includes forming at least two conductive layers on a substrate. An isolation layer is formed between the two conductive layers. The conductive layers are electrically coupled together and then the isolation layer is removed to form a gap between the conductive layers. The electrical coupling of the layers mitigates or eliminates the effects of electrostatic charge build up on the device during the removal process.

    摘要翻译： 一种制造微机电装置的方法包括在基板上形成至少两个导电层。 在两个导电层之间形成隔离层。 导电层电耦合在一起，然后去除隔离层以在导电层之间形成间隙。 这些层的电耦合可减轻或消除在去除过程中静电积累在器件上的影响。

    Method of manufacture for microelectromechanical devices
    5.
    发明授权
    Method of manufacture for microelectromechanical devices 有权
    微机电装置的制造方法

    公开(公告)号：US07476327B2

    公开(公告)日：2009-01-13

    申请号：US10839329

    申请日：2004-05-04

    申请人： Ming-Hau Tung ,  Brian James Gally ,  Manish Kothari ,  Clarence Chui ,  John Batey

    发明人： Ming-Hau Tung ,  Brian James Gally ,  Manish Kothari ,  Clarence Chui ,  John Batey

    IPC分类号： B21D39/00

    CPC分类号： B81C1/00579 ,  B81B3/0008 ,  Y10T428/12542

    摘要： A method of manufacturing a microelectromechanical device includes forming at least two conductive layers on a substrate. An isolation layer is formed between the two conductive layers. The conductive layers are electrically coupled together and then the isolation layer is removed to form a gap between the conductive layers. The electrical coupling of the layers mitigates or eliminates the effects of electrostatic charge build up on the device during the removal process.

    摘要翻译： 一种制造微机电装置的方法包括在基板上形成至少两个导电层。 在两个导电层之间形成隔离层。 导电层电耦合在一起，然后去除隔离层以在导电层之间形成间隙。 这些层的电耦合可减轻或消除在去除过程中静电积累在器件上的影响。

    MEMS structures, methods of fabricating MEMS components on separate substrates and assembly of same
    6.
    发明授权
    MEMS structures, methods of fabricating MEMS components on separate substrates and assembly of same 有权
    MEMS结构，在单独基板上制造MEMS部件的方法及其组装

    公开(公告)号：US07719752B2

    公开(公告)日：2010-05-18

    申请号：US11863079

    申请日：2007-09-27

    申请人： Jeffrey Brian Sampsell ,  Brian James Gally ,  Philip Don Floyd

    发明人： Jeffrey Brian Sampsell ,  Brian James Gally ,  Philip Don Floyd

    IPC分类号： G02B26/00 ,  H01L21/00

    CPC分类号： G02B26/0841 ,  B81B3/007 ,  B81B2201/042 ,  B81B2207/07 ,  B81B2207/092 ,  G02B5/284 ,  G02B26/001 ,  H01L31/04 ,  Y10T29/49126

    摘要： Methods of fabricating a microelectromechanical systems (MEMS) device with reduced masking and MEMS devices formed by the same are disclosed. In one embodiment, a MEMS device is fabricated by laminating a front substrate and a carrier, each of which has components preformed thereon. The front substrate is provided with stationary electrodes formed thereover. A carrier including movable electrodes formed thereover is attached to the front substrate. The carrier of some embodiments is released after transferring the movable electrodes to the front substrate. In other embodiments, the carrier stays over the front substrate, and serves as a backplate for the MEMS device. Features are formed by deposition and patterning, by embossing, or by patterning and etching. In some embodiments in which the MEMS device serves as an interferometric modulator, the front substrate is also provided with black masks to prevent or mitigate bright areas in the actuated state of the MEMS device. Static interferometric modulators can also be formed by shaping or preformation and lamination. The methods not only reduce the manufacturing costs, but also provide a higher yield. The resulting MEMS devices can trap smaller volumes between laminated substrates and are less susceptible to pressure variations and moisture leakage.

    摘要翻译： 公开了制造具有减小的掩蔽的微机电系统（MEMS）装置和由其形成的MEMS装置的方法。 在一个实施例中，通过层叠前基板和载体来制造MEMS装置，每个基板具有在其上预成型的部件。 前面基板上设有形成在其上的固定电极。 包括在其上形成的可移动电极的载体附着到前基板。 一些实施例的载体在将可移动电极转移到前基板之后被释放。 在其他实施例中，载体停留在前基板上，并且用作MEMS装置的背板。 特征通过沉积和图案化，通过压花或通过图案化和蚀刻形成。 在其中MEMS器件用作干涉式调制器的一些实施例中，前基板还设置有黑色掩模以防止或减轻MEMS器件的致动状态下的亮区域。 静态干涉式调制器也可以通过成形或预形成和层压形成。 该方法不仅降低了制造成本，而且提供了更高的产量。 所得到的MEMS器件可以在层压基板之间捕获更小的体积，并且不易受压力变化和水分泄漏的影响。

    METHODS OF FABRICATING MEMS WITH SPACERS BETWEEN PLATES AND DEVICES FORMED BY SAME
    7.
    发明申请
    METHODS OF FABRICATING MEMS WITH SPACERS BETWEEN PLATES AND DEVICES FORMED BY SAME 有权
    将板与由其形成的器件之间的间隔物制成MEMS的方法

    公开(公告)号：US20100182675A1

    公开(公告)日：2010-07-22

    申请号：US12752982

    申请日：2010-04-01

    申请人： Jeffrey Brian Sampsell ,  Brian James Gally ,  Philip Don Floyd

    发明人： Jeffrey Brian Sampsell ,  Brian James Gally ,  Philip Don Floyd

    IPC分类号： G02B26/00 ,  H02N11/00 ,  H05K3/36

    CPC分类号： G02B26/0841 ,  B81B3/007 ,  B81B2201/042 ,  B81B2207/07 ,  B81B2207/092 ,  G02B5/284 ,  G02B26/001 ,  H01L31/04 ,  Y10T29/49126

    摘要： Methods of fabricating a microelectromechanical systems (MEMS) device with spacers between plates and MEMS devices formed by the same are disclosed. In one embodiment, a MEMS device is fabricated by laminating a front substrate and a carrier, each of which has components preformed thereon. The front substrate is provided with stationary electrodes formed thereover. A carrier including movable electrodes formed thereover is attached to the front substrate. The carrier of some embodiments is released after transferring the movable electrodes to the front substrate. In other embodiments, the carrier stays over the front substrate, and serves as a backplate for the MEMS device. Features are formed by deposition and patterning, by embossing, or by patterning and etching. Spacers are provided between the front substrate and the backplate to maintain a gap therebetween. The methods not only reduce the manufacturing costs, but also provide a higher yield. The resulting MEMS devices can trap smaller volumes between laminated substrates and are less susceptible to pressure variations and moisture leakage.

    摘要翻译： 公开了在其与由其形成的MEMS器件之间制造具有间隔物的微机电系统（MEMS）器件的方法。 在一个实施例中，通过层叠前基板和载体来制造MEMS装置，每个基板具有在其上预成型的部件。 前面基板上设有形成在其上的固定电极。 包括在其上形成的可移动电极的载体附着到前基板。 一些实施例的载体在将可移动电极转移到前基板之后被释放。 在其他实施例中，载体停留在前基板上，并且用作MEMS装置的背板。 特征通过沉积和图案化，通过压花或通过图案化和蚀刻形成。 间隔件设置在前基板和背板之间以在其间保持间隙。 该方法不仅降低了制造成本，而且提供了更高的产量。 所得到的MEMS器件可以在层压基板之间捕获更小的体积，并且不易受压力变化和水分泄漏的影响。

    Display device having front illuminator with turning features
    8.
    发明授权
    Display device having front illuminator with turning features 有权
    具有前照明器的显示装置具有转动特征

    公开(公告)号：US08872085B2

    公开(公告)日：2014-10-28

    申请号：US12444138

    申请日：2007-09-26

    申请人： Russell Wayne Gruhlke ,  Brian James Gally ,  Marek Mienko ,  Ion Bita ,  Gang Xu

    发明人： Russell Wayne Gruhlke ,  Brian James Gally ,  Marek Mienko ,  Ion Bita ,  Gang Xu

    IPC分类号： H01L27/00 ,  F21V8/00 ,  G02B26/00

    CPC分类号： G02B6/0051 ,  G02B6/0053 ,  G02B26/001

    摘要： In various embodiments described herein, a display device includes a front illumination device that comprises a light guide disposed forward of an array of display elements, such as an array of interferometric modulators, to distribute light across the array of display elements. The light guide panel may include a turning layer to deliver uniform illumination from a light source to the array of display elements. For many portable display applications, the light guide panel comprises the substrate used in fabricating the display elements. The light guide panel may include additional films as well. The light guide panel, for example, may include a diffuser and/or an optical isolation layer to further enhance the optical imaging characteristics of the display.

    摘要翻译： 在本文描述的各种实施例中，显示装置包括前照明装置，其包括布置在诸如干涉式调制器阵列之类的显示元件阵列之前的光导，以将光分布在显示元件阵列上。 导光板可以包括转向层，以将来自光源的均匀照明传送到显示元件阵列。 对于许多便携式显示器应用，导光板包括用于制造显示元件的基板。 导光板也可以包括另外的膜。 例如，导光板可以包括扩散器和/或光隔离层，以进一步增强显示器的光学成像特性。

    Methods of fabricating MEMS with spacers between plates and devices formed by same
    10.
    发明授权
    Methods of fabricating MEMS with spacers between plates and devices formed by same 有权
    制造具有由板形成的间隔物的MEMS与由其形成的器件的方法

    公开(公告)号：US08284475B2

    公开(公告)日：2012-10-09

    申请号：US12752982

    申请日：2010-04-01

    申请人： Jeffrey Brian Sampsell ,  Brian James Gally ,  Philip Don Floyd

    发明人： Jeffrey Brian Sampsell ,  Brian James Gally ,  Philip Don Floyd

    IPC分类号： G02B26/00 ,  G02B26/08

    CPC分类号： G02B26/0841 ,  B81B3/007 ,  B81B2201/042 ,  B81B2207/07 ,  B81B2207/092 ,  G02B5/284 ,  G02B26/001 ,  H01L31/04 ,  Y10T29/49126

    摘要： Methods of fabricating a microelectromechanical systems (MEMS) device with spacers between plates and MEMS devices formed by the same are disclosed. In one embodiment, a MEMS device is fabricated by laminating a front substrate and a carrier, each of which has components preformed thereon. The front substrate is provided with stationary electrodes formed thereover. A carrier including movable electrodes formed thereover is attached to the front substrate. The carrier of some embodiments is released after transferring the movable electrodes to the front substrate. In other embodiments, the carrier stays over the front substrate, and serves as a backplate for the MEMS device. Features are formed by deposition and patterning, by embossing, or by patterning and etching. Spacers are provided between the front substrate and the backplate to maintain a gap therebetween. The methods not only reduce the manufacturing costs, but also provide a higher yield. The resulting MEMS devices can trap smaller volumes between laminated substrates and are less susceptible to pressure variations and moisture leakage.

    摘要翻译： 公开了在其与由其形成的MEMS器件之间制造具有间隔物的微机电系统（MEMS）器件的方法。 在一个实施例中，通过层叠前基板和载体来制造MEMS装置，每个基板具有在其上预成型的部件。 前面基板上设有形成在其上的固定电极。 包括在其上形成的可移动电极的载体附着到前基板。 一些实施例的载体在将可移动电极转移到前基板之后被释放。 在其他实施例中，载体停留在前基板上，并且用作MEMS装置的背板。 特征通过沉积和图案化，通过压花或通过图案化和蚀刻形成。 间隔件设置在前基板和背板之间以在其间保持间隙。 该方法不仅降低了制造成本，而且提供了更高的产量。 所得到的MEMS器件可以在层压基板之间捕获更小的体积，并且不易受压力变化和水分泄漏的影响。