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    Packaging for an interferometric modulator
    1.
    发明授权
    Packaging for an interferometric modulator 有权
    用于干涉式调制器的包装

    公开(公告)号：US07164520B2

    公开(公告)日：2007-01-16

    申请号：US10844819

    申请日：2004-05-12

    申请人： Lauren Fay Palmateer ,  Brian James Gally ,  William J. Cummings ,  Manish Kothari ,  Clarence Chui

    发明人： Lauren Fay Palmateer ,  Brian James Gally ,  William J. Cummings ,  Manish Kothari ,  Clarence Chui

    IPC分类号： G02F1/03

    CPC分类号： G02B26/001

    摘要： A package is made of a transparent substrate having an interferometric modulator and a back plate. A non-hermetic seal joins the back plate to the substrate to form a package, and a desiccant resides inside the package. A method of packaging an interferometric modulator includes providing a transparent substrate and manufacturing an interferometric modulator array on a backside of the substrate. A back plate is provided and a desiccant is applied to the back plate. The back plate is sealed to the backside of the substrate with a back seal in ambient conditions, thereby forming a package

    摘要翻译： 封装由具有干涉式调制器和背板的透明基板制成。 非气密密封件将背板连接到基板以形成包装，并且干燥剂驻留在包装内。 封装干涉式调制器的方法包括提供透明衬底并在衬底的背面制造干涉式调制器阵列。 设置背板，并将干燥剂施加到背板上。 背板在环境条件下用背密封件密封到基板的背面，从而形成封装

    Method of manufacture for microelectromechanical devices
    2.
    发明授权
    Method of manufacture for microelectromechanical devices 有权
    微机电装置的制造方法

    公开(公告)号：US07704772B2

    公开(公告)日：2010-04-27

    申请号：US12271793

    申请日：2008-11-14

    申请人： Ming-Hau Tung ,  Brian James Gally ,  Manish Kothari ,  Clarence Chui ,  John Batey

    发明人： Ming-Hau Tung ,  Brian James Gally ,  Manish Kothari ,  Clarence Chui ,  John Batey

    IPC分类号： H01L21/00

    CPC分类号： B81C1/00579 ,  B81B3/0008 ,  Y10T428/12542

    摘要： A method of manufacturing a microelectromechanical device includes forming at least two conductive layers on a substrate. An isolation layer is formed between the two conductive layers. The conductive layers are electrically coupled together and then the isolation layer is removed to form a gap between the conductive layers. The electrical coupling of the layers mitigates or eliminates the effects of electrostatic charge build up on the device during the removal process.

    摘要翻译： 一种制造微机电装置的方法包括在基板上形成至少两个导电层。 在两个导电层之间形成隔离层。 导电层电耦合在一起，然后去除隔离层以在导电层之间形成间隙。 这些层的电耦合可减轻或消除在去除过程中静电积累在器件上的影响。

    METHOD OF MANUFACTURE FOR MICROELECTROMECHANICAL DEVICES
    4.
    发明申请
    METHOD OF MANUFACTURE FOR MICROELECTROMECHANICAL DEVICES 有权
    微电子设备制造方法

    公开(公告)号：US20090068781A1

    公开(公告)日：2009-03-12

    申请号：US12271793

    申请日：2008-11-14

    申请人： Ming-Hau Tung ,  Brian James Gally ,  Manish Kothari ,  Clarence Chui ,  John Batey

    发明人： Ming-Hau Tung ,  Brian James Gally ,  Manish Kothari ,  Clarence Chui ,  John Batey

    IPC分类号： H01L21/00

    CPC分类号： B81C1/00579 ,  B81B3/0008 ,  Y10T428/12542

    摘要： A method of manufacturing a microelectromechanical device includes forming at least two conductive layers on a substrate. An isolation layer is formed between the two conductive layers. The conductive layers are electrically coupled together and then the isolation layer is removed to form a gap between the conductive layers. The electrical coupling of the layers mitigates or eliminates the effects of electrostatic charge build up on the device during the removal process.

    摘要翻译： 一种制造微机电装置的方法包括在基板上形成至少两个导电层。 在两个导电层之间形成隔离层。 导电层电耦合在一起，然后去除隔离层以在导电层之间形成间隙。 这些层的电耦合可减轻或消除在去除过程中静电积累在器件上的影响。

    Method of manufacture for microelectromechanical devices
    5.
    发明授权
    Method of manufacture for microelectromechanical devices 有权
    微机电装置的制造方法

    公开(公告)号：US07476327B2

    公开(公告)日：2009-01-13

    申请号：US10839329

    申请日：2004-05-04

    申请人： Ming-Hau Tung ,  Brian James Gally ,  Manish Kothari ,  Clarence Chui ,  John Batey

    发明人： Ming-Hau Tung ,  Brian James Gally ,  Manish Kothari ,  Clarence Chui ,  John Batey

    IPC分类号： B21D39/00

    CPC分类号： B81C1/00579 ,  B81B3/0008 ,  Y10T428/12542

    摘要： A method of manufacturing a microelectromechanical device includes forming at least two conductive layers on a substrate. An isolation layer is formed between the two conductive layers. The conductive layers are electrically coupled together and then the isolation layer is removed to form a gap between the conductive layers. The electrical coupling of the layers mitigates or eliminates the effects of electrostatic charge build up on the device during the removal process.

    摘要翻译： 一种制造微机电装置的方法包括在基板上形成至少两个导电层。 在两个导电层之间形成隔离层。 导电层电耦合在一起，然后去除隔离层以在导电层之间形成间隙。 这些层的电耦合可减轻或消除在去除过程中静电积累在器件上的影响。

    Method and system for packaging MEMS devices with glass seal
    6.
    发明授权
    Method and system for packaging MEMS devices with glass seal 有权
    用于封装具有玻璃密封的MEMS器件的方法和系统

    公开(公告)号：US08735225B2

    公开(公告)日：2014-05-27

    申请号：US12415986

    申请日：2009-03-31

    申请人： Lauren Palmateer ,  William J. Cummings ,  Brian Gally ,  Clarence Chui ,  Manish Kothari

    发明人： Lauren Palmateer ,  William J. Cummings ,  Brian Gally ,  Clarence Chui ,  Manish Kothari

    IPC分类号： H01L23/31

    CPC分类号： B81B7/0038 ,  B81C2203/019 ,  G02B26/001

    摘要： Methods and systems for packaging MEMS devices such as interferometric modulator arrays are disclosed. One embodiment of a MEMS device package structure includes a seal with a chemically reactant getter. Another embodiment of a MEMS device package comprises a primary seal with a getter, and a secondary seal proximate an outer periphery of the primary seal. Yet another embodiment of a MEMS device package comprises a getter positioned inside the MEMS device package and proximate an inner periphery of the package seal.

    摘要翻译： 公开了用于封装诸如干涉式调制器阵列之类的MEMS装置的方法和系统。 MEMS器件封装结构的一个实施例包括具有化学反应物吸气剂的密封。 MEMS器件封装的另一实施例包括具有吸气剂的主密封件和靠近主密封件的外周边的次级密封件。 MEMS器件封装的另一个实施例包括位于MEMS器件封装内部并且靠近封装密封件的内周边的吸气剂。

    METHOD OF MAKING AN ELECTRONIC DEVICE WITH A CURVED BACKPLATE
    9.
    发明申请
    METHOD OF MAKING AN ELECTRONIC DEVICE WITH A CURVED BACKPLATE 有权
    制造具有弯曲背板的电子设备的方法

    公开(公告)号：US20110053304A1

    公开(公告)日：2011-03-03

    申请号：US12904825

    申请日：2010-10-14

    申请人： Lauren Palmateer ,  Brian J. Gally ,  William J. Cummings ,  Manish Kothari ,  Clarence Chui

    发明人： Lauren Palmateer ,  Brian J. Gally ,  William J. Cummings ,  Manish Kothari ,  Clarence Chui

    IPC分类号： H01L21/00

    CPC分类号： G02B26/001

    摘要： A package is made of a transparent substrate having an interferometric modulator and a back plate. A non-hermetic seal joins the back plate to the substrate to form a package, and a desiccant resides inside the package. A method of packaging an interferometric modulator includes providing a transparent substrate and manufacturing an interferometric modulator array on a backside of the substrate. A back plate includes a curved portion relative to the substrate. The curved portion is substantially throughout the back plate. The back plate is sealed to the backside of the substrate with a back seal in ambient conditions, thereby forming a package.

    摘要翻译： 封装由具有干涉式调制器和背板的透明基板制成。 非气密密封件将背板连接到基板以形成包装，并且干燥剂驻留在包装内。 封装干涉式调制器的方法包括提供透明衬底并在衬底的背面制造干涉式调制器阵列。 背板包括相对于基板的弯曲部分。 弯曲部分基本上遍及后板。 背板在环境条件下用背密封件密封到基板的背面，由此形成封装。