公开(公告)号：US20240395986A1

公开(公告)日：2024-11-28

申请号：US18669141

申请日：2024-05-20

Applicant: Lextar Electronics Corporation

Inventor： Shiou-Yi KUO ,  Jian-Chin LIANG ,  Cheng-Hsien LI ,  Kai Hung CHENG

IPC: H01L33/58 ,  H01L25/075 ,  H01L33/10 ,  H01L33/38

Abstract: A light-emitting element, a manufacturing method thereof, and a package structure are provided. The light-emitting element includes a first semiconductor layer, an active layer disposed on the first semiconductor layer, a second semiconductor layer disposed on the active layer, and a convex lens structure disposed on the second semiconductor layer. The convex lens structure includes a plurality of microlenses. The microlenses and the second semiconductor layer are integrally formed and have the same material. The radius of curvature of one of the microlenses is 0.2 μm to 5.0 μm, and the light-emission angle of the light-emitting element is 100° to 110°.

公开(公告)号：US20240355986A1

公开(公告)日：2024-10-24

申请号：US18633418

申请日：2024-04-11

Applicant: Lextar Electronics Corporation

Inventor： Shiou-Yi KUO ,  Guo-Yi SHIU ,  Chin-Hung LO ,  Chih-Hao LIN ,  Cheng-Hsien LI ,  Wei-Yuan MA

IPC: H01L33/62 ,  H01L23/00 ,  H01L25/075

CPC classification number: H01L33/62 ,  H01L24/19 ,  H01L24/20 ,  H01L25/0753 ,  H01L2224/19 ,  H01L2224/211 ,  H01L2933/0066

Abstract: A micro light-emitting diode package structure and a forming method thereof are provided. The micro light-emitting diode package structure includes micro light-emitting diode dies, a light-transmitting layer, a first insulating layer, redistribution layers, and conductive elements. The micro light-emitting diode dies are disposed side by side and each includes an electrode surface, a light-emitting surface, and side surfaces. The electrode surface and the light-emitting surface are opposite to each other, and the side surfaces are between them. The light-transmitting layer covers the light-emitting surface and the side surfaces. The first insulating layer is under the micro light-emitting diode dies and in direct contact with the electrode surface. The redistribution layers are disposed under the first insulating layer and pass through the first insulating layer to electrically connect the electrode surface. The conductive elements are disposed under the redistribution layers and electrically connected to the redistribution layers.