公开(公告)号：US20150124476A1

公开(公告)日：2015-05-07

申请号：US14337648

申请日：2014-07-22

Applicant: Lextar Electronics Corporation

Inventor： Kuang-Neng YANG ,  Kun-Hua WU ,  Jo-Hsiang CHEN ,  Tai-Hua HO ,  Tzong-Liang TSAI ,  Chih-Hao LIN

IPC: F21K99/00 ,  F21V9/16 ,  F21V9/08

CPC classification number: F21V9/30 ,  F21K9/20 ,  F21K9/64 ,  F21Y2103/00 ,  F21Y2115/10

Abstract: A lighting apparatus includes a wavelength converting apparatus. The wavelength converting apparatus includes a hollow tube and a wavelength converting material. The hollow tube has an accommodating chamber. The wavelength converting material is positioned in the accommodating chamber.

Abstract translation: 照明装置包括波长转换装置。 波长转换装置包括中空管和波长转换材料。 中空管具有容纳室。 波长转换材料位于容纳室中。

公开(公告)号：US20140268877A1

公开(公告)日：2014-09-18

申请号：US14077655

申请日：2013-11-12

Applicant: Lextar Electronics Corporation

Inventor： Kuang-Neng YANG ,  Kun-Hua WU ,  Jo-Hsiang CHEN ,  Chih-Hao LIN ,  Che-Wei HSU ,  Tzong-Liang TSAI

IPC: H01L25/075 ,  F21V8/00

CPC classification number: H01L25/0753 ,  G02B6/0083 ,  H01L33/505 ,  H01L33/507 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A luminous element includes a heat dissipation plate, a body, a plurality of LED chips, a first connector and a second connector. The heat dissipation plate includes a die-bonding area and a heat dissipation area opposite to the die-bonding area. The body surrounds the heat dissipation plate, and includes a first body surface and a second body surface opposite to the first body surface. The first body surface includes a concave part exposing the die-bonding area. The second body surface includes an opening exposing the heat dissipation area. The LED chips are mounted on the die-bonding area. The first and the second connectors are disposed on the body, and they can be pluggably connected to an external power source or other connectors. The LED chips are connected to the electrical input terminals in the first and the second connectors.

Abstract translation: 发光元件包括散热板，主体，多个LED芯片，第一连接器和第二连接器。 散热板包括芯片接合区域和与芯片接合区域相对的散热区域。 主体围绕散热板，并且包括与第一主体表面相对的第一主体表面和第二主体表面。 第一体表包括露出芯片接合区域的凹部。 第二体表面包括露出散热区域的开口。 LED芯片安装在芯片接合区域上。 第一和第二连接器设置在主体上，并且它们可以可插拔地连接到外部电源或其它连接器。 LED芯片连接到第一和第二连接器中的电输入端子。