公开(公告)号：US08735929B2

公开(公告)日：2014-05-27

申请号：US13861420

申请日：2013-04-12

Applicant: Lextar Electronics Corporation

Inventor： Pei-Song Cai ,  Yun-Yi Tien ,  Tzu-Pu Lin ,  Chun-Wei Wang ,  Jian-Chin Liang

IPC: H01L33/00

CPC classification number: H01L33/48 ,  H01L33/486 ,  H01L33/505 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A light-emitting diode (LED) package comprising a carrier, an LED chip and a phosphor glue is provided. The carrier has a recess, an upper surface, and a ring-shape rough surface connected to a top edge of the recess. The LED chip is disposed within the recess. The phosphor glue fills up the recess and over the upper surface of the carrier. An edge of the phosphor glue contacts the ring-shape rough surface.

Abstract translation: 提供了包括载体，LED芯片和磷光体胶的发光二极管（LED）封装。 载体具有连接到凹部的顶部边缘的凹部，上表面和环形粗糙表面。 LED芯片设置在凹槽内。 磷光体胶填充凹槽并在载体的上表面上方。 磷光胶的边缘接触环形粗糙表面。

公开(公告)号：US20130270594A1

公开(公告)日：2013-10-17

申请号：US13861420

申请日：2013-04-12

Applicant: LEXTAR ELECTRONICS CORPORATION

Inventor： Pei-Song Cai ,  Yun-Yi Tien ,  Tzu-Pu Lin ,  Chun-Wei Wang ,  Jian-Chin Liang

IPC: H01L33/48

CPC classification number: H01L33/48 ,  H01L33/486 ,  H01L33/505 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A light-emitting diode (LED) package comprising a carrier, an LED chip and a phosphor glue is provided. The carrier has a recess, an upper surface, and a ring-shape rough surface connected to a top edge of the recess. The LED chip is disposed within the recess. The phosphor glue fills up the recess and over the upper surface of the carrier. An edge of the phosphor glue contacts the ring-shape rough surface.

Abstract translation: 提供了包括载体，LED芯片和磷光体胶的发光二极管（LED）封装。 载体具有连接到凹部的顶部边缘的凹部，上表面和环形粗糙表面。 LED芯片设置在凹槽内。 磷光体胶填充凹槽并在载体的上表面上方。 磷光胶的边缘接触环形粗糙表面。