公开(公告)号：US09890930B2

公开(公告)日：2018-02-13

申请号：US13709655

申请日：2012-12-10

Applicant: LEXTAR ELECTRONICS CORPORATION

Inventor： Yun-Yi Tien ,  Pei-Song Cai ,  Jian-Chin Liang

IPC: F21V1/00 ,  F21V9/16 ,  H01L25/075 ,  H01L33/50 ,  H01L33/60 ,  F21Y115/10

CPC classification number: F21V9/30 ,  F21V9/08 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/504 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A light source module includes a substrate, a first illumination element, a second illumination element and a third illumination element. The first illumination element includes a blue LED chip disposed on the substrate and a first wavelength converting layer that covers the blue LED chip, in which blue light emitted from the blue LED chip can be converted to light in the range of a first wavelength. The second illumination element includes a blue LED chip disposed on the substrate and a second wavelength converting layer that covers the blue LED chip, in which blue light emitted from the blue LED chip can be converted to light in the range of a second wavelength. The third illumination element includes a blue LED chip.

公开(公告)号：US10908344B2

公开(公告)日：2021-02-02

申请号：US16373651

申请日：2019-04-03

Applicant: Lextar Electronics Corporation

Inventor： Pei-Song Cai ,  Lung-Kuan Lai ,  Shih-Yu Yeh ,  Guan-Zhi Chen ,  Hong-Zhi Liu ,  Kuo-Yen Chang ,  Ching-Hua Li

IPC: G02B6/00 ,  F21V8/00

Abstract: A light-emitting module structure includes a substrate, a plurality of light-emitting diodes (LEDs) disposed on the substrate, and a light-guiding layer covering the light-emitting diodes. The light-guiding layer has an upper surface, the upper surface has a plurality of recesses, and the recesses are above the light-emitting diodes or between the light-emitting diodes. This light-emitting module structure can improve the brightness and uniformity of the light-emitting module.

公开(公告)号：US11422296B2

公开(公告)日：2022-08-23

申请号：US17134548

申请日：2020-12-28

Applicant: Lextar Electronics Corporation

Inventor： Pei-Song Cai ,  Lung-Kuan Lai ,  Shih-Yu Yeh ,  Guan-Zhi Chen ,  Hong-Zhi Liu ,  Kuo-Yen Chang ,  Ching-Hua Li

IPC: G02B6/00 ,  F21V8/00

Abstract: A light-emitting module structure includes a substrate, a plurality of light-emitting diodes (LEDs) disposed on the substrate, and a light-guiding layer covering the light-emitting diodes. The light-guiding layer has an upper surface, the upper surface has a plurality of recesses, and the recesses are above the light-emitting diodes or between the light-emitting diodes. This light-emitting module structure can improve the brightness and uniformity of the light-emitting module.

公开(公告)号：US10720559B2

公开(公告)日：2020-07-21

申请号：US16153823

申请日：2018-10-07

Applicant: Lextar Electronics Corporation

Inventor： Lung-Kuan Lai ,  Pei-Song Cai ,  Jian-Chin Liang ,  Hao-Chung Chan ,  Hong-Zhi Liu

IPC: H01L33/62 ,  H01L33/50 ,  H01L33/56 ,  H01L25/075 ,  H01L33/48

Abstract: A light-emitting diode (LED) device and a manufacturing method thereof are provided. The LED device includes a frame body, a first conductive extension structure, a second conductive extension structure, and a LED chip. The frame body includes an upper surface, a bottom, a recess on the opposite side of the bottom, and a first side surface and a second side surface opposite to each other. The first and second conductive extension structures are located in the frame body. The first and second conductive extension structures extend from the first side surface to the second side surface of the frame body. The frame body encapsulates a left side surface, a right side surface, a top surface, and a bottom surface of each of the first and second conductive extension structures. The LED chip is disposed in the recess and includes a first conductive pad and a second conductive pad.

公开(公告)号：US20130322067A1

公开(公告)日：2013-12-05

申请号：US13709655

申请日：2012-12-10

Applicant: LEXTAR ELECTRONICS CORPORATION

Inventor： Yun-Yi Tien ,  Pei-Song Cai ,  Jian-Chin Liang

IPC: F21V9/16

CPC classification number: F21V9/30 ,  F21V9/08 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/504 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A light source module includes a substrate, a first illumination element, a second illumination element and a third illumination element. The first illumination element includes a blue LED chip disposed on the substrate and a first wavelength converting layer that covers the blue LED chip, in which blue light emitted from the blue LED chip can be converted to light in the range of a first wavelength. The second illumination element includes a blue LED chip disposed on the substrate and a second wavelength converting layer that covers the blue LED chip, in which blue light emitted from the blue LED chip can be converted to light in the range of a second wavelength. The third illumination element includes a blue LED chip.

Abstract translation: 光源模块包括基板，第一照明元件，第二照明元件和第三照明元件。 第一照明元件包括设置在基板上的蓝色LED芯片和覆盖蓝色LED芯片的第一波长转换层，其中从蓝色LED芯片发射的蓝色光可以在第一波长的范围内被转换为光。 第二照明元件包括设置在基板上的蓝色LED芯片和覆盖蓝色LED芯片的第二波长转换层，其中从蓝色LED芯片发出的蓝色光可以转换成第二波长范围内的光。 第三照明元件包括蓝色LED芯片。

公开(公告)号：US08735929B2

公开(公告)日：2014-05-27

申请号：US13861420

申请日：2013-04-12

Applicant: Lextar Electronics Corporation

Inventor： Pei-Song Cai ,  Yun-Yi Tien ,  Tzu-Pu Lin ,  Chun-Wei Wang ,  Jian-Chin Liang

IPC: H01L33/00

CPC classification number: H01L33/48 ,  H01L33/486 ,  H01L33/505 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A light-emitting diode (LED) package comprising a carrier, an LED chip and a phosphor glue is provided. The carrier has a recess, an upper surface, and a ring-shape rough surface connected to a top edge of the recess. The LED chip is disposed within the recess. The phosphor glue fills up the recess and over the upper surface of the carrier. An edge of the phosphor glue contacts the ring-shape rough surface.

Abstract translation: 提供了包括载体，LED芯片和磷光体胶的发光二极管（LED）封装。 载体具有连接到凹部的顶部边缘的凹部，上表面和环形粗糙表面。 LED芯片设置在凹槽内。 磷光体胶填充凹槽并在载体的上表面上方。 磷光胶的边缘接触环形粗糙表面。

公开(公告)号：US20130270594A1

公开(公告)日：2013-10-17

申请号：US13861420

申请日：2013-04-12

Applicant: LEXTAR ELECTRONICS CORPORATION

Inventor： Pei-Song Cai ,  Yun-Yi Tien ,  Tzu-Pu Lin ,  Chun-Wei Wang ,  Jian-Chin Liang

IPC: H01L33/48

CPC classification number: H01L33/48 ,  H01L33/486 ,  H01L33/505 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A light-emitting diode (LED) package comprising a carrier, an LED chip and a phosphor glue is provided. The carrier has a recess, an upper surface, and a ring-shape rough surface connected to a top edge of the recess. The LED chip is disposed within the recess. The phosphor glue fills up the recess and over the upper surface of the carrier. An edge of the phosphor glue contacts the ring-shape rough surface.

Abstract translation: 提供了包括载体，LED芯片和磷光体胶的发光二极管（LED）封装。 载体具有连接到凹部的顶部边缘的凹部，上表面和环形粗糙表面。 LED芯片设置在凹槽内。 磷光体胶填充凹槽并在载体的上表面上方。 磷光胶的边缘接触环形粗糙表面。