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    LIGHT-EMITTING DIODE PACKAGE
    1.
    发明申请
    LIGHT-EMITTING DIODE PACKAGE 审中-公开
    发光二极管封装

    公开(公告)号：US20150129914A1

    公开(公告)日：2015-05-14

    申请号：US14340491

    申请日：2014-07-24

    Applicant: LEXTAR ELECTRONICS CORPORATION

    Inventor： Yun-Yi Tien

    IPC: H01L33/60 ,  H01L33/62 ,  H01L33/50

    CPC classification number: H01L33/58 ,  H01L33/486 ,  H01L33/56 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: The invention provides a light-emitting diode package. The light-emitting diode package includes a lead frame having a first lead and a second lead separated from each other by a space. A transparent plastic housing surrounds and encapsulates the lead frame to form a cup-shaped body having a recessed accommodating space. A bottom of the space is defined as a function area. The function area comprises an exposed surface of the first lead and an exposed surface of the second lead. A top of the space is defined as an opening for light emission. A light-emitting diode chip is mounted on the first lead in the function area, electrically connected to the second lead. A white reflective material is disposed on an isolation area in the function area, covering the first and second leads adjacent to the space. An encapsulation material fills the recessed accommodating space.

    Abstract translation: 本发明提供一种发光二极管封装。 发光二极管封装包括具有第一引线和第二引线的引线框架，第一引线和第二引线通过空间彼此分离。 透明的塑料壳体包围并封装引线框架以形成具有凹入的容纳空间的杯形本体。 空间的底部被定义为一个功能区域。 功能区域包括第一引线的暴露表面和第二引线的暴露表面。 该空间的顶部被定义为用于发光的开口。 发光二极管芯片安装在功能区域中的第一引线上，电连接到第二引线。 白色反射材料设置在功能区域的隔离区域上，覆盖与该空间相邻的第一和第二引线。 封装材料填充凹入的容纳空间。

    Light emitting device and backlight module
    2.
    发明授权
    Light emitting device and backlight module 有权

    公开(公告)号：US10677423B2

    公开(公告)日：2020-06-09

    申请号：US16214128

    申请日：2018-12-09

    Applicant: Lextar Electronics Corporation

    Inventor： Yin-Cyuan Wu ,  Yu-Chang Wu ,  Yun-Yi Tien

    IPC: F21V9/38 ,  F21Y115/10

    Abstract: A light emitting device includes a circuit board, light-emitting diodes, an optically clear adhesive layer and a transparent film. The light-emitting diodes are disposed on a surface of the circuit board. The optically clear adhesive layer is disposed on the surface of the circuit board and covers the light-emitting diodes. The transparent film is disposed over a side of the optically clear adhesive layer distant from the circuit board. A hardness of the transparent film is greater than a hardness of the optically clear adhesive layer.

    Light emitting device, backlight, and display panel with reflective layer
    5.
    发明授权
    Light emitting device, backlight, and display panel with reflective layer 有权

    公开(公告)号：US11579486B2

    公开(公告)日：2023-02-14

    申请号：US17454820

    申请日：2021-11-14

    Applicant: Lextar Electronics Corporation

    Inventor： Yun-Yi Tien ,  Yu-Chang Wu ,  Yu-Li Chang

    IPC: G02F1/13357 ,  H01L33/00 ,  H01L33/54 ,  H01L33/60 ,  G02F1/1335

    Abstract: The present disclosure provides a light emitting device including a substrate, a conductive layer, first and second reflective layers, a light emitting element, and an encapsulation layer. The conductive layer is disposed on the substrate. The first reflective layer covers the conductive layer and has an opening exposing a portion of the conductive layer. The light emitting element is disposed in the opening and electrically connects to the conductive layer. The second reflective layer is disposed on the first reflective layer and surrounds the light emitting element, and the second reflective layer has an outer diameter. The encapsulation layer covers the light emitting element. There is a height between a highest point of the encapsulation layer and an upper surface of the first reflective layer, and the height is 0.1 to 0.5 times the outer diameter. The present disclosure also provides a backlight and a display panel.

    LIGHT EMITTING DEVICE, BACKLIGHT, AND DISPLAY PANEL
    6.
    发明申请
    LIGHT EMITTING DEVICE, BACKLIGHT, AND DISPLAY PANEL 有权

    公开(公告)号：US20220163849A1

    公开(公告)日：2022-05-26

    申请号：US17454820

    申请日：2021-11-14

    Applicant: Lextar Electronics Corporation

    Inventor： Yun-Yi Tien ,  Yu-Chang Wu ,  Yu-Li Chang

    IPC: G02F1/13357 ,  H01L33/00 ,  H01L33/54 ,  H01L33/60 ,  G02F1/1335

    Abstract: The present disclosure provides a light emitting device including a substrate, a conductive layer, first and second reflective layers, a light emitting element, and an encapsulation layer. The conductive layer is disposed on the substrate. The first reflective layer covers the conductive layer and has an opening exposing a portion of the conductive layer. The light emitting element is disposed in the opening and electrically connects to the conductive layer. The second reflective layer is disposed on the first reflective layer and surrounds the light emitting element, and the second reflective layer has an outer diameter. The encapsulation layer covers the light emitting element. There is a height between a highest point of the encapsulation layer and an upper surface of the first reflective layer, and the height is 0.1 to 0.5 times the outer diameter. The present disclosure also provides a backlight and a display panel.

    LIGHT EMITTING DIODE PACKAGE STRUCTURE
    7.
    发明申请
    LIGHT EMITTING DIODE PACKAGE STRUCTURE 审中-公开
    发光二极管封装结构

    公开(公告)号：US20150014720A1

    公开(公告)日：2015-01-15

    申请号：US14252848

    申请日：2014-04-15

    Applicant: Lextar Electronics Corporation

    Inventor： Yun-Yi Tien

    IPC: H01L33/48 ,  H01L33/60 ,  H01L33/50

    CPC classification number: H01L33/486 ,  H01L33/20 ,  H01L33/504 ,  H01L33/507 ,  H01L33/56 ,  H01L2224/1403 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/181 ,  H01L2933/0033 ,  H01L2924/00012

    Abstract: A LED package structure including a carrier and a light emitting diode (LED) chip is provided. The LED chip includes a substrate, a patterned structure, a first semiconductor layer, an active layer and a second semiconductor layer. The substrate has a first surface and a second surface opposite to the first surface. The patterned structure is formed on the second surface of the substrate. The first semiconductor layer is disposed on the first surface of the substrate. The active layer is disposed on a portion of a surface of the first semiconductor layer, and other portion of the surface not covered by the active layer is exposed. The second semiconductor layer is disposed on the active layer. The LED chip is disposed on the carrier by way of flip-chip so that the first and the second semiconductor layers face towards the carrier.

    Abstract translation: 提供了包括载体和发光二极管（LED）芯片的LED封装结构。 LED芯片包括基板，图案化结构，第一半导体层，有源层和第二半导体层。 基板具有与第一表面相对的第一表面和第二表面。 图案化结构形成在基板的第二表面上。 第一半导体层设置在基板的第一表面上。 有源层设置在第一半导体层的表面的一部分上，并且未被有源层覆盖的表面的其他部分被暴露。 第二半导体层设置在有源层上。 LED芯片通过倒装芯片布置在载体上，使得第一和第二半导体层面向载体。

    Optical structure
    9.
    发明授权
    Optical structure 有权

    公开(公告)号：US12152771B1

    公开(公告)日：2024-11-26

    申请号：US18424209

    申请日：2024-01-26

    Applicant: Lextar Electronics Corporation

    Inventor： Wei-Chung Cheng ,  Yun-Yi Tien ,  Jung-Cheng Chang ,  Min-Chen Chiu

    IPC: F21V5/00 ,  F21V9/30 ,  F21Y115/10 ,  G02F1/13357

    Abstract: An optical structure is provided. The optical structure includes a substrate and a light-emitting element disposed on the substrate. The optical structure also includes a cap disposed on the substrate and covering the light-emitting element. The cap has a top portion and a sidewall connected to the top portion. The optical structure further includes a first micro-structure disposed on a first side of the top portion facing the light-emitting element. The first micro-structure is periodically arranged.

    LIGHT SOURCE MODULE
    10.
    发明申请
    LIGHT SOURCE MODULE 有权
    光源模块

    公开(公告)号：US20130322067A1

    公开(公告)日：2013-12-05

    申请号：US13709655

    申请日：2012-12-10

    Applicant: LEXTAR ELECTRONICS CORPORATION

    Inventor： Yun-Yi Tien ,  Pei-Song Cai ,  Jian-Chin Liang

    IPC: F21V9/16

    CPC classification number: F21V9/30 ,  F21V9/08 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/504 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A light source module includes a substrate, a first illumination element, a second illumination element and a third illumination element. The first illumination element includes a blue LED chip disposed on the substrate and a first wavelength converting layer that covers the blue LED chip, in which blue light emitted from the blue LED chip can be converted to light in the range of a first wavelength. The second illumination element includes a blue LED chip disposed on the substrate and a second wavelength converting layer that covers the blue LED chip, in which blue light emitted from the blue LED chip can be converted to light in the range of a second wavelength. The third illumination element includes a blue LED chip.

    Abstract translation: 光源模块包括基板，第一照明元件，第二照明元件和第三照明元件。 第一照明元件包括设置在基板上的蓝色LED芯片和覆盖蓝色LED芯片的第一波长转换层，其中从蓝色LED芯片发射的蓝色光可以在第一波长的范围内被转换为光。 第二照明元件包括设置在基板上的蓝色LED芯片和覆盖蓝色LED芯片的第二波长转换层，其中从蓝色LED芯片发出的蓝色光可以转换成第二波长范围内的光。 第三照明元件包括蓝色LED芯片。

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