公开(公告)号：US09245877B2

公开(公告)日：2016-01-26

申请号：US14305071

申请日：2014-06-16

Applicant: Lextar Electronics Corporation

Inventor： Bo-Yu Ko ,  Yee-Cheng Chang ,  Chun-Wei Wang

IPC: H01L33/62 ,  H01L25/16

CPC classification number: H01L25/167 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A LED device is provided. The LED comprises a frame, a housing, a LED chip and a protection component. The frame comprises a first lead frame and a second lead frame disposed along a first direction and isolated from each other. The housing partially covers the first and second lead frames, and has a receiving portion exposing parts of the surfaces of the first and second lead frames. The LED chip is disposed in the receiving portion on the exposed surface of the first lead frame, and electrically connected to the first and second lead frames. The protection component is disposed on a surface of the second lead frame that is covered by the housing and electrically connected to the first lead frame. None of the sides of a vertical projection of the protection component on the second lead frame is parallel or perpendicular to the first direction.

Abstract translation: 提供LED装置。 LED包括框架，壳体，LED芯片和保护部件。 框架包括沿着第一方向设置并彼此隔离的第一引线框架和第二引线框架。 壳体部分地覆盖第一和第二引线框架，并且具有暴露第一引线框架和第二引线框架的表面的部分的接收部分。 LED芯片设置在第一引线框架的暴露表面上的接收部分中，并且电连接到第一引线框架和第二引线框架。 保护部件设置在第二引线框架的被外壳覆盖并与第一引线框架电连接的表面上。 保护部件在第二引线框架上的垂直投影的一侧不平行或垂直于第一方向。

公开(公告)号：US09054286B1

公开(公告)日：2015-06-09

申请号：US14256991

申请日：2014-04-20

Applicant: Lextar Electronics Corporation

Inventor： Tsai-Yu Chen ,  Chun-Wei Wang

IPC: H01L33/00 ,  H01L33/58 ,  H01L27/15 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62 ,  H01L33/46 ,  H01L33/44 ,  H01L33/54 ,  H01L33/52 ,  H01L33/56

CPC classification number: H01L33/56 ,  H01L25/0753 ,  H01L33/44 ,  H01L33/46 ,  H01L33/50 ,  H01L33/52 ,  H01L33/54 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A light emitting diode module includes a lead frame, a first light emitting diode chip, a second light emitting diode chip, an encapsulant, and a lens structure. The lead frame has a die-bonding surface and a side wall together defining an accommodating recess. The encapsulant is filled in the accommodating recess, and covers the first and the second light emitting diode chips. The lens structure disposed on the lead frame has a bottom surface, a reflective surface, a first, a second, a third, and a fourth light emitting curved surface. The light emitting curved surfaces are respectively disposed opposite to the bottom surface. An adjacent position among the light emitting curved surfaces is a lowest point nearest to the bottom surface. The first and the second light emitting diode chips are disposed at the projections of the first and the second light emitting curved surface on the die-bonding surface.

Abstract translation: 发光二极管模块包括引线框架，第一发光二极管芯片，第二发光二极管芯片，密封剂和透镜结构。 引线框架具有芯片接合表面和侧壁，共同限定了容纳凹部。 密封剂填充在容纳凹部中，并且覆盖第一和第二发光二极管芯片。 设置在引线框架上的透镜结构具有底表面，反射表面，第一，第二，第三和第四发光弯曲表面。 发光曲面分别设置为与底面相对。 发光曲面中的相邻位置是最靠近底面的最低点。 第一和第二发光二极管芯片设置在芯片接合表面上的第一和第二发光弯曲表面的突起处。

公开(公告)号：US08735929B2

公开(公告)日：2014-05-27

申请号：US13861420

申请日：2013-04-12

Applicant: Lextar Electronics Corporation

Inventor： Pei-Song Cai ,  Yun-Yi Tien ,  Tzu-Pu Lin ,  Chun-Wei Wang ,  Jian-Chin Liang

IPC: H01L33/00

CPC classification number: H01L33/48 ,  H01L33/486 ,  H01L33/505 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A light-emitting diode (LED) package comprising a carrier, an LED chip and a phosphor glue is provided. The carrier has a recess, an upper surface, and a ring-shape rough surface connected to a top edge of the recess. The LED chip is disposed within the recess. The phosphor glue fills up the recess and over the upper surface of the carrier. An edge of the phosphor glue contacts the ring-shape rough surface.

Abstract translation: 提供了包括载体，LED芯片和磷光体胶的发光二极管（LED）封装。 载体具有连接到凹部的顶部边缘的凹部，上表面和环形粗糙表面。 LED芯片设置在凹槽内。 磷光体胶填充凹槽并在载体的上表面上方。 磷光胶的边缘接触环形粗糙表面。

公开(公告)号：US20130270594A1

公开(公告)日：2013-10-17

申请号：US13861420

申请日：2013-04-12

Applicant: LEXTAR ELECTRONICS CORPORATION

Inventor： Pei-Song Cai ,  Yun-Yi Tien ,  Tzu-Pu Lin ,  Chun-Wei Wang ,  Jian-Chin Liang

IPC: H01L33/48

CPC classification number: H01L33/48 ,  H01L33/486 ,  H01L33/505 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A light-emitting diode (LED) package comprising a carrier, an LED chip and a phosphor glue is provided. The carrier has a recess, an upper surface, and a ring-shape rough surface connected to a top edge of the recess. The LED chip is disposed within the recess. The phosphor glue fills up the recess and over the upper surface of the carrier. An edge of the phosphor glue contacts the ring-shape rough surface.

Abstract translation: 提供了包括载体，LED芯片和磷光体胶的发光二极管（LED）封装。 载体具有连接到凹部的顶部边缘的凹部，上表面和环形粗糙表面。 LED芯片设置在凹槽内。 磷光体胶填充凹槽并在载体的上表面上方。 磷光胶的边缘接触环形粗糙表面。

公开(公告)号：USD782425S1

公开(公告)日：2017-03-28

申请号：US29497491

申请日：2014-07-24

Applicant: LEXTAR ELECTRONICS CORPORATION

Designer： Bo-Yu Ko ,  Kuo-Wei Huang ,  Chun-Wei Wang

公开(公告)号：US20150207049A1

公开(公告)日：2015-07-23

申请号：US14305071

申请日：2014-06-16

Applicant: Lextar Electronics Corporation

Inventor： Bo-Yu Ko ,  Yee-Cheng Chang ,  Chun-Wei Wang

IPC: H01L33/62 ,  H01L33/52 ,  H01L33/50 ,  H01L27/15

CPC classification number: H01L25/167 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A LED device is provided. The LED comprises a frame, a housing, a LED chip and a protection component. The frame comprises a first lead frame and a second lead frame disposed along a first direction and isolated from each other. The housing partially covers the first and second lead frames, and has a receiving portion exposing parts of the surfaces of the first and second lead frames. The LED chip is disposed in the receiving portion on the exposed surface of the first lead frame, and electrically connected to the first and second lead frames. The protection component is disposed on a surface of the second lead frame that is covered by the housing and electrically connected to the first lead frame. None of the sides of a vertical projection of the protection component on the second lead frame is parallel or perpendicular to the first direction.

Abstract translation: 提供LED装置。 LED包括框架，壳体，LED芯片和保护部件。 框架包括沿着第一方向设置并彼此隔离的第一引线框架和第二引线框架。 壳体部分地覆盖第一和第二引线框架，并且具有暴露第一引线框架和第二引线框架的表面的部分的接收部分。 LED芯片设置在第一引线框架的暴露表面上的接收部分中，并且电连接到第一引线框架和第二引线框架。 保护部件设置在第二引线框架的被外壳覆盖并与第一引线框架电连接的表面上。 保护部件在第二引线框架上的垂直投影的一侧不平行或垂直于第一方向。

公开(公告)号：US20150162510A1

公开(公告)日：2015-06-11

申请号：US14256991

申请日：2014-04-20

Applicant: Lextar Electronics Corporation

Inventor： Tsai-Yu CHEN ,  Chun-Wei Wang

IPC: H01L33/58 ,  H01L33/62 ,  H01L33/60 ,  H01L27/15 ,  H01L33/50

CPC classification number: H01L33/56 ,  H01L25/0753 ,  H01L33/44 ,  H01L33/46 ,  H01L33/50 ,  H01L33/52 ,  H01L33/54 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A light emitting diode module includes a lead frame, a first light emitting diode chip, a second light emitting diode chip, an encapsulant, and a lens structure. The lead frame has a die-bonding surface and a side wall together defining an accommodating recess. The encapsulant is filled in the accommodating recess, and covers the first and the second light emitting diode chips. The lens structure disposed on the lead frame has a bottom surface, a reflective surface, a first, a second, a third, and a fourth light emitting curved surface. The light emitting curved surfaces are respectively disposed opposite to the bottom surface. An adjacent position among the light emitting curved surfaces is a lowest point nearest to the bottom surface. The first and the second light emitting diode chips are disposed at the projections of the first and the second light emitting curved surface on the die-bonding surface.

Abstract translation: 发光二极管模块包括引线框架，第一发光二极管芯片，第二发光二极管芯片，密封剂和透镜结构。 引线框架具有芯片接合表面和侧壁，共同限定了容纳凹部。 密封剂填充在容纳凹部中，并且覆盖第一和第二发光二极管芯片。 设置在引线框架上的透镜结构具有底表面，反射表面，第一，第二，第三和第四发光弯曲表面。 发光曲面分别设置为与底面相对。 发光曲面中的相邻位置是最靠近底面的最低点。 第一和第二发光二极管芯片设置在芯片接合表面上的第一和第二发光弯曲表面的突起处。

公开(公告)号：US20130277706A1

公开(公告)日：2013-10-24

申请号：US13854163

申请日：2013-04-01

Applicant: LEXTAR ELECTRONICS CORPORATION

Inventor： Shing-Kuo Chen ,  Bo-Yu Ko ,  Chun-Wei Wang

IPC: H01L33/64 ,  H01L33/62

CPC classification number: H01L33/64 ,  H01L33/486 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A package structure of a light emitting device is disclosed. The package structure includes a light emitting device, a leadframe and a cup structure. The leadframe is used for supporting the light emitting device. The leadframe has a top surface, a bottom surface and a side surface located between the top surface and the bottom surface. The side surface has a dimension in the thickness direction of the leadframe. The cup structure made of thermosetting resin is disposed on the leadframe. A sidewall of the cup structure covers the side surface of the leadframe, and has a connecting profile length in the thickness direction with respect to the side surface. The connecting profile length is larger than the dimension of the side surface in the thickness direction.

Abstract translation: 公开了一种发光器件的封装结构。 封装结构包括发光器件，引线框和杯结构。 引线框用于支撑发光器件。 引线框架具有顶表面，底表面和位于顶表面和底表面之间的侧表面。 侧面在引线框的厚度方向上具有尺寸。 由热固性树脂制成的杯结构设置在引线框架上。 杯结构的侧壁覆盖引线框架的侧表面，并且在相对于侧表面的厚度方向上具有连接轮廓长度。 连接轮廓长度大于侧面在厚度方向上的尺寸。