摘要:
The design and structure of a fluidic concentration metering device with a full dynamic range utilizing micro-machined thermal time-of-flight sensing elements is exhibited in this disclosure. With an additional identical sensing chip but packaged at the different locations in the measurement fluidic chamber with a closed conduit, the device can simultaneously measure the fluidic concentration and the fluidic flowrate. With a temperature thermistor integrated on the same micro-machined thermal sensing chip, the disclosed device will be able to provide the key processing parameters for the fluidic applications.
摘要:
The design and structure of a fluidic concentration metering device with a full dynamic range utilizing micro-machined thermal time-of-flight sensing elements is exhibited in this disclosure. With an additional identical sensing chip but packaged at the different locations in the measurement fluidic chamber with a closed conduit, the device can simultaneously measure the fluidic concentration and the fluidic flowrate. With a temperature thermistor integrated on the same micro-machined thermal sensing chip, the disclosed device will be able to provide the key processing parameters for the fluidic applications.
摘要:
An apparatus comprising a micromachined (a.k.a. MEMS, Micro Electro Mechanical Systems) silicon flow sensor, a flow channel package, and a driving circuitry, which operates in a working principle of thermal time-of-flight (TOF) to measure gas or liquid flow speed, is disclosed in the present invention. The micromachining technique for fabricating this MEMS time-of-flight silicon thermal flow sensor can greatly reduce the sensor fabrication cost by batch production. This microfabrication process for silicon time-of-flight thermal flow sensors provides merits of small feature size, low power consumption, and high accuracy compared to conventional manufacturing methods. Thermal time-of-flight technology in principle can provide accurate flow speed measurements for gases regardless of its gas compositions. In addition, the present invention further discloses the package design and driving circuitry which is utilized by the correlated working principle.
摘要:
A mass flow sensor is supported on an N or P-type silicon substrate with orientation . This mass flow sensor comprises a central thin-film heater and a pair of thin-film heat sensing elements, and a thermally isolated membrane for supporting the heater and the sensors out of contact with the substrate base. The mass flow sensor is arranged for integration on a same silicon substrate to form a one-dimensional or two-dimensional array in order to expand the dynamic measurement range.
摘要:
An integrated mass flow sensor is manufactured by a process of carrying out a micro-machining process on an N or P-type silicon substrate with orientation . This mass flow sensor comprises a central thin-film heater and a pair of thin-film heat sensing elements, and a thermally isolated membrane for supporting the heater and the sensors out of contact with the substrate base. The mass flow sensor is arranged for integration on a same silicon substrate to form a one-dimensional or two-dimensional array in order to expand the dynamic measurement range. For each sensor, the thermally isolated membrane is formed by a process that includes a step of first depositing dielectric thin-film layers over the substrate and then performing a backside etching process on a bulk silicon with TMAH or KOH or carrying out a dry plasma etch until the bottom dielectric thin-film layer is exposed. Before backside etching the bulk silicon, rectangular openings are formed on the dielectric thin-film layers by applying a plasma etching to separate the area of heater and sensing elements from the rest of the membrane. This mass flow sensor is operated with two sets of circuits, a first circuit for measuring a flow rate in a first range of flow rates and a second circuit for measuring a flow rate in a second range of flow rates, to significantly increase range of flow rate measurements, while maintains a high degree of measurement accuracy.
摘要:
A micromachined thermal mass flow sensor comprises a high mechanical strength polyimide film as a supporting layer of suspending membrane. The polyimide film provides superior thermal insulating properties to reduce the power consumption of device. Due to the tendency of humidity absorption, the polyimide suspending membrane is double side passivated on both top and bottom surfaces to sustain its long term stability from rush and humid working environment. A thin layer of silicon dioxide deposited by plasma enhanced chemical vapor deposition is overlaid between the silicon nitride and polyimide film to enhance the adhesion property of passivation layers to polyimide surface. With such embodiments, a sturdy and robust micromachined thermal mass flow sensor with high measurement accuracy could be formed.
摘要:
The present invention is generally related to a novel micromachining thermal mass flow sensor and, more particularly, to a device incorporated with high strength and robust characteristics, which therefore is capable of operating under harsh environments. The new disclosed sensor is made of essential material which can provide robust physical structure and superior thermal properties to support the flow measuring operation. The invented thermal mass flow sensor is featuring with the advantages of micro-fabricated devices in terms of compact size, low power consumption, high accuracy and repeatability, wide dynamic range and easiness for mass production, which could avoid the drawbacks of fragility and vulnerability.
摘要:
A device with micromachined (a.k.a. MEMS, Micro Electro Mechanical Systems) silicon sensor to measure gas or liquid concentration in a binary mixture formality is disclosed in the present invention. A process for fabricating the said MEMS silicon concentration sensor, which thereby can greatly reduce the sensor fabrication cost by a batch production, is revealed as well. This MEMS process can mass-produce the sensors on silicon substrate in the ways of small size, low power, and high reliability. In addition to the gas or liquid concentration measurement, the present invention further discloses that the said sensor can also readily measure gas or liquid mass flow rate while record the concentration data, which is not viable by other related working principle.
摘要:
An integrated mass flow sensor is manufactured by a process of carrying out a micro-machining process on an N or P-type silicon substrate with orientation . This mass flow sensor comprises a central thin-film heater and a pair of thin-film heat sensing elements, and a thermally isolated membrane for supporting the heater and the sensors out of contact with the substrate base. The mass flow sensor is arranged for integration on a same silicon substrate to form a one-dimensional or two-dimensional array in order to expand the dynamic measurement range. For each sensor, the thermally isolated membrane is formed by a process that includes a step of first depositing dielectric thin-film layers over the substrate and then performing a backside etching process on a bulk silicon with TMAH or KOH or carrying out a dry plasma etch until the bottom dielectric thin-film layer is exposed. Before backside etching the bulk silicon, rectangular openings are formed on the dielectric thin-film layers by applying a plasma etching to separate the area of heater and sensing elements from the rest of the membrane. This mass flow sensor is operated with two sets of circuits, a first circuit for measuring a flow rate in a first range of flow rates and a second circuit for measuring a flow rate in a second range of flow rates, to significantly increase range of flow rate measurements, while maintains a high degree of measurement accuracy.
摘要:
An apparatus comprising a micromachined (a.k.a. MEMS, Micro Electro Mechanical Systems) silicon flow sensor, a flow channel package, and a driving circuitry, which operates in a working principle of thermal time-of-flight (TOF) to measure gas or liquid flow speed, is disclosed in the present invention. The micromachining technique for fabricating this MEMS time-of-flight silicon thermal flow sensor can greatly reduce the sensor fabrication cost by batch production. This microfabrication process for silicon time-of-flight thermal flow sensors provides merits of small feature size, low power consumption, and high accuracy compared to conventional manufacturing methods. Thermal time-of-flight technology in principle can provide accurate flow speed measurements for gases regardless of its gas compositions. In addition, the present invention further discloses the package design and driving circuitry which is utilized by the correlated working principle.