Abstract:
A thermal sensor comprises an active element (41), e.g., a heater or cooler, at least one temperature sensor (31), and processing circuitry (50). The processing circuitry causes a change of power supplied to the active element (41). It then determines, at a plurality of times, a thermal parameter based on an output signal of the temperature sensors and analyzes the transient behavior of the thermal parameter. Based on this analysis, the processing circuitry determines a contamination signal that is indicative of a contamination on a sensing surface of the thermal sensor. If the thermal sensor comprises a plurality of temperature sensors arranged in different sectors of the sensing surface, a multi-sector thermal signal can be derived from the outputs of the sensors, and determination of the contamination signal can be based on the multi-sector thermal signal.
Abstract:
A thermal conductivity detector which includes a measurement channel, an electrically heatable heating filament extending longitudinally along the center of the measurement channel so that a fluid passing through the measurement channel flows around the filament, an evaluator that detects electrical resistance changes of the heating filament and provide an output representative of the presence and amount of various fluid components passing the heating filament, and a bypass channel for bypassing the measurement channel, where the bypass channel has a lower fluidic resistance than the measurement channel and where, in order to improve the detection capability, the thermal conductivity detector further includes a flow sensor for measuring the flow of the fluid in the bypass channel and for providing an output indicative of the measured flow, and a correcting device for correcting the output of the evaluator using the output of the flow sensor.
Abstract:
Methods and systems for determining the presence and/or rate of a flow of a fluid sample include transmitting light through the fluid sample are disclosed. The methods comprise, applying a series of thermal pulses to the fluid sample, the series comprises a time interval between each thermal pulse, detecting transmitted light using a light detector; and determining at least one of (a) whether or not the fluid is flowing and (b) a flow rate of the fluid, based on an intensity of the transmitted light corresponding to at least one time interval.
Abstract:
This invention relates to hot film shear stress sensors and their fabrication. We describe a hot film shear stress sensor comprising a silicon substrate supporting a membrane having a cavity underneath, said membrane bearing a film of metal and having electrical contacts for heating said film, and wherein said membrane comprises a silicon oxide membrane, where in said metal comprises aluminium or tungsten, and wherein said membrane has a protective layer of a silicon-based material over said film of metal. In preferred embodiments the sensor is fabricated by a CMOS process and the metal comprises aluminium or tungsten.
Abstract:
The present disclosure relates to a method and an apparatus for measuring a flow rate through a vessel, such as a conduit or pipeline. The method comprises providing a reference parameter, measuring a first parameter at a first position at the vessel and determining a difference between the first parameter and the reference parameter. The flow rate through the vessel is determined based on the difference between the first parameter and the reference parameter.
Abstract:
An apparatus comprising a micromachined (a.k.a. MEMS, Micro Electro Mechanical Systems) silicon flow sensor, a flow channel package, and a driving circuitry, which operates in a working principle of thermal time-of-flight (TOF) to measure gas or liquid flow speed, is disclosed in the present invention. The micromachining technique for fabricating this MEMS time-of-flight silicon thermal flow sensor can greatly reduce the sensor fabrication cost by batch production. This microfabrication process for silicon time-of-flight thermal flow sensors provides merits of small feature size, low power consumption, and high accuracy compared to conventional manufacturing methods. Thermal time-of-flight technology in principle can provide accurate flow speed measurements for gases regardless of its gas compositions. In addition, the present invention further discloses the package design and driving circuitry which is utilized by the correlated working principle.
Abstract:
Example methods and apparatus to measure fluid flow rates are disclosed. A disclosed example apparatus includes a circulator to selectively circulate a fluid in a flowline, a generator thermally coupled to the flowline at a first location and controllable to form a heat wave in the fluid, a sensor thermally coupled to the flowline at a second location to measure a first value representative of the heat wave, a phase detector to determine a second value representative of a wavelength of the heat wave based on the first value, a frequency adjuster to control the generator to form the heat wave in the fluid at a first frequency, the first frequency selected so that the second value is substantially equal to a distance between the first and second locations, and a flow rate determiner to determine a flow rate of the fluid based on the first frequency.
Abstract:
Fluid flows through a conduit. To measure flow speed the fluid is heated at a heating location in the conduit with a time-dependent heating strength. A speed of sound in fluid flowing in the conduit is measured at a plurality of sensing locations downstream from said heating location. The flow speed of the fluid is determined from a delay with which the time dependence is detected in the sound speeds measured at said sensing locations. In an embodiment a frequency of the variation of heating strength that is used to determine the flow speed is selected automatically dependent on the flow speed and/or other circumstances.
Abstract:
An apparatus for measuring a fluid microflow velocity within a capillary conduit, comprises: a) at least one thermoelectric cooler having a heating and a cooling surface, said heating surface being suitable for heating a fluid flowing over it and said cooling surface being suitable for cooling said fluid; and b) a capillary conduit through which said fluid flows, said capillary conduit passing through said at least one thermoelectric cooler in heat-exchanging positioned relationship with its heating and cooling surfaces.
Abstract:
Example methods and apparatus to measure fluid flow rates are disclosed. A disclosed example apparatus includes a circulator to selectively circulate a fluid in a flowline, a generator thermally coupled to the flowline at a first location and controllable to form a heat wave in the fluid, a sensor thermally coupled to the flowline at a second location to measure a first value representative of the heat wave, a phase detector to determine a second value representative of a wavelength of the heat wave based on the first value, a frequency adjuster to control the generator to form the heat wave in the fluid at a first frequency, the first frequency selected so that the second value is substantially equal to a distance between the first and second locations, and a flow rate determiner to determine a flow rate of the fluid based on the first frequency.