公开(公告)号：US20170300077A1

公开(公告)日：2017-10-19

申请号：US15641233

申请日：2017-07-04

Applicant: MEDIATEK INC.

Inventor： Chia-Tao Hsu ,  Chee-Kong Ung ,  Li-Chun Yang ,  Yu-Sung Chen ,  Ming-Tse Dai

IPC: G05F3/04 ,  G01R19/00

CPC classification number: G05F3/04 ,  G01R19/0084

Abstract: A power management circuit includes a voltage sensing circuit and a supply voltage adjusting circuit. The voltage sensing circuit is arranged for sensing a plurality of voltages respectively of a plurality of nodes of a PCB to generate a sensing result. The supply voltage adjusting circuit is coupled to the voltage sensing circuit, and is arranged for determining a voltage level of a supply voltage supplied to a power plane of the PCB by referring to the sensing result.

公开(公告)号：US20140022719A1

公开(公告)日：2014-01-23

申请号：US13661014

申请日：2012-10-25

Applicant: MEDIATEK INC.

Inventor： Mao-Lin Wu ,  Ho-Chung Chen ,  Chia-Yu Hsieh ,  Li-Chun Yang

IPC: G06F1/16 ,  B05D5/12

CPC classification number: H01R13/6581 ,  H01R13/646

Abstract: An interface module coupled between a host device and a wireless device is disclosed. The interface module includes a connector, having a first part covered in a first case with a first depth and a second part covered in a second case with a second depth; and a control circuit coupled to the first part of the connector, for controlling data transmission between the host device and the wireless device; wherein the second case is made of a conductive material and which can be further covered by an absorptive material.

Abstract translation: 公开了一种耦合在主机设备和无线设备之间的接口模块。 接口模块包括连接器，其具有覆盖在具有第一深度的第一壳体中的第一部分和在具有第二深度的第二壳体中覆盖的第二部分; 以及耦合到所述连接器的所述第一部分的控制电路，用于控制所述主机设备和所述无线设备之间的数据传输; 其中所述第二壳体由导电材料制成并且可以被吸收材料进一步覆盖。

公开(公告)号：US09733661B2

公开(公告)日：2017-08-15

申请号：US14499267

申请日：2014-09-29

Applicant: MEDIATEK INC.

Inventor： Chia-Tao Hsu ,  Chee-Kong Ung ,  Li-Chun Yang ,  Yu-Sung Chen ,  Ming-Tse Dai

IPC: G05F3/04 ,  G01R19/00

CPC classification number: G05F3/04 ,  G01R19/0084

Abstract: A power management circuit includes a voltage sensing circuit and a supply voltage adjusting circuit. The voltage sensing circuit is arranged for sensing a plurality of voltages respectively of a plurality of nodes of a PCB to generate a sensing result. The supply voltage adjusting circuit is coupled to the voltage sensing circuit, and is arranged for determining a voltage level of a supply voltage supplied to a power plane of the PCB by referring to the sensing result.

公开(公告)号：US20160091915A1

公开(公告)日：2016-03-31

申请号：US14499267

申请日：2014-09-29

Applicant: MEDIATEK INC.

Inventor： Chia-Tao Hsu ,  Chee-Kong Ung ,  Li-Chun Yang ,  Yu-Sung Chen ,  Ming-Tse Dai

IPC: G05F3/04 ,  H05K7/02 ,  G01R19/00

CPC classification number: G05F3/04 ,  G01R19/0084

Abstract: A power management circuit includes a voltage sensing circuit and a supply voltage adjusting circuit. The voltage sensing circuit is arranged for sensing a plurality of voltages respectively of a plurality of nodes of a PCB to generate a sensing result. The supply voltage adjusting circuit is coupled to the voltage sensing circuit, and is arranged for determining a voltage level of a supply voltage supplied to a power plane of the PCB by referring to the sensing result.

Abstract translation: 电源管理电路包括电压检测电路和电源电压调节电路。 电压感测电路被布置成用于感测PCB的多个节点的多个电压以产生感测结果。 电源电压调节电路耦合到电压感测电路，并且被配置为通过参考感测结果来确定提供给PCB的电源平面的电源电压的电压电平。

公开(公告)号：US10003160B2

公开(公告)日：2018-06-19

申请号：US15403192

申请日：2017-01-11

Applicant: MEDIATEK INC.

Inventor： Mao-Lin Wu ,  Ho-Chung Chen ,  Chia-Yu Hsieh ,  Li-Chun Yang

IPC: G06F1/16 ,  H01R13/6581 ,  H01R13/646

CPC classification number: H01R13/6581 ,  H01R13/646

Abstract: An interface module coupled between a host device and a wireless device is disclosed. The interface module includes a connector, having a first part covered in a first case with a first depth and a second part covered in a second case with a second depth; and a control circuit coupled to the first part of the connector, for controlling data transmission between the host device and the wireless device; wherein the second case is made of a conductive material and which can be further covered by an absorptive material.

公开(公告)号：US20170133796A1

公开(公告)日：2017-05-11

申请号：US15403192

申请日：2017-01-11

Applicant: MEDIATEK INC.

Inventor： Mao-Lin Wu ,  Ho-Chung Chen ,  Chia-Yu Hsieh ,  Li-Chun Yang

IPC: H01R13/6581 ,  H01R13/646

CPC classification number: H01R13/6581 ,  H01R13/646

Abstract: An interface module coupled between a host device and a wireless device is disclosed. The interface module includes a connector, having a first part covered in a first case with a first depth and a second part covered in a second case with a second depth; and a control circuit coupled to the first part of the connector, for controlling data transmission between the host device and the wireless device; wherein the second case is made of a conductive material and which can be further covered by an absorptive material.