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公开(公告)号：US20250012971A1
公开(公告)日：2025-01-09
申请号：US18887611
申请日：2024-09-17
Applicant: MELLANOX TECHNOLOGIES, LTD.
Inventor： Elad MENTOVICH , Dimitrios KALAVROUZIOTIS , Jonathan LUFF , Wei QIAN , Dazeng FENG
Abstract: An optical interconnect device and the method of fabricating it are described. The device includes an in-plane laser cavity transmitting a light beam along a first direction, a Franz Keldysh (FK) optical modulator transmitting the light beam along the first direction, a mode-transfer module including a tapered structure disposed after the FK optical modulator along the first direction to enlarge the spot size of the light beam to match an external optical fiber and a universal coupler controlling the light direction. The tapered structure can be made linear or non-linear along the first direction. The universal coupler passes the laser light to an in-plane external optical fiber if the fiber is placed along the first direction, or it is a vertical coupler in the case that the external optical fiber is placed perpendicularly to the substrate surface. The coupler is coated with highly reflective material.
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公开(公告)号：US20230246419A1
公开(公告)日：2023-08-03
申请号：US17672936
申请日：2022-02-16
Applicant: Mellanox Technologies, Ltd.
Inventor： Anders LARSSON , Dimitrios KALAVROUZIOTIS , Attila FULOP , Filip Leonard Hjort , Elad MENTOVICH
CPC classification number: H01S5/183 , H01S5/022 , H04B10/40 , H04B10/503
Abstract: Apparatuses, systems, and associated methods are described that provide an optical device with sealed optoelectronic component(s) without impacting effective optical performance of the optical device. An example optical device includes a substrate that defines a first surface and a second surface opposite the first surface. The optical device further includes an optoelectronic component supported by the first surface of the substrate where the optoelectronic component operates with optical signals. The optical device further includes a conformal coating applied to the first surface of the substrate such that at least a portion of the conformal coating is disposed on the optoelectronic component. The conformal coating substantially seals the optoelectronic component from an external environment of the optical device without impacting effective optical performance of the optical device. A thickness of the conformal coating may be determined based upon one or more operating parameters of the optoelectronic component.
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公开(公告)号：US20220283973A1
公开(公告)日：2022-09-08
申请号：US17636484
申请日：2019-08-21
Applicant: Mellanox Technologies, Ltd.
Inventor： Dotan LEVI , Elad MENTOVICH , Ran RAVID , Roee SHAPIRO , Avraham GANOR , Paraskevas BAKOPOULOS , Dimitrios KALAVROUZIOTIS
Abstract: Apparatuses, systems, and associated methods of manufacturing are described that provide a dynamic data interconnect and networking cable configuration. The dynamic data interconnect includes a substrate, transmitters supported on the substrate configured to generate signals, and receivers supported on the substrate configured to receive signals. The dynamic data interconnect further includes a number of connection pads that receive data cables attached thereto and a number of transmission lanes that operably couple the transmitters and receivers to the connection pads. The dynamic data interconnect further includes transmission circuitry in communication with each of the transmitters and receivers such that, in an operational configuration, the transmission circuitry determines a transmission state of the dynamic data interconnect and selectively disables operation of at least a portion of the transmitters or at least a portion of the receivers.
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公开(公告)号：US20220163740A1
公开(公告)日：2022-05-26
申请号：US17341645
申请日：2021-06-08
Applicant: Mellanox Technologies, Ltd.
Inventor： Dimitrios KALAVROUZIOTIS , Sylvie ROCKMAN , Elad MENTOVICH , Tamir SHARKAZ , Yaakov GRIDISH , Anna SANDOMIRSKY
IPC: G02B6/42
Abstract: Optical components and associated methods of manufacturing are provided. An example optical component includes a body defined by an optical interposer substrate and a passivation layer applied to the optical interposer substrate. The optical interposer substrate defines a first surface of the body, and the passivation layer defines a second surface of the body opposite the first surface. The passivation layer includes a metallic shielding element configured to prevent interference between the first surface and the second surface. The optical component further includes an opening extending from the second surface to the optical interposer substrate, the opening defining an optical path through the passivation layer. The optical interposer substrate receives an optical signal from an optical transmitter supported by the second surface via the optical path.
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公开(公告)号：US20250055562A1
公开(公告)日：2025-02-13
申请号：US18933039
申请日：2024-10-31
Applicant: MELLANOX TECHNOLOGIES, LTD.
Inventor： Paraskevas BAKOPOULOS , Ioannis (Giannis) PATRONAS , Nikolaos ARGYRIS , Dimitrios SYRIVELIS , Elad MENTOVICH , Dimitrios KALAVROUZIOTIS , Avraham GANOR , Nimer HAZIN
IPC: H04B10/038 , H04B10/112 , H04B10/40
Abstract: A datacenter environment having a plurality of servers, leaf switches, and spine switches is presented. A transceiver module facilitates reliable data transmission across network layers. The transceiver module includes a first optical module to facilitate data transmission between a server and a leaf switch, and a second optical module to facilitate data transmission between the leaf switch and a spine switch. An adapter operatively coupled to both optical modules manages data flow under different configurations. In a first configuration, the adapter receives first data from the server via the first optical module and second data from the leaf switch via the second optical module. Upon detecting an operational failure in the first optical module, the adapter terminates reception of second data from the leaf switch and switches to a second configuration, in which it redirects the first data from the server through the second optical module.
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Patent Agency Ranking
公开(公告)号：US20250004200A1
公开(公告)日：2025-01-02
申请号：US18883522
申请日：2024-09-12
Applicant: MELLANOX TECHNOLOGIES, LTD.
Inventor： Elad MENTOVICH , Dimitrios KALAVROUZIOTIS , Jonathan LUFF , Wei QIAN , Dazeng FENG
Abstract: An optical interconnect device and the method of fabricating it are described. The device includes an in-plane laser cavity transmitting a light beam along a first direction, a Franz Keldysh (FK) optical modulator transmitting the light beam along the first direction, a mode-transfer module including a tapered structure disposed after the FK optical modulator along the first direction to enlarge the spot size of the light beam to match an external optical fiber and a universal coupler controlling the light direction. The tapered structure can be made linear or non-linear along the first direction. The universal coupler passes the laser light to an in-plane external optical fiber if the fiber is placed along the first direction, or it is a vertical coupler in the case that the external optical fiber is placed perpendicularly to the substrate surface. The coupler is coated with highly reflective material.
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公开(公告)号：US20220365293A1
公开(公告)日：2022-11-17
申请号：US17755388
申请日：2019-11-06
Applicant: MELLANOX TECHNOLOGIES LTD.
Inventor： Dimitrios KALAVROUZIOTIS , Tamir SHARKAZ , Yuri BERK , Elad MENTOVICH
Abstract: Various embodiments provide a method for fabricating a couplable electro-optical device. In an example embodiment, the method includes fabricating at least one raw electro-optical device on a substrate; applying lens material to a working stamp; aligning the substrate and the working stamp; pressing the substrate onto the lens material until the distance between the substrate and the working stamp is a predetermined distance; and curing the lens material to form an integrated lens secured to the at least one electro-optical device on the substrate. An anti-reflective coating layer may be optionally applied on top of the molded lens. The couplable electro-optical device may be incorporated into a receiver, transmitter, and/or transceiver using passive alignment to align the couplable electro-optical device to an optical fiber.
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公开(公告)号：US20230412265A1
公开(公告)日：2023-12-21
申请号：US17869997
申请日：2022-07-21
Applicant: Mellanox Technologies, Ltd.
Inventor： Paraskevas BAKOPOULOS , Ioannis (Giannis) PATRONAS , Nikolaos ARGYRIS , Dimitrios SYRIVELIS , Elad MENTOVICH , Dimitrios KALAVROUZIOTIS , Avraham GANOR , Nimer HAZIN
IPC: H04B10/038 , H04B10/112 , H04B10/40
CPC classification number: H04B10/038 , H04B10/40 , H04B10/1127
Abstract: A transceiver module for providing operational resilience is presented. The transceiver module is configured to receive first data via a first optical module in a first configuration of operation and detect, using an adapter that is operationally connected to the first optical module, an operational failure of the first optical module. In response to detecting the operational failure, the transceiver module is configured to switch, via the adapter, from the first configuration of operation to a second configuration of operation by: automatically engaging a second optical module; triggering the first data that was initially directed into a first input port of the first optical module to be directed into a second input port of the second optical module; and receiving the first data from a second output port of the second optical module.
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公开(公告)号：US20220276455A1
公开(公告)日：2022-09-01
申请号：US17631655
申请日：2019-08-21
Applicant: Mellanox Technologies, Ltd.
Inventor： Alon RUBINSTEIN , Elad MENTOVICH , Dimitrios KALAVROUZIOTIS , Paraskevas BAKOPOULOS
Abstract: Apparatuses, systems, and associated methods of manufacturing are described that provide an optical interposer and associated communication system. An example optical interposer includes a substrate having a first end that receives a first optical fiber welded thereto and a second end that receives a plurality of photonic integrated circuits (PICs) attached thereto. The interposer further includes an optical waveguide network defined by the substrate that provides optical communication between the first welded optical fiber and the plurality of PICs. The optical waveguide network also includes optical redistribution elements supported by the substrate. In an operational configuration, the optical interposer receives a first input optical signal from the first welded optical fiber, and the plurality of optical redistribution elements successively split the first input optical signal such that a plurality of output optical signals is directed to the plurality of PICs.
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公开(公告)号：US20220099891A1
公开(公告)日：2022-03-31
申请号：US17421004
申请日：2020-01-02
Applicant: Mellanox Technologies, Ltd.
Inventor： Jonathan LUFF , Wei QIAN , Dimitrios KALAVROUZIOTIS , Elad MENTOVICH , Dazeng FENG
Abstract: An optical interconnect device and the method of fabricating it are described. The device includes an in-plane laser cavity transmitting a light beam along a first direction, a Franz Keldysh (FK) optical modulator transmitting the light beam along the first direction, a mode-transfer module including a tapered structure disposed after the FK optical modulator along the first direction to enlarge the spot size of the light beam to match an external optical fiber and a universal coupler controlling the light direction. The tapered structure can be made linear or non-linear along the first direction. The universal coupler passes the laser light to an in-plane external optical fiber if the fiber is placed along the first direction, or it is a vertical coupler in the case that the external optical fiber is placed perpendicularly to the substrate surface. The coupler is coated with highly reflective material.
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