-
公开(公告)号：US20150109889A1
公开(公告)日：2015-04-23
申请号：US14056221
申请日：2013-10-17
IPC分类号： G10K11/18
CPC分类号： H04R19/005 , H04R7/06 , H04R19/04
摘要： An acoustic transducer includes a base plate, a vibrating membrane and a back plate. The vibrating membrane covers an opening of the base plate and has a plurality of conjoint vibratile portions. The acoustic transducer further has a connecting portion that is connected to a boundary between each two of the adjacent vibratile portions so as to allow the vibratile portions to generate vibration independently. The vibratile portions are geometrically different. Thereby, the vibratile portions can vibrate independently. This allows a designer to easily enhance the dynamic range of the acoustic transducer by geometrically modifying the vibrating membrane without increasing the total area of the vibrating membrane while maintaining a certain good degree of sensitivity and signal-to-noise ratio.
摘要翻译： 声换能器包括基板，振动膜和背板。 振动膜覆盖基板的开口，并具有多个联合的振动部分。 声换能器还具有连接部分，其连接到相邻的每个振动部分之间的边界，以便使振动部分独立地产生振动。 振动部分在几何上是不同的。 由此，振动部分可以独立地振动。 这允许设计者通过几何修改振动膜来容易地增强声换能器的动态范围，而不增加振动膜的总面积，同时保持一定的良好的灵敏度和信噪比。
-
公开(公告)号：US20150304751A1
公开(公告)日：2015-10-22
申请号：US14255420
申请日：2014-04-17
IPC分类号： H04R1/04
CPC分类号： H04R1/04 , H04R19/005 , H04R19/04
摘要： A chip-stacked microphone includes a cover, an acoustic wave transducer module, an application-specific integrated circuit chip (ASIC) and a substrate arranged in proper order from top to bottom. The cover is connected to the substrate and covered over the acoustic wave transducer module, providing a sound hole. The application-specific integrated circuit chip (ASIC) is electrically connected to the substrate. The acoustic wave transducer module is electrically connected to the application-specific integrated circuit chip (ASIC) using a 3D packaging technology, allowing an acoustic wave to pass therebetween. Thus, the invention greatly reduces the area for footprint and fully utilizes the space between the cover and the two modules for back chamber to maintain the overall performance of the microphone.
摘要翻译： 芯片堆叠麦克风包括盖，声波换能器模块，专用集成电路芯片（ASIC）和从顶部到底部以适当顺序布置的基板。 盖子连接到基板上并覆盖在声波传感器模块上，提供一个声孔。 专用集成电路芯片（ASIC）电连接到基板。 声波换能器模块使用3D封装技术电连接到专用集成电路芯片（ASIC），允许声波在其间通过。 因此，本发明大大减少了占地面积，并充分利用了盖和两个后室模块之间的空间，以保持麦克风的整体性能。
-
3.发明申请公开(公告)号：US20180146302A1
公开(公告)日：2018-05-24
申请号：US15857709
申请日：2017-12-29
CPC分类号： H04R19/04 , B81B3/0021 , B81B7/0032 , B81B2201/0257 , B81B2207/095 , B81B2207/096 , B81C1/0023 , B81C1/00309 , B81C2203/0109 , H04R1/04 , H04R1/086 , H04R19/005 , H04R31/00
摘要： A MEMS microphone package structure is provided to have a circuit substrate, an acoustic wave transducer, an application-specific integrated circuit, a lid, and at least two solder pads. The circuit substrate has a top surface, a bottom surface, and a sound hole passing through the top surface and the bottom surface. The acoustic wave transducer and the application-specific integrated circuit are disposed on the top surface and electrically connected. The lid is disposed on the top surface and made by a multilayer printed circuit boards. The lid surrounds and covers the acoustic wave transducer and the application-specific integrated circuit. The lid further has a shielding layer completely disposed on inner surfaces of the lid and two embedded first metal layers served for signal transmission and grounding and electrically connected with the solder pads respectively.
-
公开(公告)号：US20150373446A1
公开(公告)日：2015-12-24
申请号：US14310723
申请日：2014-06-20
IPC分类号： H04R1/08
CPC分类号： H04R1/28 , B81B7/0032 , H01L2224/48137 , H01L2224/48221 , H04R1/04 , H04R19/005 , H04R19/04 , H04R2201/003
摘要： A multi-floor type MEMS microphone includes a housing formed by a stack of circuit boards and provided with a first cavity, a second cavity in vertical communication with the first cavity, and a sound hole in communication with the second cavity. The second cavity has a vertical cross-sectional area smaller than that of the first cavity. A MEMS transducer is disposed in the second cavity and electrically conducted with the housing, and an ASIC chip is disposed in the first cavity and electrically conducted with the housing. By this design, the volume of the back chamber of a vibrating diaphragm of the MEMS transducer can be increased in a limited space of the housing, and thus the sensitivity of the microphone can be improved.
摘要翻译： 多层型MEMS麦克风包括由电路板堆叠形成的壳体，其具有第一腔体，与第一空腔垂直连通的第二空腔和与第二空腔连通的声孔。 第二腔的垂直截面积小于第一腔。 MEMS换能器设置在第二腔中并与外壳电连接，并且ASIC芯片设置在第一空腔中并与外壳电连接。 通过这种设计，可以在壳体的有限空间中增加MEMS换能器的振动膜的后室的体积，从而可以提高麦克风的灵敏度。
-
公开(公告)号：US20150110302A1
公开(公告)日：2015-04-23
申请号：US14056232
申请日：2013-10-17
IPC分类号： H04R1/00
CPC分类号： H04R19/005 , B81B2201/0257 , B81B2203/0127 , B81C1/00182 , H04R19/04 , H04R31/003 , H04R31/006 , H04R2201/003 , H04R2499/11
摘要： An acoustic transducer with high sensitivity includes a base plate, a back plate and a vibrating membrane. The vibrating membrane is peripherally fixed to the base plate and covers an opening of the base plate. The back plate has a positioning member connected between the back plate and the vibrating membrane, so as to define at least one vibratile portion that is arranged annularly by a plurality of elastic members. Thereby, the vibratile portion has a reduced deformable width and increased rigidity, so can effectively improve its acoustically receiving sensitivity and signal-to-noise ratio.
摘要翻译： 具有高灵敏度的声学传感器包括基板，背板和振动膜。 振动膜周边固定在基板上并覆盖基板的开口。 背板具有连接在背板和振动膜之间的定位构件，以便限定由多个弹性构件环状布置的至少一个振动部。 因此，振动部具有减小的可变形宽度和增加的刚度，因此可以有效地提高其声学接收灵敏度和信噪比。
-
公开(公告)号：US20150016656A1
公开(公告)日：2015-01-15
申请号：US13939454
申请日：2013-07-11
IPC分类号： H04R7/16
CPC分类号： H04R7/16 , H04R7/06 , H04R7/20 , H04R19/005
摘要： A dual-diaphragm acoustic transducer includes a substrate defining an opening, an inner diaphragm and an outer diaphragm concentrically mounted at one same side of the substrate corresponding to the opening of the substrate, and a plurality of elastic supporting members connected between the outer perimeter of the inner diaphragm and the inner perimeter of the outer diaphragm. Thus, when a sound wave enters the opening of the substrate, the sound wave pressure forces the outer diaphragm to displace and to carry the inner diaphragm to move, and the inner diaphragm itself will also be forced by the sound wave pressure to have a larger displacement than the outer diaphragm, enhancing the sensitivity. Further, using the inner and outer diaphragms to respond to different sound wave pressures can enhance the sound wave pressure sensing range.
摘要翻译： 双隔膜声换能器包括限定开口的基板，同心地安装在与基板的开口相对应的基板的同一侧的内隔膜和外隔膜，以及连接在基板的外周边之间的多个弹性支撑构件 内隔膜和外隔膜的内周。 因此，当声波进入基板的开口时，声波压力迫使外隔膜移位并携带内隔膜移动，并且内隔膜本身也将被声波压力强制以具有较大的 位移比外隔膜增加灵敏度。 此外，使用内膜和外隔膜响应不同的声波压力可以增强声波压力感测范围。
-
-
-
-
-
搜索结果
6 条记录 (耗时 0.016 秒)
