公开(公告)号：US11469358B1

公开(公告)日：2022-10-11

申请号：US16279887

申请日：2019-02-19

Applicant: Meta Platforms Technologies, LLC

Inventor： John Michael Goward ,  James Ronald Bonar

IPC: H01L33/62 ,  C23C14/14 ,  C23C14/02 ,  C25D7/12 ,  C25D3/56 ,  C25D5/48 ,  C23C14/58

Abstract: Embodiments relate to nanoporous copper interconnects on a first body for electrically connecting to a second body. To fabricate the nanoporous copper interconnect, a zinc-copper alloy is deposited on recesses on the surface of the first body, and then the zinc is removed from the zinc-copper alloy to obtain nanoporous copper. The first body and the second body can be attached using bonding between oxide surfaces of the two bodies or be provided with underfill between the two bodies. The nanoporous copper electrically connects to an active layer or electrical components of the first body and the second bodies. Using nanoporous copper as interconnects is advantageous, among other reasons, because it can be formed at a low temperature, it is compatible with a standard complementary metal-oxide-semiconductor (CMOS) process, it provides good electrical conductivity, and it is less likely to cause issues due to migration of material.

公开(公告)号：US11469199B2

公开(公告)日：2022-10-11

申请号：US17100807

申请日：2020-11-20

Applicant: Meta Platforms Technologies, LLC

Inventor： John Michael Goward

IPC: H01L23/00 ,  H01L25/16 ,  H01L33/62 ,  H01L25/075 ,  H01L33/00

Abstract: Embodiments relate to the design of a device capable of maintaining the alignment an interconnect by resisting lateral forces acting on surfaces of the interconnect. The device comprises a first body comprising a first surface with a nanoporous metal structure protruding from the first surface. The device further comprises a second body comprising a second surface with a locking structure to resist a lateral force between the first body and the second body during or after assembly of the first body and the second body.

公开(公告)号：US20240295690A1

公开(公告)日：2024-09-05

申请号：US18441693

申请日：2024-02-14

Applicant: Meta Platforms Technologies, LLC

Inventor： Dusan COSO ,  Steven Alexander-Boyd Hickman ,  Giuseppe Calafiore ,  Petr Markov ,  Shermin Arab ,  John Michael Goward ,  Rahul Agarwal ,  Zhujun Shi

IPC: G02B6/12

CPC classification number: G02B6/12 ,  G02B2006/12121

Abstract: According to examples, an apparatus for implementing a hermetically-covered photonic integrated circuit on a substrate having an integrated laser diode is described. The apparatus may include a cover wafer, a housing layer including a waveguide, the waveguide including a photonic integrated circuit, a laser die including a laser cavity, and a base substrate. The base substrate may include an emission window to provide a reflective design and to eliminate a need for a polarized beam splitter, a through-wafer via element to electrical coupling to the laser die and one or more pillars to set a height of the laser die relative to the photonic integrated circuit.

公开(公告)号：US12009465B1

公开(公告)日：2024-06-11

申请号：US17681203

申请日：2022-02-25

Applicant: META PLATFORMS TECHNOLOGIES, LLC

Inventor： Christophe Antoine Hurni ,  John Michael Goward ,  Chloe Astrid Marie Fabien

IPC: H01L33/62 ,  G02B27/01 ,  H01L25/075 ,  H01L33/00 ,  H01L33/58

CPC classification number: H01L33/62 ,  G02B27/017 ,  H01L25/0753 ,  H01L33/0095 ,  H01L33/58 ,  G02B2027/0178 ,  H01L2933/0066

Abstract: In a flip-chip LED assembly having an array of LEDs formed on the same substrate, different LEDs of the array have different distances to the n-contacts of the assembly. This may cause current crowding as current has to spread from the n-contacts through the substrate to each the farthest LEDs of the LED array, requiring LEDs that are farther away to be driven with a higher voltage in order to receive a desired amount of current. To spread current more evenly through the LED assembly and reduce a voltage difference between the closest and farthest LEDs of the array, a current spreading layer having a conductive material (e.g., a conductive oxide) is formed on a surface of the substrate of the LED assembly. The current spreading layer may be a bulk layer or be patterned to increase light extraction from the LEDs of the array.

公开(公告)号：US11764331B1

公开(公告)日：2023-09-19

申请号：US17466380

申请日：2021-09-03

Applicant: META PLATFORMS TECHNOLOGIES, LLC

Inventor： Christophe Antoine Hurni ,  John Michael Goward ,  Chloe Astrid Marie Fabien

IPC: H01L33/00 ,  H01L25/00 ,  H01L27/00 ,  H01L33/38 ,  H01L33/62 ,  G02B27/01 ,  H01L25/075

CPC classification number: H01L33/382 ,  G02B27/0176 ,  H01L25/0753 ,  H01L33/62 ,  G02B2027/0178 ,  H01L2933/0016

Abstract: In a flip-chip LED assembly having an array of LEDs formed on the same substrate, different LEDs of the array have different distances to the n-contacts of the assembly. This may cause current crowding as current has to spread from the n-contacts through the substrate to each the farthest LEDs of the LED array, requiring LEDs that are farther away to be driven with a higher voltage in order to receive a desired amount of current. To spread current more evenly through the LED assembly and reduce a voltage difference between the closest and farthest LEDs of the array, one or more additional n-contacts are formed within the LED array. In some embodiments, the n-contacts may replace a pixel of the LED array. In other embodiments, one or more p-contacts of the LED array are resized or repositioned to accommodate the additional n-contacts without sacrificing pixels of the LED array.