公开(公告)号：US11034864B2

公开(公告)日：2021-06-15

申请号：US16478614

申请日：2018-01-17

Applicant: MITSUI CHEMICALS TOHCELLO, INC.

Inventor： Kouji Igarashi ,  Jin Kinoshita ,  Hiroyoshi Kurihara

IPC: H01L21/00 ,  C09J7/24 ,  C09J7/35 ,  C09J11/06 ,  C09J201/00 ,  H01L21/02 ,  H01L23/00

Abstract: An adhesive film used when sealing an electronic component to temporarily fix the electronic component, the adhesive film including a base material layer, an adhesive resin layer which is provided on a first surface side of the base material layer and which is for temporarily fixing the electronic component, and an adhesive resin layer which is provided on a second surface side of the base material layer and of which the adhesive strength decreases according to an external stimulus, in which the adhesive resin layer includes a polyvalent carboxylic acid ester-based plasticizer and an adhesive resin, and a content of the polyvalent carboxylic acid ester-based plasticizer in the adhesive resin layer is more than or equal to 0.7 parts by mass and less than or equal to 50 parts by mass with respect to 100 parts by mass of the adhesive resin included in the adhesive resin layer.

公开(公告)号：US10340172B2

公开(公告)日：2019-07-02

申请号：US15741564

申请日：2016-07-01

Applicant: MITSUI CHEMICALS TOHCELLO, INC.

Inventor： Jun Kamada ,  Noboru Kawasaki ,  Shinichi Usugi ,  Makoto Sukegawa ,  Jin Kinoshita ,  Kouji Igarashi ,  Akimitsu Morimoto

IPC: C09J7/30 ,  B32B27/00 ,  B32B27/30 ,  H01L21/67 ,  C09J133/06 ,  C09J133/10 ,  C09J133/12 ,  C09J201/02 ,  H01L21/283 ,  H01L21/304 ,  H01L21/683 ,  H01L21/687

Abstract: This semiconductor wafer surface protection film has a substrate layer A, an adhesive absorption layer B, and adhesive surface layer C, in the stated order. The adhesive absorption layer B comprises an adhesive composition containing a thermoset resin b1, said adhesive absorption layer B having a minimum value G′bmin of the storage elastic modulus G′b in the range of 25° C. to less than 250° C. of 0.001 MPa to less than 0.1 MPa, a storage elastic modulus G′b250 at 250° C. of 0.005 MPa or above, and a temperature at which G′bmin is exhibited of 50-150° C. The adhesive surface layer C has a minimum value G′cmin of the storage elastic modulus G′c in the range of 25° C. to less than 250° C. of 0.03 MPa.

公开(公告)号：US11848215B2

公开(公告)日：2023-12-19

申请号：US17044129

申请日：2019-03-19

Applicant: MITSUI CHEMICALS TOHCELLO, INC.

Inventor： Kouji Igarashi ,  Jin Kinoshita ,  Hiroyoshi Kurihara ,  Toru Miura

IPC: H01L21/56 ,  C09J7/38 ,  B32B37/06 ,  B32B37/12 ,  B32B37/18 ,  C09J5/00 ,  C09K3/10 ,  H01L21/683 ,  H01L21/78 ,  H01L23/00

CPC classification number: H01L21/568 ,  B32B37/06 ,  B32B37/12 ,  B32B37/182 ,  C09J5/00 ,  C09J7/385 ,  C09K3/10 ,  H01L21/561 ,  H01L21/565 ,  H01L21/6835 ,  H01L21/78 ,  H01L24/96 ,  B32B2457/00 ,  C09J2203/326 ,  C09J2301/124 ,  C09J2301/502 ,  C09J2433/00 ,  C09K2200/0647 ,  H01L2221/68386 ,  H01L2224/95001

Abstract: The method for manufacturing an electronic device includes at least: a step of preparing a structure provided with an adhesive film provided with a base material layer, an adhesive resin layer (A) provided on a first surface side of the base material layer and for temporarily fixing an electronic component, and an adhesive resin layer (B) provided on a second surface side of the base material layer and in which an adhesive force is decreased by an external stimulus, an electronic component attached to the adhesive resin layer (A) of the adhesive film, and a support substrate attached to the adhesive resin layer (B) of the adhesive film; at least one step selected from a step of decreasing water content in the adhesive film and a step of decreasing water content in the structure; and a step of sealing the electronic component with a sealing material.

公开(公告)号：US11840652B2

公开(公告)日：2023-12-12

申请号：US17041470

申请日：2019-03-19

Applicant: MITSUI CHEMICALS TOHCELLO, INC.

Inventor： Kouji Igarashi ,  Jin Kinoshita ,  Hiroyoshi Kurihara ,  Toru Miura

IPC: C09J7/38 ,  H01L21/56 ,  H01L21/683

CPC classification number: C09J7/385 ,  H01L21/568 ,  H01L21/6836 ,  C09J2203/326 ,  C09J2301/1242 ,  C09J2433/00 ,  C09J2467/006

Abstract: An adhesive film includes a base material layer; an adhesive resin layer (A) provided on a first surface side of the base material layer; and an adhesive resin layer (B) provided on a second surface side of the base material layer and in which an adhesive force is decreased by an external stimulus, in which, as measured by method 1, an integrated tacking force value (F2.5) of the adhesive resin layer (B) is 1.0 gf/sec or more at a test speed of 2.5 mm/min and a test temperature of 130° C., and an integrated tacking force value (F30) of the adhesive resin layer (B) is 7.0 gf/sec or more at a test speed of 30 mm/min and a test temperature of 130° C.

公开(公告)号：US11462482B2

公开(公告)日：2022-10-04

申请号：US16631255

申请日：2018-07-09

Applicant: MITSUI CHEMICALS TOHCELLO, INC.

Inventor： Takashi Unezaki ,  Jun Kamada ,  Akimitsu Morimoto ,  Jin Kinoshita

IPC: H01L23/552 ,  H01L23/00 ,  H05K9/00

Abstract: Provided is a method of producing an electronic device, including a step of preparing a structure which includes an electronic component having a circuit forming surface, and an adhesive laminated film which includes a base material layer, an unevenness-absorptive resin layer, and an adhesive resin layer in this order and in which the adhesive resin layer is attached to the circuit forming surface of the electronic component such that the circuit forming surface is protected; and a step of forming an electromagnetic wave-shielding layer on the electronic component in a state of being attached to the adhesive laminated film.