公开(公告)号：US11808803B2

公开(公告)日：2023-11-07

申请号：US17976607

申请日：2022-10-28

Applicant: Micron Technology, Inc.

Inventor： Daniel G. Scobee ,  Aleksandr Semenuk ,  Aswin Thiruvengadam

IPC: G01R31/28 ,  H05K7/20 ,  H05K1/18

CPC classification number: G01R31/2817 ,  H05K1/181 ,  H05K7/20 ,  H05K2201/10219

Abstract: A thermal chamber multiple sides that form an enclosed chamber. The thermal chamber includes a first side of the multiple sides, the first side configured to adjustably mount an electronic circuit board within the enclosed chamber. The thermal chamber includes a second side of the multiple sides, the second side located opposite the first side and including one or more ports that expose the enclosed chamber. Each of the one or more ports is configured to receive a temperature control component that transfers thermal energy locally to and from a plurality of electronic devices of an electronic system that is coupled to and positioned above the electronic circuit board.

公开(公告)号：USD893484S1

公开(公告)日：2020-08-18

申请号：US29673181

申请日：2018-12-12

Applicant: Micron Technology, Inc.

Designer： Daniel G. Scobee ,  Aleksandr Semenuk ,  Aswin Thiruvengadam

公开(公告)号：US11658175B2

公开(公告)日：2023-05-23

申请号：US17459589

申请日：2021-08-27

Applicant: Micron Technology, Inc.

Inventor： Daniel G. Scobee ,  Aleksandr Semenuk ,  Aswin Thiruvengadam

IPC: H01L31/00 ,  H01L27/02 ,  H01L35/04 ,  H05K1/02 ,  G01K7/02 ,  G06F1/20

CPC classification number: H01L27/0248 ,  G01K7/021 ,  G06F1/20 ,  H01L35/04 ,  H05K1/0203

Abstract: A thermal chamber includes a cavity that is enclosed by sides and one or more ports that expose the cavity within the thermal chamber. Each of the one or more ports is configured to receive a temperature control component having a solid physical structure and configured to transfer thermal energy to and from an electrical device exposed via the cavity. The thermal chamber includes a bottom side open area of the thermal chamber located below the one or more ports. The bottom side open area is configured to allow the temperature control component to contact the electrical device that is exposed via the bottom side open area.

公开(公告)号：US20210391319A1

公开(公告)日：2021-12-16

申请号：US17459589

申请日：2021-08-27

Applicant: Micron Technology, Inc.

Inventor： Daniel G. Scobee ,  Aleksandr Semenuk ,  Aswin Thiruvengadam

IPC: H01L27/02 ,  H01L35/04 ,  H05K1/02 ,  G01K7/02 ,  G06F1/20

Abstract: A thermal chamber includes a cavity that is enclosed by sides and one or more ports that expose the cavity within the thermal chamber. Each of the one or more ports is configured to receive a temperature control component having a solid physical structure and configured to transfer thermal energy to and from an electrical device exposed via the cavity. The thermal chamber includes a bottom side open area of the thermal chamber located below the one or more ports. The bottom side open area is configured to allow the temperature control component to contact the electrical device that is exposed via the bottom side open area.

公开(公告)号：US11493550B2

公开(公告)日：2022-11-08

申请号：US16711106

申请日：2019-12-11

Applicant: Micron Technology, Inc.

Inventor： Daniel G. Scobee ,  Aleksandr Semenuk ,  Aswin Thiruvengadam

IPC: G01R31/28 ,  H05K7/20 ,  H05K1/18

Abstract: A thermal chamber includes multiple sides, such as a back side, a front side, a first end, a second end, a top side, and a bottom side. An electronic circuit board is adjustably mounted to the bottom side and positioned above the bottom side of the thermal chamber. In the closed position the multiple sides form an enclosed chamber. The top side includes one or more ports orientated along the horizontal axis. Each of the one or more ports includes a top side open area that exposes the enclosed chamber. Each of the one or more ports is configured to receive a temperature control component that transfers thermal energy locally to and from multiple electronic devices of an electronic system that is coupled to and positioned above the electronic circuit board.

公开(公告)号：US11121125B2

公开(公告)日：2021-09-14

申请号：US16218038

申请日：2018-12-12

Applicant: Micron Technology, Inc.

Inventor： Daniel G. Scobee ,  Aleksandr Semenuk ,  Aswin Thiruvengadam

IPC: G05D23/00 ,  H01L27/02 ,  H01L35/04 ,  H05K1/02 ,  G01K7/02 ,  G06F1/20

Abstract: A thermal chamber includes multiple sides, such as a back side, a front side, a first end, a second end, a top side, and a bottom side. The multiple sides form a cavity. The top side includes one or more ports. Each of the one or more ports includes a top side open area that exposes the cavity within the thermal chamber. Each of the one or more ports is configured to receive a temperature control component that transfers thermal energy to and from an electrical device exposed via the cavity. The top side open area of the one or more ports has a corresponding bottom side open area of the bottom side located below the top side open area. The bottom side open area is configured to allow the temperature control component to contact the electrical device that is exposed via the bottom side open area.

公开(公告)号：US12181940B2

公开(公告)日：2024-12-31

申请号：US17724622

申请日：2022-04-20

Applicant: Micron Technology, Inc.

Inventor： Daniel G. Scobee ,  Aleksandr Semenuk ,  Aswin Thiruvengadam

IPC: G06F1/20

Abstract: An apparatus includes a first thermoelectric component (TEC), a second TEC, a thermal transfer component disposed between the first TEC and the second TEC and a thermal conduction layer. The thermal conduction layer is coupled to the second TEC. The thermal conduction layer includes a planar area configured to be positioned above two or more electronic devices of multiple electronic devices of an electronic system to transfer thermal energy at the two or more electronic devices based on the first TEC, the second TEC and the thermal transfer component.

公开(公告)号：USD995530S1

公开(公告)日：2023-08-15

申请号：US29838660

申请日：2022-05-13

Applicant: Micron Technology, Inc.

Designer： Daniel G. Scobee ,  Aleksandr Semenuk ,  Aswin Thiruvengadam

Abstract: FIG. 1 is a side perspective view of a thermal control component showing our claimed design.
FIG. 2 is a first side view of our claimed design.
FIG. 3 is a second side view of our claimed design.
FIG. 4 is a third side view of our claimed design.
FIG. 5 is a fourth side view of our claimed design.
FIG. 6 is a top view of our claimed design; and,
FIG. 7 is a bottom view of our claimed design.
The broken lines in the figures show portions of the thermal control component that form no part of the claimed design.

公开(公告)号：USD954712S1

公开(公告)日：2022-06-14

申请号：US29746237

申请日：2020-08-12

Applicant: Micron Technology, Inc.

Designer： Daniel G. Scobee ,  Aleksandr Semenuk ,  Aswin Thiruvengadam

公开(公告)号：US11334129B2

公开(公告)日：2022-05-17

申请号：US16711109

申请日：2019-12-11

Applicant: Micron Technology, Inc.

Inventor： Daniel G. Scobee ,  Aleksandr Semenuk ,  Aswin Thiruvengadam

IPC: G06F1/20

Abstract: A temperature control component includes a TEC that includes a top surface and a bottom surface. A thermal conduction layer includes a top surface and a bottom surface. The top surface of the thermal conduction layer is coupled to the bottom surface of the TEC. The bottom surface of the thermal conduction layer includes a planar area. The planar area of the thermal conduction layer is to be positioned above two or more electronic devices of multiple electronic devices of an electronic system to transfer the thermal energy at the two or more electronic devices.