公开(公告)号：US11700885B2

公开(公告)日：2023-07-18

申请号：US16652915

申请日：2018-10-25

Applicant: KT&G CORPORATION

Inventor： Jung Ho Han ,  Jae Sung Choi ,  Hun Il Lim ,  Tae Hun Kim ,  Hyung Jin Jung

IPC: A24F13/00 ,  A24F40/42 ,  A24F40/90 ,  A24F40/46 ,  A24B15/167 ,  A24F40/20 ,  A24F40/30 ,  A24D3/17 ,  A24D1/20 ,  A24F40/60 ,  F21V3/00 ,  F21V5/00 ,  G02B19/00 ,  H05B3/54 ,  A24F40/485 ,  A24F40/10 ,  A24F40/44 ,  A24F40/40 ,  A24F40/57 ,  A24F40/65 ,  H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  A24F40/50 ,  A24F40/95 ,  A24F15/01 ,  A24F40/51 ,  F21Y115/10

CPC classification number: A24F40/42 ,  A24B15/167 ,  A24D1/20 ,  A24D3/17 ,  A24F15/01 ,  A24F40/10 ,  A24F40/20 ,  A24F40/30 ,  A24F40/40 ,  A24F40/44 ,  A24F40/46 ,  A24F40/485 ,  A24F40/50 ,  A24F40/57 ,  A24F40/60 ,  A24F40/65 ,  A24F40/90 ,  A24F40/95 ,  F21V3/00 ,  F21V5/00 ,  G02B19/0009 ,  G02B19/0061 ,  H05B3/54 ,  H05K1/0203 ,  H05K1/0277 ,  H05K1/148 ,  H05K1/181 ,  A24F40/51 ,  F21Y2115/10 ,  H05K2201/012 ,  H05K2201/0154 ,  H05K2201/10219

Abstract: An aerosol generation device includes a case into which a cigarette is inserted, a heater disposed in the case and configured to heat the cigarette inserted into the case, a mainstream smoke passage connecting an end portion of the cigarette to the outside, and a pressure detection sensor configured to detect a change in a pressure of air inhaled to pass through the cigarette.

公开(公告)号：US20180323361A1

公开(公告)日：2018-11-08

申请号：US16031868

申请日：2018-07-10

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Henry L. Edwards ,  Kenneth J. Maggio ,  Steven Kummerl ,  Sreenivasan K. Koduri

IPC: H01L35/28 ,  H01L23/00 ,  H05K1/02 ,  H01L29/02 ,  H05K1/18 ,  H01L23/38

CPC classification number: H01L35/28 ,  H01L21/568 ,  H01L23/38 ,  H01L24/18 ,  H01L24/19 ,  H01L24/24 ,  H01L24/25 ,  H01L29/02 ,  H01L2224/04105 ,  H01L2224/06181 ,  H01L2224/2518 ,  H01L2224/32225 ,  H01L2224/92144 ,  H01L2924/12042 ,  H05K1/0203 ,  H05K1/185 ,  H05K2201/0358 ,  H05K2201/10219 ,  H01L2924/00

Abstract: A circuit board includes an embedded thermoelectric device with hard thermal bonds. A method includes embedding a thermoelectric device in a circuit board and forming hard thermal bonds.

公开(公告)号：US20180269371A1

公开(公告)日：2018-09-20

申请号：US15761485

申请日：2016-09-07

Applicant: Siemens Aktiengesellschaft

Inventor： Martin Franke ,  Peter Frühauf ,  Rüdiger Knofe ,  Bernd Müller ,  Stefan Nerreter ,  Michael Niedermayer ,  Ulrich Wittreich ,  Manfred Zäske

IPC: H01L35/30 ,  H02H5/04 ,  H05K1/02 ,  F04D33/00 ,  F04D25/06

CPC classification number: H01L35/30 ,  F04D25/06 ,  F04D33/00 ,  H01L23/38 ,  H01L23/467 ,  H01L35/28 ,  H02H5/04 ,  H05K1/0203 ,  H05K2201/064 ,  H05K2201/066 ,  H05K2201/10037 ,  H05K2201/10151 ,  H05K2201/10219

Abstract: The present disclosure relates to a cooling arrangement for an electronic component. Some embodiments of the teachings thereof may include a heat sink with a contact surface as an interface for the electronic component. For example, a cooling arrangement for an electronic component may include: a heat sink with a contact surface for the electronic component; a converter for the conversion of thermal energy into useful energy; a functional element driven by the useful energy; and an active cooling device for the heat sink or for the electronic component.

公开(公告)号：US20180116056A1

公开(公告)日：2018-04-26

申请号：US15849624

申请日：2017-12-20

Applicant: Unimicron Technology Corp.

Inventor： Yin-Ju CHEN ,  Ming-Hao WU ,  Cheng-Po YU

IPC: H05K3/46 ,  H05K1/18 ,  H01L23/12 ,  H01L23/498 ,  H01L35/30 ,  H05K1/02 ,  H05K3/36 ,  G06F1/20 ,  H05K1/14 ,  H05K1/11

CPC classification number: H05K3/4647 ,  G06F1/206 ,  H01L23/12 ,  H01L23/13 ,  H01L23/4275 ,  H01L23/49827 ,  H01L35/30 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2924/15153 ,  H01L2924/15313 ,  H05K1/0203 ,  H05K1/0206 ,  H05K1/113 ,  H05K1/14 ,  H05K1/181 ,  H05K1/185 ,  H05K1/187 ,  H05K3/36 ,  H05K3/4697 ,  H05K2201/048 ,  H05K2201/10219 ,  H05K2201/10378 ,  H05K2201/10515 ,  H05K2201/10734

Abstract: A circuit board with a heat-recovery function includes a substrate, a heat-storing device, and a thermoelectric device. The heat-storing device is embedded in the substrate and connected to a processor for performing heat exchange with the processor. The thermoelectric device embedded in the substrate includes a first metal-junction surface and a second metal-junction surface. The first metal-junction surface is connected to the heat-storing device for performing heat exchange with the heat-storing device. The second metal-junction surface is joined with the first metal-junction surface, in which the thermoelectric device generates an electric potential by a temperature difference between the first metal-junction surface and the second metal-junction surface.

公开(公告)号：US09750158B2

公开(公告)日：2017-08-29

申请号：US14268276

申请日：2014-05-02

Applicant: Honeywell International Inc.

Inventor： Peter Charles Strickland ,  Sergiy Borysenko ,  Bradley Jessup

IPC: H05K7/20 ,  H05K1/02 ,  H05K3/06

CPC classification number: H05K7/20 ,  H05K1/0204 ,  H05K1/0209 ,  H05K3/06 ,  H05K2201/062 ,  H05K2201/09063 ,  H05K2201/10121 ,  H05K2201/10219 ,  Y10T29/49156 ,  Y10T29/49361

Abstract: A printed circuit board for use with a cooling device configured to cool at least one device is provided. The printed circuit board includes a substrate having a first surface and a second surface opposing the first surface; a ground plane on the first surface of the substrate, and circuitry in a circuit-region on the second surface of the substrate. The ground plane includes a patterned-region that is patterned with an array of holes. The circuitry is configured for use with the at least one device to be cooled. When a first side of the cooling device contacts the ground plane, and when the at least one device to be cooled contacts the circuitry, a reduced cross-sectional area of the patterned-region prevents heat from a second side of the cooling device from degrading performance of the at least one device.

公开(公告)号：US20170034925A1

公开(公告)日：2017-02-02

申请号：US15289950

申请日：2016-10-10

Applicant: Unimicron Technology Corp.

Inventor： Yin-Ju CHEN ,  Ming-Hao WU ,  Cheng-Po YU

IPC: H05K3/46 ,  H05K3/30 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H01L35/30 ,  H05K3/36 ,  H05K3/40 ,  H05K1/02

CPC classification number: H05K3/4647 ,  G06F1/206 ,  H01L23/12 ,  H01L23/13 ,  H01L23/4275 ,  H01L23/49827 ,  H01L35/30 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2924/15153 ,  H01L2924/15313 ,  H05K1/0203 ,  H05K1/0206 ,  H05K1/113 ,  H05K1/14 ,  H05K1/181 ,  H05K1/185 ,  H05K1/187 ,  H05K3/36 ,  H05K3/4697 ,  H05K2201/048 ,  H05K2201/10219 ,  H05K2201/10378 ,  H05K2201/10515 ,  H05K2201/10734

Abstract: A circuit board with a heat-recovery function includes a substrate, a heat-storing device, and a thermoelectric device. The heat-storing device is embedded in the substrate and connected to a processor for performing heat exchange with the processor. The thermoelectric device embedded in the substrate includes a first metal-junction surface and a second metal-junction surface. The first metal-junction surface is connected to the heat-storing device for performing heat exchange with the heat-storing device. The second metal-junction surface is joined with the first metal-junction surface, in which the thermoelectric device generates an electric potential by a temperature difference between the first metal-junction surface and the second metal-junction surface.

Abstract translation: 具有热恢复功能的电路板包括基板，储热装置和热电装置。 储热装置嵌入在基板中并与处理器连接，以与处理器进行热交换。 嵌入在基板中的热电装置包括第一金属结表面和第二金属结表面。 第一金属接合面与蓄热装置连接，与蓄热装置进行热交换。 第二金属结表面与第一金属结表面接合，其中热电装置通过第一金属接合表面和第二金属结表面之间的温度差产生电位。

公开(公告)号：US20160379784A1

公开(公告)日：2016-12-29

申请号：US15125123

申请日：2014-03-11

Applicant: SHENZHEN ZHIYOU BATTERY INTEGRATION TECHNOLOGY CO., LTD

Inventor： Shugang GONG

IPC: H01H50/04 ,  H05K5/02 ,  H05K5/00 ,  H01H50/10 ,  H05K1/18

CPC classification number: H01H50/047 ,  H01H1/5805 ,  H01H50/041 ,  H01H50/10 ,  H01H51/281 ,  H05K1/0203 ,  H05K1/181 ,  H05K5/0017 ,  H05K5/0217 ,  H05K2201/1003 ,  H05K2201/10053 ,  H05K2201/10196 ,  H05K2201/10219 ,  Y02P70/611

Abstract: A reed switch relay comprises a PCB base (1) and a control assembly (2) electrically connected to the PCB base. The control assembly is mounted on the PCB base by a surface mount technology. The control assembly comprises a hollow coil (21) mounted on the PCB base, a reed switch (22) mounted in the hollow coil, and a shield layer (23) sleeving the outer surface of the hollow coil, the reed switch comprises pins, the shield layer is connected with the pins of the reed switch. In the reed relay, the control assembly is mounted on the PCB base though a surface mount technology, which ensures position tolerance and precision of the reed switch, implements full mechanization of product production, increases productivity, and satisfies requirements of mass production, thereby increasing economic benefits.

Abstract translation: 簧片开关继电器包括PCB基座（1）和电连接到PCB基座的控制组件（2）。 控制组件通过表面贴装技术安装在PCB基座上。 控制组件包括安装在PCB基座上的中空线圈（21），安装在中空线圈中的舌簧开关（22）和套在中空线圈外表面上的屏蔽层（23），舌簧开关包括销， 屏蔽层与舌簧开关的引脚连接。 在簧片继电器中，控制组件通过表面贴装技术安装在PCB基座上，确保了簧片开关的位置公差和精度，实现产品生产的全面机械化，提高生产率，满足批量生产要求，从而增加 经济效益

公开(公告)号：US20160316565A1

公开(公告)日：2016-10-27

申请号：US14695057

申请日：2015-04-24

Applicant: Unimicron Technology Corp.

Inventor： Yin-Ju CHEN ,  Ming-Hao WU ,  Cheng-Po YU

IPC: H05K1/18 ,  H05K1/11 ,  H01L35/30 ,  H05K3/30 ,  H05K3/40 ,  H05K1/02 ,  H05K3/46

CPC classification number: H05K3/4647 ,  G06F1/206 ,  H01L23/12 ,  H01L23/13 ,  H01L23/4275 ,  H01L23/49827 ,  H01L35/30 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2924/15153 ,  H01L2924/15313 ,  H05K1/0203 ,  H05K1/0206 ,  H05K1/113 ,  H05K1/14 ,  H05K1/181 ,  H05K1/185 ,  H05K1/187 ,  H05K3/36 ,  H05K3/4697 ,  H05K2201/048 ,  H05K2201/10219 ,  H05K2201/10378 ,  H05K2201/10515 ,  H05K2201/10734

Abstract: A circuit board with a heat-recovery function includes a substrate, a heat-storing device, and a thermoelectric device. The heat-storing device is embedded in the substrate and connected to a processor for performing heat exchange with the processor. The thermoelectric device embedded in the substrate includes a first metal-junction surface and a second metal-junction surface. The first metal-junction surface is connected to the heat-storing device for performing heat exchange with the heat-storing device. The second metal-junction surface is joined with the first metal-junction surface, in which the thermoelectric device generates an electric potential by a temperature difference between the first metal-junction surface and the second metal-junction surface.

公开(公告)号：US09338891B2

公开(公告)日：2016-05-10

申请号：US14713064

申请日：2015-05-15

Applicant: IBIDEN CO., LTD.

Inventor： Toyotaka Shimabe ,  Ryuichiro Tominaga

IPC: H05K1/18 ,  H05K1/03 ,  H05K1/11 ,  H05K1/02

CPC classification number: H05K1/183 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/50 ,  H01L2224/16227 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/3511 ,  H05K1/0298 ,  H05K1/0313 ,  H05K1/115 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/0145 ,  H05K2201/09854 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10219 ,  H05K2201/10636 ,  H05K2203/1469 ,  Y02P70/611 ,  H01L2924/00

Abstract: A printed wiring board includes a core substrate having a cavity, multiple electronic components accommodated in the cavity, and a build-up layer formed on the substrate and including an insulating interlayer such that the interlayer is covering the cavity. The components include a first component, second component and third component, the core substrate has a first projection structure partitioning the first and second components in the cavity and a second projection structure partitioning the second and third components in the cavity, and the cavity and the first and second structures are formed in the substrate such that T1

Abstract translation: 印刷电路板包括具有空腔的芯基板，容纳在空腔中的多个电子元件，以及形成在基板上并包括绝缘夹层的堆积层，使得中间层覆盖空腔。 所述部件包括第一部件，第二部件和第三部件，所述芯基板具有分隔所述空腔中的所述第一和第二部件的第一突起结构以及将所述腔体中的第二和第三部件分隔开的第二突起结构， 在基板上形成第一和第二结构，使得T1

公开(公告)号：US09161432B2

公开(公告)日：2015-10-13

申请号：US13598269

申请日：2012-08-29

Applicant: Toshio Watanabe ,  Isao Ichimura ,  Tatsuo Maeda ,  Takuma Nagata

Inventor： Toshio Watanabe ,  Isao Ichimura ,  Tatsuo Maeda ,  Takuma Nagata

IPC: H05K7/20 ,  H05K1/02 ,  H05K3/00 ,  H05K3/30

CPC classification number: H05K1/0201 ,  H05K3/0061 ,  H05K3/303 ,  H05K2201/09054 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/10121 ,  H05K2201/10219 ,  H05K2201/10409 ,  H05K2203/165

Abstract: A circuit board includes a board having a hole formed therein, and an imager that is bonded to a first region including at least a portion of the hole in a front surface of the board.

Abstract translation: 电路板包括其中形成有孔的板，以及结合到包括板的前表面中的孔的至少一部分的第一区域的成像器。