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公开(公告)号：US20240178204A1
公开(公告)日：2024-05-30
申请号：US18434842
申请日：2024-02-07
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Yukiya YAMAGUCHI , Atsushi HORITA , Hiroki SHOUNAI
IPC: H01L25/16 , H01L23/498 , H03F3/19
CPC classification number: H01L25/16 , H01L23/49811 , H03F3/19 , H03F2200/294 , H03F2200/451
Abstract: A radio-frequency module includes a module substrate including a first major surface opposite to a second major surface, a plurality of electronic components disposed at the first major surface and at the second major surface, and a power supply terminal disposed at the second major surface. The plurality of electronic components include an integrated circuit disposed at the second major surface and including a control circuit coupled to the power supply terminal. The plurality of electronic components also include a capacitor disposed at the second major surface and coupled between a path connecting the power supply terminal to the control circuit and ground. The integrated circuit is disposed closer to the capacitor than any other electronic component disposed at the second major surface and/or the capacitor is disposed closer to the integrated circuit than any other electronic component disposed at the second major surface.
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公开(公告)号：US20240187029A1
公开(公告)日：2024-06-06
申请号：US18442117
申请日：2024-02-15
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Yukiya YAMAGUCHI , Hiroki SHOUNAI , Atsushi HORITA
CPC classification number: H04B1/38 , H04B1/0078
Abstract: A radio-frequency module includes a module substrate having major surfaces that are opposite to each other, a plurality of electronic components disposed at the major surface and at the major surface, and a plurality of post electrodes that are disposed at the major surface and that include a power supply terminal. The plurality of electronic components includes an integrated circuit that is disposed at the major surface and that includes a control circuit coupled to the power supply terminal. The plurality of electronic components also include a capacitor that is disposed at the major surface and that is coupled between the path connecting the power supply terminal to the control circuit and ground. The power supply terminal is disposed closer to the capacitor than any other post electrodes; and/or the capacitor is disposed closer to the power supply terminal than any other electronic component disposed at the major surface.
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公开(公告)号：US20180102754A1
公开(公告)日：2018-04-12
申请号：US15730128
申请日：2017-10-11
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Yusuke TANAKA , Hiroki SHOUNAI
IPC: H03H7/38
CPC classification number: H03H7/38
Abstract: A matching circuit performs output impedance matching for an amplifier that amplifies an input signal and outputs an amplified signal. The matching circuit includes a low pass filter and a high pass filter. The ground of the low pass filter and the ground of the high pass filter are isolated from each other.
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公开(公告)号：US20240275412A1
公开(公告)日：2024-08-15
申请号：US18625227
申请日：2024-04-03
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hiroki SHOUNAI , Kenji TAHARA
CPC classification number: H04B1/006 , H03F1/56 , H03F3/245 , H03F2200/171 , H03F2200/387 , H03F2200/451
Abstract: A radio frequency circuit includes power amplifiers, an input side coil and an output side coil, a filter whose pass band is a first band, a filter whose pass band is a second band, a filter whose pass band is a third band, a switch connected between ground and a path connecting one end portion of the output side coil and the filter, a switch connected between the ground and a path connecting the other end portion of the output side coil and the filter, a switch arranged in series in the path in between the switch and the filter, and a switch arranged in series in the path connecting the filter and a path connecting the switch and the switch, wherein no switch is arranged in series in the path.
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公开(公告)号：US20240214025A1
公开(公告)日：2024-06-27
申请号：US18537837
申请日：2023-12-13
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Shigeru TSUCHIDA , Kyohei MORITA , Yoshito MATSUMURA , Hiroki SHOUNAI , Ken NANKOU
IPC: H04B1/40
CPC classification number: H04B1/40
Abstract: A radio frequency module includes a module substrate having main surfaces that are opposite to each other, a plurality of external connection terminals that are disposed on the main surface, power amplifier circuits that are disposed on the main surface, a transformer that is connected to the power amplifier circuit and disposed on the main surface, and a transformer that is connected to the power amplifier circuit and disposed on the main surface. The power amplifier circuit is a Doherty-type power amplifier circuit, and the power amplifier circuit is a differential-amplifier-type power amplifier circuit.
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Patent Agency Ranking
公开(公告)号：US20240214024A1
公开(公告)日：2024-06-27
申请号：US18499378
申请日：2023-11-01
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Shigeru TSUCHIDA , Kyohei MORITA , Yoshito MATSUMURA , Hiroki SHOUNAI , Ken NANKOU
IPC: H04B1/40
CPC classification number: H04B1/40
Abstract: A radio frequency module includes a module substrate having main surfaces that are opposite to each other, a plurality of external connection terminals that are disposed on the main surface, a power amplifier circuit that is disposed on the main surface and supports a first power class, a power amplifier circuit that is disposed on the main surface and supports a second power class, a transformer that is connected to the power amplifier circuit and disposed on the main surface, and a transformer that is connected to the power amplifier circuit and disposed on the main surface. The second power class is defined by a maximum output power higher than a third power class. The first power class is defined by a maximum output power lower than the second power class or the same maximum output power as the second power class.
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公开(公告)号：US20240187033A1
公开(公告)日：2024-06-06
申请号：US18442125
申请日：2024-02-15
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hiroki SHOUNAI , Yukiya YAMAGUCHI , Atsushi HORITA , Hiroyuki YAMAMOTO , Yukiko MATSUDA
IPC: H04B1/40
CPC classification number: H04B1/40
Abstract: A radio frequency module includes a module substrate including a first main surface facing a second main surface, and a power amplifier including first and second power amplification devices and an output transformer, which includes a primary coil and a secondary coil, and a capacitor connected to the output transformer. One end of the primary coil is connected to the first amplification device. Another end of the primary coil is connected to the second amplification device. One end of the secondary coil is connected to an output terminal. The output transformer is disposed in or on the module substrate and is disposed closer to one of the first and second main surfaces than the other. The capacitor is disposed in or on the other of the first and second main surfaces and is disposed to overlap the output transformer when the module substrate is viewed in a plan view.
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公开(公告)号：US20240162923A1
公开(公告)日：2024-05-16
申请号：US18418379
申请日：2024-01-22
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kenji TAHARA , Hiroki SHOUNAI , Kae YAMAMOTO , Ryo WAKABAYASHI
CPC classification number: H04B1/0458 , H04B1/0078 , H04B2001/0408
Abstract: A radio frequency circuit includes power amplifiers, a transformer, a filter having a band A as a pass band, a filter having a band B as a pass band, a filter having a band C as a pass band, matching circuits connected to one end of an output side coil, and matching circuits connected to the other end of the output side coil. The matching circuit includes a capacitor disposed at a first path, a switch connected to the first path and a ground, a switch and an inductor connected in series, and the matching circuit includes a capacitor disposed at a second path, and a switch and an inductor connected in series, and the matching circuit includes a switch connected to a third path and the ground.
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公开(公告)号：US20220278703A1
公开(公告)日：2022-09-01
申请号：US17713230
申请日：2022-04-05
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hiroki SHOUNAI
Abstract: An output matching circuit includes a plurality of inductor parts and is connected to an output pad electrode of a power amplifier. In a radio frequency module, a second principal surface of a first wiring board and a third principal surface of a second wiring board are on opposite sides of the radio frequency module. An external connection terminal is arranged on a fourth principal surface of the second wiring board. The power amplifier is arranged on a first principal surface) of the first wiring board. In theon output matching circuit, at least part of a first inductor part, which is the inductor part L1 closest to the output pad electrode of the plurality of inductor parts, is arranged on the first principal surface of the first wiring board.
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公开(公告)号：US20190109567A1
公开(公告)日：2019-04-11
申请号：US16212920
申请日：2018-12-07
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hiroki SHOUNAI , Yoshiki KOGUSHI
CPC classification number: H03F1/26 , H03F1/32 , H03F1/565 , H03F3/195 , H03F3/213 , H03F3/245 , H03F2200/171 , H03F2200/387 , H03F2200/451
Abstract: A power amplifier module includes an amplifier that amplifies an input signal and outputs an amplified signal, a matching circuit disposed between an output terminal of the amplifier and a subsequent circuit, a choke inductor having a first end to which a power supply voltage is applied and a second end from which power supply is provided to the amplifier through the output terminal of the amplifier, and a first attenuation circuit disposed between the output terminal of the amplifier and the second end of the choke inductor and configured to attenuate a harmonic component of the amplified signal.
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