ELECTRONIC COMPONENT
    1.
    发明公开

    公开(公告)号:US20240105386A1

    公开(公告)日:2024-03-28

    申请号:US18534790

    申请日:2023-12-11

    Abstract: An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes at multilayer body end surfaces of the multilayer body and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surfaces and the board side surfaces. One of the board main surfaces is located in a vicinity of the electronic element and joined with one of the multilayer body main surfaces in a vicinity of the interposer board. The interposer board is an alumina board. The board end surfaces include a metal layer including a Pd-containing layer, and an electrolessly-plated layer on an outer periphery of the Pd-containing layer.

    MULTILAYER CERAMIC CAPACITOR
    2.
    发明公开

    公开(公告)号:US20230207223A1

    公开(公告)日:2023-06-29

    申请号:US18118174

    申请日:2023-03-07

    Inventor: Mitsuru IKEDA

    CPC classification number: H01G4/30 H01G4/012 H01G2/02 H01G4/008 H01G4/1218

    Abstract: A multilayer ceramic capacitor includes a multilayer body, and two external electrodes. The multilayer body includes a multilayer body main portion including an inner layer portion including dielectric layers and internal electrode layers that are stacked, and two outer layer portions on opposite sides of the inner layer portion in a stacking direction, two side gap portions on opposite sides of the multilayer main body in a width direction, two main surfaces on opposite sides in the stacking direction, two side surfaces on opposite sides in the width direction, and two end surfaces on opposite sides in a length direction. Each of the two external electrodes are at an end surface of the multilayer body, and extend from the end surface to a portion of the main surface. An end of the side gap portion on a side of the main surface protrudes farther than the multilayer main body.

    MULTILAYER CERAMIC CAPACITOR
    3.
    发明申请

    公开(公告)号:US20230027489A1

    公开(公告)日:2023-01-26

    申请号:US17958482

    申请日:2022-10-03

    Inventor: Mitsuru IKEDA

    Abstract: A multilayer ceramic capacitor includes a multilayer body and external electrodes. The multilayer body includes an inner layer portion including dielectric layers and internal electrode layers alternately stacked, and first and second outer layer portions on opposite sides of the inner layer portion in a stacking direction, side gap portions on opposite sides in a width direction, main surfaces on opposite sides in the stacking direction, side surfaces on opposite sides in the width direction, and end surfaces on opposite sides in a length direction. Each external electrode is provided at one end surfaces of the multilayer body, and extends from the end surface to a portion of the main surface. A difference in location between ends at the side surface of two adjacent internal electrode layers is about 0.5 μm or less. The second outer layer portion is thicker than the first outer layer portion.

    ELECTRONIC COMPONENT
    4.
    发明申请

    公开(公告)号:US20220013294A1

    公开(公告)日:2022-01-13

    申请号:US17366140

    申请日:2021-07-02

    Abstract: An electronic component includes a multilayer body including a multilayer main body and side gap portions, the multilayer main body including an inner layer portion including alternatively laminated dielectric layers and internal nickel electrode layers, and including end surfaces in a length direction. The internal nickel electrode layers are exposed at the end surfaces. The side gap portions are on both sides of the multilayer main body in a width direction. External nickel layers are on the end surfaces of the multilayer body. A deviation amount in the width direction between ends of two adjacent internal nickel electrode layers on both side surfaces is within about 0.5 μm. The external nickel layers are on the end surface of the multilayer body, in a region other than a region including a rounded ridge portion. A thermosetting resin layer including metal filler is outside the external nickel layer.

    MULTILAYER CERAMIC CAPACITOR
    5.
    发明申请

    公开(公告)号:US20210335550A1

    公开(公告)日:2021-10-28

    申请号:US17232357

    申请日:2021-04-16

    Inventor: Mitsuru IKEDA

    Abstract: A multilayer ceramic capacitor includes a multilayer body, and two external electrodes. The multilayer body includes a multilayer body main portion including an inner layer portion including dielectric layers and internal electrode layers that are stacked, and two outer layer portions on opposite sides of the inner layer portion in a stacking direction, two side gap portions on opposite sides of the multilayer main body in a width direction, two main surfaces on opposite sides in the stacking direction, two side surfaces on opposite sides in the width direction, and two end surfaces on opposite sides in a length direction. Each of the two external electrodes are at an end surface of the multilayer body, and extend from the end surface to a portion of the main surface. An end of the side gap portion on a side of the main surface protrudes farther than the multilayer main body.

    MULTILAYER CERAMIC CAPACITOR
    6.
    发明申请
    MULTILAYER CERAMIC CAPACITOR 有权
    多层陶瓷电容器

    公开(公告)号:US20160163453A1

    公开(公告)日:2016-06-09

    申请号:US14935563

    申请日:2015-11-09

    Inventor: Mitsuru IKEDA

    CPC classification number: H01G4/012 H01G2/12 H01G4/12 H01G4/232 H01G4/30

    Abstract: A ceramic body includes outer layer portions of about 15 μm or more and about 25 μm or less in thickness outside an inner layer portion where internal electrodes are stacked with dielectric ceramic layers interposed therebetween, the inner layer portion includes inner cover electrodes opposed to the internal electrode located outermost in the stacking direction with the dielectric ceramic layers interposed therebetween, the outer layer portions include outer cover electrodes opposed to the inner cover electrodes with the dielectric ceramic layers interposed therebetween, the inner cover electrodes have a coverage of about 75% or more and about 100% or less, the outer cover electrodes have a coverage of about 50% or more and about 70% or less, and boundary layers containing Mg and Mn are provided at the boundaries between the outer cover electrodes and the dielectric ceramic layers located outside the electrodes.

    Abstract translation: 陶瓷体包括外层部分,其内部电极层叠有介电陶瓷层的内层部分的外侧厚度为约15μm或更小,内层部分包括与内部电极相对的内盖电极 电极位于层叠方向最外侧,介电陶瓷层插入其间,外层部分包括与内盖电极相对的外盖电极,介电陶瓷层插入其间,内盖电极的覆盖率为约75%以上 和约100%以下,外覆盖电极具有约50%以上且约70%以下的覆盖率,并且在外覆电极与位于电介质陶瓷层之间的边界处设置包含Mg和Mn的边界层 电极外。

    MULTILAYER CERAMIC CAPACITOR
    7.
    发明公开

    公开(公告)号:US20230411081A1

    公开(公告)日:2023-12-21

    申请号:US18242569

    申请日:2023-09-06

    Inventor: Mitsuru IKEDA

    CPC classification number: H01G4/30 H01G4/1227 H01G4/248 H01G4/012

    Abstract: A multilayer ceramic capacitor includes a multilayer body and external electrodes. The multilayer body includes an inner layer portion including dielectric layers and internal electrode layers alternately stacked, and first and second outer layer portions on opposite sides of the inner layer portion in a stacking direction, side gap portions on opposite sides in a width direction, main surfaces on opposite sides in the stacking direction, side surfaces on opposite sides in the width direction, and end surfaces on opposite sides in a length direction. Each external electrode is provided at one end surfaces of the multilayer body, and extends from the end surface to a portion of the main surface. A difference in location between ends at the side surface of two adjacent internal electrode layers is about 0.5 μm or less. The second outer layer portion is thicker than the first outer layer portion.

    MULTILAYER CERAMIC CAPACITOR
    8.
    发明公开

    公开(公告)号:US20230268122A1

    公开(公告)日:2023-08-24

    申请号:US18139604

    申请日:2023-04-26

    Inventor: Mitsuru IKEDA

    CPC classification number: H01G4/012 H01G4/008 H01G4/1218 H01G4/30

    Abstract: A multilayer ceramic capacitor includes a multilayer body including an inner layer portion including dielectric layers and internal electrodes, and outer layer portions, two external electrodes each including a foundation electrode layer connected to the internal electrodes, and a conductive resin layer in contact with the foundation electrode layer. An end region of each of the internal electrodes is connected to the foundation electrode layer and is thicker than regions of the respective internal electrodes other than the end region. The internal electrodes include first and second internal electrodes. The first internal electrodes each include a first opposing portion, and a first lead-out portion. The second internal electrodes each include a second opposing portion, and a second lead-out portion. Distances between end regions of the first and second lead-out portions adjacent to each other are shorter than distances between the respective first and second opposing portions adjacent to each other.

    ELECTRONIC COMPONENT
    9.
    发明申请

    公开(公告)号:US20220384103A1

    公开(公告)日:2022-12-01

    申请号:US17752909

    申请日:2022-05-25

    Abstract: An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes each at a respective one of multilayer body end surfaces of the multilayer body and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surface and the board side surface. One of the board main surfaces is located in a vicinity of the electronic element and joined with one of the pair of multilayer body main surfaces in a vicinity of the interposer board. The interposer board is an alumina board. The pair of board end surfaces include a metal layer including a Cu-containing layer and a Cu plated layer on an outer periphery of the Cu-containing layer.

    ELECTRONIC COMPONENT
    10.
    发明申请

    公开(公告)号:US20220013296A1

    公开(公告)日:2022-01-13

    申请号:US17366143

    申请日:2021-07-02

    Abstract: An electronic component includes a multilayer body including a multilayer main body and side gap portions, the multilayer main body including an inner layer portion including dielectric layers and internal nickel electrode layers laminated alternately therein, and including end surfaces on both sides in a length direction. The internal nickel electrode layers are exposed at the end surfaces. External nickel layers are provided on the end surfaces. External copper electrode layers cover the end surfaces on which the external nickel layers are provided. A deviation amount in the width direction between positions of ends of two adjacent internal nickel electrode layers on both side surfaces is at least about 0.5 μm. The external nickel layers are provided on the end surface, in a region excluding a rounded ridge portion. Nickel and tin layers are provided outside the external copper electrode layer.

Patent Agency Ranking