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    ELECTRONIC COMPONENT
    1.
    发明申请
    ELECTRONIC COMPONENT 有权

    公开(公告)号：US20220384104A1

    公开(公告)日：2022-12-01

    申请号：US17752910

    申请日：2022-05-25

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Mitsuru IKEDA ,  Yasuhiro NISHISAKA

    IPC: H01G2/06 ,  H01G4/30 ,  H01G4/248 ,  H01G4/232 ,  H01G4/12 ,  H01G4/008

    Abstract: An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes at multilayer body end surfaces of the multilayer body and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surfaces and the board side surfaces. One of the board main surfaces is located in a vicinity of the electronic element and joined with one of the multilayer body main surfaces in a vicinity of the interposer board. The interposer board is an alumina board. The board end surfaces include a metal layer including a Pd-containing layer, and an electrolessly-plated layer on an outer periphery of the Pd-containing layer.

    ELECTRONIC COMPONENT AND METHOD FOR PRODUCING THE SAME
    2.
    发明申请
    ELECTRONIC COMPONENT AND METHOD FOR PRODUCING THE SAME 审中-公开
    电子元件及其制造方法

    公开(公告)号：US20160276104A1

    公开(公告)日：2016-09-22

    申请号：US15061119

    申请日：2016-03-04

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Yasuhiro NISHISAKA ,  Tomoe TANAKA

    IPC: H01G4/10 ,  H01G13/00 ,  H01G4/012 ,  H01G4/12 ,  H01G4/248 ,  H01G4/232

    CPC classification number: H01G13/006 ,  H01G4/12 ,  H01G4/232 ,  H01G4/2325

    Abstract: An outer electrode includes sintered layers each containing a sintered metal, an electrically insulating glass layer, and metal layers each containing at least one of Sn and Cu. Each sintered layer covers a respective end surface of a body and extends from the end surface to at least one main surface of the body. The glass layer is directly provided on the sintered layers located on the end surfaces of the body, extends in a direction perpendicular or substantially perpendicular to side surfaces of the body, and defines a portion of a surface of the outer electrode. Each metal layer covers a portion of one of the sintered layers other than a portion of the corresponding sintered layer that is covered with the glass layer, and defines another portion of the surface of the outer electrode.

    Abstract translation: 外电极包括各自含有烧结金属，电绝缘玻璃层和各自含有Sn和Cu中的至少一种的金属层的烧结层。 每个烧结层覆盖主体的相应端表面，并且从端表面延伸到主体的至少一个主表面。 玻璃层直接设置在位于主体的端面上的烧结层上，在与主体的侧面垂直或大致垂直的方向上延伸，并限定外部电极的一部分表面。 每个金属层覆盖除被玻璃层覆盖的相应烧结层的一部分之外的一个烧结层的一部分，并且限定外部电极的表面的另一部分。

    CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
    3.
    发明申请
    CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME 有权
    陶瓷电子元件及其制造方法

    公开(公告)号：US20140127493A1

    公开(公告)日：2014-05-08

    申请号：US14154204

    申请日：2014-01-14

    Applicant: MURATA MANUFACTURING CO., LTD.

    Inventor： Yasuhiro NISHISAKA ,  Yukio SANADA ,  Koji SATO ,  Seiichi MATSUMOTO

    IPC: H05K1/18 ,  H01F27/28 ,  H01C7/00 ,  H01G4/232 ,  H01L41/083

    CPC classification number: H05K1/182 ,  H01C7/008 ,  H01F27/28 ,  H01F27/2804 ,  H01G4/008 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H01L41/083 ,  H01L41/1876

    Abstract: A ceramic electronic component includes a ceramic element assembly and external electrodes. The external electrodes are disposed on the ceramic element assembly. The external electrodes include an underlying electrode layer and a first Cu plating film. The underlying electrode layer is disposed on the ceramic element assembly. The first Cu plating film is disposed on the underlying electrode layer. The underlying electrode layer includes a metal that is diffusible in Cu and a ceramic bonding material. The metal that is diffusible in Cu is diffused in at least a surface layer in the underlying electrode layer side of the first Cu plating film.

    Abstract translation: 陶瓷电子部件包括陶瓷元件组件和外部电极。 外部电极设置在陶瓷元件组件上。 外部电极包括下面的电极层和第一个Cu镀膜。 底层电极层设置在陶瓷元件组件上。 第一Cu镀膜设置在下面的电极层上。 底层电极层包括可在Cu中扩散的金属和陶瓷接合材料。 在Cu中可扩散的金属在第一Cu镀膜的下面的电极层侧的至少一个表面层中扩散。

    ELECTRONIC COMPONENT
    4.
    发明申请
    ELECTRONIC COMPONENT 有权

    公开(公告)号：US20220384102A1

    公开(公告)日：2022-12-01

    申请号：US17752908

    申请日：2022-05-25

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Mitsuru IKEDA ,  Yasuhiro NISHISAKA

    IPC: H01G2/06 ,  H01G4/30 ,  H01G4/248 ,  H01G4/232 ,  H01G4/12 ,  H01G4/008

    Abstract: An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes at multilayer body end surfaces of the multilayer body and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surface and the board side surface. One of the board main surfaces is located in a vicinity of the electronic element and joined with one of the pair of multilayer body main surfaces in the vicinity of the board. The interposer board is an alumina board. The board end surfaces each include a metal layer including a Zn-containing layer and a Cu layer on an outer periphery of the Zn-containing layer.

    ELECTRONIC COMPONENT
    5.
    发明申请
    ELECTRONIC COMPONENT 有权

    公开(公告)号：US20220013291A1

    公开(公告)日：2022-01-13

    申请号：US17366139

    申请日：2021-07-02

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Yasuhiro NISHISAKA ,  Mitsuru IKEDA

    IPC: H01G4/232 ,  H01G4/008 ,  H01G4/12 ,  H01G4/30

    Abstract: An electronic component includes external nickel layers each provided on end surfaces of a multilayer body and external copper electrode layers each covering the end surfaces on which the external nickel layers are provided. When a dimension of each of the external nickel layers in the lamination direction is defined as TN, and a dimension of the inner layer portion in the lamination direction is defined as T1, T1

    CERAMIC ELECTRONIC COMPONENT
    8.
    发明申请
    CERAMIC ELECTRONIC COMPONENT 有权
    陶瓷电子元件

    公开(公告)号：US20140292141A1

    公开(公告)日：2014-10-02

    申请号：US14191480

    申请日：2014-02-27

    Applicant: MURATA MANUFACTURING CO., LTD.

    Inventor： Yasuhiro NISHISAKA ,  Satoshi MATSUNO ,  Tetsuya KISUMI ,  Yoko OKABE

    IPC: H01G4/30 ,  H01C7/00 ,  H01F17/00 ,  H02N2/00

    CPC classification number: H02N2/00 ,  H01C7/008 ,  H01F17/0013 ,  H01L41/0471 ,  H01L41/0472 ,  H01L41/0533

    Abstract: A ceramic electronic component includes a ceramic body, inner electrodes, a glass coating layer, and outer electrodes. The glass coating layer extends from an exposed portion of one of the inner electrodes at a first end surface to a first principal surface. The outer electrodes are each constituted by a plating film disposed directly above the glass coating layer. The glass coating layer includes a glass medium and metal powder particles that define conductive paths. The metal powder particles have an elongated or substantially elongated shape and are dispersed in the glass medium. The dimension of a portion of the glass coating layer located on the first principal surface in the length direction, is larger than that of a portion of the glass coating layer located on the first end surface in the thickness direction.

    Abstract translation: 陶瓷电子部件包括陶瓷体，内电极，玻璃涂层和外电极。 玻璃涂层从一个内电极的暴露部分在第一端面延伸到第一主表面。 外部电极由直接设置在玻璃涂层上方的镀膜构成。 玻璃涂层包括限定导电路径的玻璃介质和金属粉末颗粒。 金属粉末颗粒具有细长的或基本上细长的形状并且分散在玻璃介质中。 位于第一主表面上的长度方向上的玻璃涂层的一部分的尺寸大于位于厚度方向上的第一端面上的玻璃涂层的部分的尺寸。

    CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
    9.
    发明申请
    CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME 有权
    陶瓷电子元件及其制造方法

    公开(公告)号：US20130279073A1

    公开(公告)日：2013-10-24

    申请号：US13923396

    申请日：2013-06-21

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Yasuhiro NISHISAKA ,  Yukio SANADA ,  Koji SATO ,  Seiichi MATSUMOTO

    IPC: H01G4/30

    CPC classification number: H05K1/182 ,  H01C7/008 ,  H01F27/28 ,  H01F27/2804 ,  H01G4/008 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H01L41/083 ,  H01L41/1876

    Abstract: A ceramic electronic component includes a ceramic element assembly and external electrodes. The external electrodes are disposed on the ceramic element assembly. The external electrodes include an underlying electrode layer and a first Cu plating film. The underlying electrode layer is disposed on the ceramic element assembly. The first Cu plating film is disposed on the underlying electrode layer. The underlying electrode layer includes a metal that is diffusible in Cu and a ceramic bonding material. The metal that is diffusible in Cu is diffused in at least a surface layer in the underlying electrode layer side of the first Cu plating film.

    Abstract translation: 陶瓷电子部件包括陶瓷元件组件和外部电极。 外部电极设置在陶瓷元件组件上。 外部电极包括下面的电极层和第一个Cu镀膜。 底层电极层设置在陶瓷元件组件上。 第一Cu镀膜设置在下面的电极层上。 底层电极层包括可在Cu中扩散的金属和陶瓷接合材料。 在Cu中可扩散的金属在第一Cu镀膜的下面的电极层侧的至少一个表面层中扩散。

    CERAMIC ELECTRONIC COMPONENT
    10.
    发明公开
    CERAMIC ELECTRONIC COMPONENT 审中-公开

    公开(公告)号：US20240363287A1

    公开(公告)日：2024-10-31

    申请号：US18766895

    申请日：2024-07-09

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Syouta IKEBE ,  Yasuhiro NISHISAKA

    IPC: H01G4/012 ,  H01G4/008 ,  H01G4/30

    CPC classification number: H01G4/012 ,  H01G4/008 ,  H01G4/30

    Abstract: A ceramic electronic component includes a ceramic body including an internal electrode layer, and an outer electrode on a surface of the ceramic body and electrically connected to the internal electrode layer. The outer electrode includes a base electrode layer including a SiO2—BaO—B2O3—CaO-based glass, a protective layer covering a surface of the SiO2—BaO—B2O3—Cao-based glass exposed on a surface of the base electrode layer and including at least one of P, S, C, Si, Ba, F, N, Al, Sr, or B, and a Ni plating layer covering the base electrode layer and the protective layer.

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