公开(公告)号：US09755289B2

公开(公告)日：2017-09-05

申请号：US14739474

申请日：2015-06-15

Applicant: NATIONAL INSTRUMENTS CORPORATION

Inventor： Ron J. Barnett ,  Gregory S. Gonzales

IPC: H01P5/08 ,  H01P3/08 ,  H03H7/38 ,  H01P3/06

CPC classification number: H01P5/085

Abstract: Right angle transition to circuit. A system includes a conductive plate, coaxial transmission line, a circuit, parallel to the conductive plate, and a right angle transition from the coaxial transmission line to the circuit. The transmission line includes a center pin protruding through a hole in the plate, an outer conductor formed by a conductive surface of the hole, and air dielectric between. The circuit includes a top conducting layer (TCL), ground plane with cutout, and an insulating substrate between the TCL and ground plane that abuts the pin. The transition includes the pin, a conductive element connecting the center pin to the TCL, the outer conductor, the air dielectric, the abutment of the substrate against the pin, and the cutout. The abutment and cutout minimize manufacturing variations regarding distance between the pin and the ground plane. The transition tunes out inductance introduced by bonding the pin to the TCL.

公开(公告)号：US20140078683A1

公开(公告)日：2014-03-20

申请号：US13772874

申请日：2013-02-21

Applicant: NATIONAL INSTRUMENTS CORPORATION

Inventor： Tamir Moran ,  Gregory S. Gonzales

IPC: H03H5/02

CPC classification number: H03H5/02 ,  H01L23/66 ,  H01L25/16 ,  H01L2223/6633 ,  H01L2223/665 ,  H01L2223/6683 ,  H01L2224/48091 ,  H01L2224/48229 ,  H01R13/7197 ,  Y10T29/4913 ,  H01L2924/00014

Abstract: In one embodiment, a high frequency module may include a substrate. The substrate may include a first surface and a second surface substantially opposite of the first surface. The high frequency module may include a component coupled to the second surface. A direct current may be provided to the component using the substrate. The high frequency module may include a core coupled to the second surface of the substrate. In some embodiments, the core may include at least one opening extending through the core. The component may be positioned in at least one of the openings. In some embodiments, the high frequency module may include a cover coupled to the core. The component may be positioned in at least one of the openings between the substrate and the cover.

Abstract translation: 在一个实施例中，高频模块可以包括衬底。 衬底可以包括基本上与第一表面相对的第一表面和第二表面。 高频模块可以包括耦合到第二表面的部件。 可以使用衬底向组件提供直流电。 高频模块可以包括耦合到衬底的第二表面的芯。 在一些实施例中，芯可以包括延伸穿过芯的至少一个开口。 部件可以定位在至少一个开口中。 在一些实施例中，高频模块可以包括耦合到芯的盖。 该部件可以位于基板和盖之间的至少一个开口中。

公开(公告)号：US09015938B2

公开(公告)日：2015-04-28

申请号：US14073084

申请日：2013-11-06

Applicant: National Instruments Corporation

Inventor： Ron J. Barnett ,  Gregory S. Gonzales

IPC: H01R43/04 ,  H01P1/203 ,  H01R13/24 ,  H01R43/26 ,  H01R43/16 ,  H01R31/06 ,  H01P1/22

CPC classification number: H01R43/26 ,  H01P1/203 ,  H01P1/227 ,  H01R13/2407 ,  H01R31/06 ,  H01R43/16 ,  Y10T29/49117 ,  Y10T29/49174 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49218 ,  Y10T29/49224

Abstract: A connector is disclosed. The connector includes a conductive housing. The conductive housing includes a wall region enclosing a space for receiving an adapter. The conductive housing also includes an annular end piece extending radially inward from a first end of the wall region and terminating the space. The annular end piece includes a flat annular surface, and a raised deformable annulus mounted on the flat annular surface. The raised deformable annulus is of a height such that an insertion of the adapter into the space deforms the raised deformable annulus to generate a physical contact connection between the flat annular surface and the adapter.

Abstract translation: 公开了连接器。 连接器包括导电壳体。 导电壳体包括封闭用于接收适配器的空间的壁区域。 导电壳体还包括从壁区域的第一端径向向内延伸并终止该空间的环形端件。 环形端件包括平坦的环形表面和安装在平坦环形表面上的凸起的可变形环形空间。 凸起的可变形环具有这样的高度，使得适配器插入空间中使升高的可变形环变形，以在平坦的环形表面和适配器之间产生物理接触连接。

公开(公告)号：US20160240909A1

公开(公告)日：2016-08-18

申请号：US14739474

申请日：2015-06-15

Applicant: NATIONAL INSTRUMENTS CORPORATION

Inventor： Ron J. Barnett ,  Gregory S. Gonzales

IPC: H01P5/08 ,  H01P3/08 ,  H03H7/38 ,  H01P3/06

CPC classification number: H01P5/085

Abstract: Right angle transition to circuit. A system includes a conductive plate, coaxial transmission line, a circuit, parallel to the conductive plate, and a right angle transition from the coaxial transmission line to the circuit. The transmission line includes a center pin protruding through a hole in the plate, an outer conductor formed by a conductive surface of the hole, and air dielectric between. The circuit includes a top conducting layer (TCL), ground plane with cutout, and an insulating substrate between the TCL and ground plane that abuts the pin. The transition includes the pin, a conductive element connecting the center pin to the TCL, the outer conductor, the air dielectric, the abutment of the substrate against the pin, and the cutout. The abutment and cutout minimize manufacturing variations regarding distance between the pin and the ground plane. The transition tunes out inductance introduced by bonding the pin to the TCL.

Abstract translation: 直角转换到电路。 系统包括导电板，同轴传输线，平行于导电板的电路以及从同轴传输线到电路的直角转变。 传输线包括穿过板中的孔突出的中心销，由该孔的导电表面形成的外部导体，以及空气电介质。 该电路包括顶部导电层（TCL），具有切口的接地平面以及紧邻引脚的TCL与接地平面之间的绝缘基板。 该转换包括引脚，将中心引脚连接到TCL的导电元件，外部导体，空气电介质，基板与销的邻接以及切口。 基座和切口使针与接地平面之间的距离的制造变化最小化。 该过渡调谐通过将引脚连接到TCL引入的电感。

公开(公告)号：US20160164198A1

公开(公告)日：2016-06-09

申请号：US14559497

申请日：2014-12-03

Applicant: NATIONAL INSTRUMENTS CORPORATION

Inventor： Ivan E. Hammer ,  Ron L. Leidl ,  Andrew C. Fischer ,  Abdolreza Karbassi ,  Tamir E. Moran ,  Gregory S. Gonzales

IPC: H01R9/05 ,  H05K1/18 ,  H01R12/72 ,  H05K3/30

CPC classification number: H05K1/18 ,  H01R12/57 ,  H01R12/722 ,  H01R24/50 ,  H05K1/181 ,  H05K1/182 ,  H05K3/301 ,  H05K2201/09036 ,  H05K2201/10189 ,  Y02P70/611

Abstract: A connector launch configured for attachment to a printed circuit board (PCB). The connector launch may include a first attachment member that is configured for surface mount attachment over at least one trace of the PCB. The at least one trace of the PCB may be configured for coupling to the connector launch. The first attachment member may include a connector receptacle that is configured to receive a first connector of a plurality of possible connectors. The connector launch may further include a connector launch pin that is configured to couple to the at least one trace of the PCB within the first attachment member and extend into the connector receptacle. The connector launch pin may couple to a connector pin of the first connector when the first connector is connected to the connector receptacle.

Abstract translation: 连接器发射器被配置为附接到印刷电路板（PCB）。 连接器发射可以包括被配置为在PCB的至少一个迹线上表面安装附接的第一附接构件。 PCB的至少一个迹线可以被配置为耦合到连接器发射。 第一附接构件可以包括连接器插座，其被配置为接收多个可能的连接器的第一连接器。 连接器发射可以进一步包括连接器发射销，其配置成耦合到第一附接构件内的PCB的至少一个迹线并且延伸到连接器插座中。 当第一连接器连接到连接器插座时，连接器发射销可以耦合到第一连接器的连接器引脚。

公开(公告)号：US09252734B2

公开(公告)日：2016-02-02

申请号：US13772874

申请日：2013-02-21

Applicant: NATIONAL INSTRUMENTS CORPORATION

Inventor： Tamir Moran ,  Gregory S. Gonzales

IPC: H03H5/02 ,  H01R13/7197 ,  H01L23/66 ,  H01L25/16

CPC classification number: H03H5/02 ,  H01L23/66 ,  H01L25/16 ,  H01L2223/6633 ,  H01L2223/665 ,  H01L2223/6683 ,  H01L2224/48091 ,  H01L2224/48229 ,  H01R13/7197 ,  Y10T29/4913 ,  H01L2924/00014

Abstract: In one embodiment, a high frequency module may include a substrate. The substrate may include a first surface and a second surface substantially opposite of the first surface. The high frequency module may include a component coupled to the second surface. A direct current may be provided to the component using the substrate. The high frequency module may include a core coupled to the second surface of the substrate. In some embodiments, the core may include at least one opening extending through the core. The component may be positioned in at least one of the openings. In some embodiments, the high frequency module may include a cover coupled to the core. The component may be positioned in at least one of the openings between the substrate and the cover.

Abstract translation: 在一个实施例中，高频模块可以包括衬底。 衬底可以包括基本上与第一表面相对的第一表面和第二表面。 高频模块可以包括耦合到第二表面的部件。 可以使用衬底向组件提供直流电。 高频模块可以包括耦合到衬底的第二表面的芯。 在一些实施例中，芯可以包括延伸穿过芯的至少一个开口。 部件可以定位在至少一个开口中。 在一些实施例中，高频模块可以包括耦合到芯的盖。 该部件可以位于基板和盖之间的至少一个开口中。

公开(公告)号：US20140059854A1

公开(公告)日：2014-03-06

申请号：US14073084

申请日：2013-11-06

Applicant: NATIONAL INSTRUMENTS CORPORATION

Inventor： Ron J. Barnett ,  Gregory S. Gonzales

IPC: H01R43/26 ,  H01R43/16

CPC classification number: H01R43/26 ,  H01P1/203 ,  H01P1/227 ,  H01R13/2407 ,  H01R31/06 ,  H01R43/16 ,  Y10T29/49117 ,  Y10T29/49174 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49218 ,  Y10T29/49224

Abstract: A connector is disclosed. The connector includes a conductive housing. The conductive housing includes a wall region enclosing a space for receiving an adapter. The conductive housing also includes an annular end piece extending radially inward from a first end of the wall region and terminating the space. The annular end piece includes a flat annular surface, and a raised deformable annulus mounted on the flat annular surface. The raised deformable annulus is of a height such that an insertion of the adapter into the space deforms the raised deformable annulus to generate a physical contact connection between the flat annular surface and the adapter.

Abstract translation: 公开了连接器。 连接器包括导电壳体。 导电壳体包括封闭用于接收适配器的空间的壁区域。 导电壳体还包括从壁区域的第一端径向向内延伸并终止该空间的环形端件。 环形端件包括平坦的环形表面和安装在平坦环形表面上的凸起的可变形环形空间。 凸起的可变形环具有这样的高度，使得适配器插入空间中使升高的可变形环变形，以在平坦的环形表面和适配器之间产生物理接触连接。