公开(公告)号：US08853816B2

公开(公告)日：2014-10-07

申请号：US13705627

申请日：2012-12-05

Applicant: NXP B.V.

Inventor： Peter Gerard Steeneken ,  Roel Daamen ,  Gerard Koops ,  Jan Sonsky ,  Evelyne Gridelet ,  Coenraad Cornelis Tak

IPC: H01L21/70 ,  H01L21/8238 ,  H01L21/762

CPC classification number: H01L21/76232 ,  H01L21/76224 ,  H01L21/823878

Abstract: An isolated semiconductor circuit comprising: a first sub-circuit and a second sub-circuit; a backend that includes an electrically isolating connector between the first and second sub-circuits; a lateral isolating trench between the semiconductor portions of the first and second sub-circuits, wherein the lateral isolating trench extends along the width of the semiconductor portions of the first and second sub-circuits, wherein one end of the isolating trench is adjacent the backend, and wherein the isolating trench is filled with an electrically isolating material.

Abstract translation: 一种隔离半导体电路，包括：第一子电路和第二子电路; 后端，其包括在所述第一和第二子电路之间的电隔离连接器; 在所述第一和第二子电路的半导体部分之间的横向隔离沟槽，其中所述横向隔离沟槽沿着所述第一和第二子电路的半导体部分的宽度延伸，其中所述隔离沟槽的一端与所述后端 ，并且其中所述隔离沟槽填充有电绝缘材料。

公开(公告)号：US09177852B2

公开(公告)日：2015-11-03

申请号：US14449522

申请日：2014-08-01

Applicant: NXP B.V.

Inventor： Peter Gerard Steeneken ,  Roel Daamen ,  Gerard Koops ,  Jan Sonsky ,  Evelyne Gridelet ,  Coenraad Cornelis Tak

IPC: H01L21/70 ,  H01L21/762 ,  H01L21/8238

CPC classification number: H01L21/76232 ,  H01L21/76224 ,  H01L21/823878

Abstract: An isolated semiconductor circuit comprising: a first sub-circuit and a second sub-circuit; a backend that includes an electrically isolating connector between the first and second sub-circuits; a lateral isolating trench between the semiconductor portions of the first and second sub-circuits, wherein the lateral isolating trench extends along the width of the semiconductor portions of the first and second sub-circuits, wherein one end of the isolating trench is adjacent the backend, and wherein the isolating trench is filled with an electrically isolating material.

Abstract translation: 一种隔离半导体电路，包括：第一子电路和第二子电路; 后端，其包括在所述第一和第二子电路之间的电隔离连接器; 在所述第一和第二子电路的半导体部分之间的横向隔离沟槽，其中所述横向隔离沟槽沿着所述第一和第二子电路的半导体部分的宽度延伸，其中所述隔离沟槽的一端与所述后端 ，并且其中所述隔离沟槽填充有电绝缘材料。