SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    2.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE 有权
    半导体器件及制造半导体器件的方法

    公开(公告)号:US20090233411A1

    公开(公告)日:2009-09-17

    申请号:US12472860

    申请日:2009-05-27

    申请人: Atsuhiro Ando

    发明人: Atsuhiro Ando

    IPC分类号: H01L21/336

    摘要: A semiconductor device includes a side wall spacer formed on the side surface of a gate electrode formed on the upper side of a semiconductor substrate with a gate insulation film therebetween, extension regions built up on the semiconductor substrate, and source/drain regions formed on the extension regions, wherein a first epitaxial layer is formed so as to fill up portions, cut out at the time of forming the side wall spacer, of the semiconductor substrate, and the extension regions are formed on the first epitaxial layer from a second epitaxial layer of a conduction type opposite to that of the first epitaxial layer.

    摘要翻译: 半导体器件包括形成在半导体衬底的上侧上的栅电极的侧表面上的侧壁隔离物,其间具有栅极绝缘膜,在半导体衬底上形成的延伸区域和形成在该半导体衬底上的源极/漏极区域 延伸区域,其中形成第一外延层以便填充形成半导体衬底的侧壁间隔物形成时的部分,并且延伸区域从第二外延层形成在第一外延层上 的导电类型与第一外延层的导电类型相反。

    Solid-state imaging device and method for manufacturing the same, and electronic apparatus and camera module
    3.
    发明授权
    Solid-state imaging device and method for manufacturing the same, and electronic apparatus and camera module 有权
    固态成像装置及其制造方法,以及电子装置和相机模块

    公开(公告)号:US08736727B2

    公开(公告)日:2014-05-27

    申请号:US13071703

    申请日:2011-03-25

    申请人: Atsuhiro Ando

    发明人: Atsuhiro Ando

    IPC分类号: H04N3/14

    摘要: A solid-state imaging device includes a photoelectric conversion portion, a charge-receiving portion to which charges are transferred from the photoelectric conversion portion, and a light control film having a reverse tapered opening over the photoelectric conversion portion to reduce the intensity of diffracted light diffusing to regions other than the photoelectric conversion portion.

    摘要翻译: 固态成像装置包括光电转换部分,电荷从光电转换部分转移的电荷接收部分,以及在光电转换部分上具有倒锥形开口的光控制膜,以降低衍射光的强度 扩散到光电转换部以外的区域。

    Semiconductor device and method of manufacturing semiconductor device
    4.
    发明授权
    Semiconductor device and method of manufacturing semiconductor device 有权
    半导体装置及其制造方法

    公开(公告)号:US08012840B2

    公开(公告)日:2011-09-06

    申请号:US12472860

    申请日:2009-05-27

    申请人: Atsuhiro Ando

    发明人: Atsuhiro Ando

    IPC分类号: H01L21/336

    摘要: A semiconductor device includes a side wall spacer formed on the side surface of a gate electrode formed on the upper side of a semiconductor substrate with a gate insulation film therebetween, extension regions built up on the semiconductor substrate, and source/drain regions formed on the extension regions, wherein a first epitaxial layer is formed so as to fill up portions, cut out at the time of forming the side wall spacer, of the semiconductor substrate, and the extension regions are formed on the first epitaxial layer from a second epitaxial layer of a conduction type opposite to that of the first epitaxial layer.

    摘要翻译: 半导体器件包括形成在半导体衬底的上侧上的栅电极的侧表面上的侧壁隔离物,其间具有栅极绝缘膜,在半导体衬底上形成的延伸区域和形成在该半导体衬底上的源极/漏极区域 延伸区域,其中形成第一外延层以便填充形成半导体衬底的侧壁间隔物形成时的部分,并且延伸区域从第二外延层形成在第一外延层上 的导电类型与第一外延层的导电类型相反。

    Semiconductor device and method of manufacturing semiconductor device

    公开(公告)号:US20060192232A1

    公开(公告)日:2006-08-31

    申请号:US11358022

    申请日:2006-02-21

    申请人: Atsuhiro Ando

    发明人: Atsuhiro Ando

    IPC分类号: H01L29/76

    摘要: A semiconductor device includes a side wall spacer formed on the side surface of a gate electrode formed on the upper side of a semiconductor substrate with a gate insulation film therebetween, extension regions built up on the semiconductor substrate, and source/drain regions formed on the extension regions, wherein a first epitaxial layer is formed so as to fill up portions, cut out at the time of forming the side wall spacer, of the semiconductor substrate, and the extension regions are formed on the first epitaxial layer from a second epitaxial layer of a conduction type opposite to that of the first epitaxial layer.

    Semiconductor device and method of manufacturing semiconductor device
    7.
    发明授权
    Semiconductor device and method of manufacturing semiconductor device 有权
    半导体装置及其制造方法

    公开(公告)号:US07557396B2

    公开(公告)日:2009-07-07

    申请号:US11358022

    申请日:2006-02-21

    申请人: Atsuhiro Ando

    发明人: Atsuhiro Ando

    IPC分类号: H01L21/336

    摘要: A semiconductor device includes a side wall spacer formed on the side surface of a gate electrode formed on the upper side of a semiconductor substrate with a gate insulation film therebetween, extension regions built up on the semiconductor substrate, and source/drain regions formed on the extension regions, wherein a first epitaxial layer is formed so as to fill up portions, cut out at the time of forming the side wall spacer, of the semiconductor substrate, and the extension regions are formed on the first epitaxial layer from a second epitaxial layer of a conduction type opposite to that of the first epitaxial layer.

    摘要翻译: 半导体器件包括形成在半导体衬底的上侧上的栅电极的侧表面上的侧壁隔离物,其间具有栅极绝缘膜,在半导体衬底上形成的延伸区域和形成在该半导体衬底上的源极/漏极区域 延伸区域,其中形成第一外延层以便填充形成半导体衬底的侧壁间隔物形成时的部分,并且延伸区域从第二外延层形成在第一外延层上 的导电类型与第一外延层的导电类型相反。