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公开(公告)号：US20180376595A1
公开(公告)日：2018-12-27
申请号：US16118892
申请日：2018-08-31
Applicant: Northrop Grumman Systems Corporation
Inventor： Matthew J. Pirih , Steven J. Mass , Andrew Yurko
Abstract: In an exemplary method, three dimensional printing forms a micro lattice truss structure with a first end formed in contact with a conductive area on a PCB so that the truss structure is adhered to the conductive area due to the three dimensional printing. The truss structure extends outward from the PCB and has a distal end. The truss structure is formed with resiliency so that the truss structure maintains structural integrity during end-to-end compression. The resiliency of the micro lattice truss structure enables the truss structure to return to substantially its uncompressed length when the compression is removed. The truss structure is conductive so that a resilient electrical connection can be formed between the conductive area of the PCB and another spaced apart surface parallel with the PCB when the distal end of the truss structure is in contact with and compressed by the other surface.
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Patent Agency Ranking
公开(公告)号：US12028978B2
公开(公告)日：2024-07-02
申请号：US17397314
申请日：2021-08-09
Applicant: Northrop Grumman Systems Corporation
Inventor： Matthew J. Pirih , Steven J. Mass , Andrew Yurko
CPC classification number: H05K1/144 , B33Y80/00 , H05K3/368 , H05K3/4015 , H05K2201/042 , H05K2201/10265 , H05K2201/10348 , H05K2203/0723 , H05K2203/095 , H05K2203/107
Abstract: An elongate, three dimensional, conductive, micro lattice truss structure has parallel layers of resilient strands so that the truss structure maintains structural integrity during end-to-end compression which shortens its uncompressed length. The resiliency of the micro lattice truss structure enables the truss structure to return to substantially its uncompressed length when the compression is removed. The truss structure is adapted to provide a resilient electrical connection between two opposing conductive areas on parallel spaced-apart printed circuit boards when the distal ends of the truss structure engage and are compressed between the two areas.
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公开(公告)号：US20170215286A1
公开(公告)日：2017-07-27
申请号：US15007743
申请日：2016-01-27
Applicant: Northrop Grumman Systems Corporation
Inventor： Matthew J. Pirih , Steven J. Mass , Andrew Yurko
CPC classification number: H05K1/144 , H05K3/368 , H05K3/4015 , H05K2201/042 , H05K2201/10265 , H05K2201/10348 , H05K2203/0723 , H05K2203/095 , H05K2203/107
Abstract: In an exemplary method, three dimensional printing forms a micro lattice truss structure with a first end formed in contact with a conductive area on a PCB so that the truss structure is adhered to the conductive area due to the three dimensional printing. The truss structure extends outward from the PCB and has a distal end. The truss structure is formed with resiliency so that the truss structure maintains structural integrity during end-to-end compression. The resiliency of the micro lattice truss structure enables the truss structure to return to substantially its uncompressed length when the compression is removed. The truss structure is conductive so that a resilient electrical connection can be formed between the conductive area of the PCB and another spaced apart surface parallel with the PCB when the distal end of the truss structure is in contact with and compressed by the other surface.
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公开(公告)号：US20210368622A1
公开(公告)日：2021-11-25
申请号：US17397314
申请日：2021-08-09
Applicant: Northrop Grumman Systems Corporation
Inventor： Matthew J. Pirih , Steven J. Mass , Andrew Yurko
Abstract: An elongate, three dimensional, conductive, micro lattice truss structure has parallel layers of resilient strands so that the truss structure maintains structural integrity during end-to-end compression which shortens its uncompressed length. The resiliency of the micro lattice truss structure enables the truss structure to return to substantially its uncompressed length when the compression is removed. The truss structure is adapted to provide a resilient electrical connection between two opposing conductive areas on parallel spaced-apart printed circuit boards when the distal ends of the truss structure engage and are compressed between the two areas.
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公开(公告)号：US11129277B2
公开(公告)日：2021-09-21
申请号：US16118892
申请日：2018-08-31
Applicant: Northrop Grumman Systems Corporation
Inventor： Matthew J. Pirih , Steven J. Mass , Andrew Yurko
Abstract: An elongate, three dimensional, conductive, micro lattice truss structure has parallel layers of resilient strands so that the truss structure maintains structural integrity during end-to-end compression which shortens its uncompressed length. The resiliency of the micro lattice truss structure enables the truss structure to return to substantially its uncompressed length when the compression is removed. The truss structure is adapted to provide a resilient electrical connection between two opposing conductive areas when the distal ends of the truss structure engage and are compressed between the two areas.
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公开(公告)号：US10104773B2
公开(公告)日：2018-10-16
申请号：US15007743
申请日：2016-01-27
Applicant: Northrop Grumman Systems Corporation
Inventor： Matthew J. Pirih , Steven J. Mass , Andrew Yurko
Abstract: In an exemplary method, three dimensional printing forms a micro lattice truss structure with a first end formed in contact with a conductive area on a PCB so that the truss structure is adhered to the conductive area due to the three dimensional printing. The truss structure extends outward from the PCB and has a distal end. The truss structure is formed with resiliency so that the truss structure maintains structural integrity during end-to-end compression. The resiliency of the micro lattice truss structure enables the truss structure to return to substantially its uncompressed length when the compression is removed. The truss structure is conductive so that a resilient electrical connection can be formed between the conductive area of the PCB and another spaced apart surface parallel with the PCB when the distal end of the truss structure is in contact with and compressed by the other surface.
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