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公开(公告)号：US20180376595A1
公开(公告)日：2018-12-27
申请号：US16118892
申请日：2018-08-31
Applicant: Northrop Grumman Systems Corporation
Inventor： Matthew J. Pirih , Steven J. Mass , Andrew Yurko
Abstract: In an exemplary method, three dimensional printing forms a micro lattice truss structure with a first end formed in contact with a conductive area on a PCB so that the truss structure is adhered to the conductive area due to the three dimensional printing. The truss structure extends outward from the PCB and has a distal end. The truss structure is formed with resiliency so that the truss structure maintains structural integrity during end-to-end compression. The resiliency of the micro lattice truss structure enables the truss structure to return to substantially its uncompressed length when the compression is removed. The truss structure is conductive so that a resilient electrical connection can be formed between the conductive area of the PCB and another spaced apart surface parallel with the PCB when the distal end of the truss structure is in contact with and compressed by the other surface.
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公开(公告)号：US11264299B1
公开(公告)日：2022-03-01
申请号：US17011382
申请日：2020-09-03
Applicant: NORTHROP GRUMMAN SYSTEMS CORPORATION
Inventor： Jesse Tice , Steven J. Mass , Michael T. Barako
IPC: H01L23/367 , H01L21/02 , H01L23/66 , H01L23/373
Abstract: An integrated circuit assembly including an integrated circuit formed on one side of a substrate and a thermal spreading layer composed of a silver ink directly printed on an opposite side of the substrate from the integrated circuit, where the thermal spreading layer removes heat generated by the integrated circuit. The assembly also includes a heat sink thermally attached to the thermal spreading layer opposite to the substrate, where the heat sink is attached to the thermal spreading layer by printing the same material on the heat sink as the thermal spreading layer and pressing the spreading layer to the heat sink.
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公开(公告)号：US11129277B2
公开(公告)日：2021-09-21
申请号：US16118892
申请日：2018-08-31
Applicant: Northrop Grumman Systems Corporation
Inventor： Matthew J. Pirih , Steven J. Mass , Andrew Yurko
Abstract: An elongate, three dimensional, conductive, micro lattice truss structure has parallel layers of resilient strands so that the truss structure maintains structural integrity during end-to-end compression which shortens its uncompressed length. The resiliency of the micro lattice truss structure enables the truss structure to return to substantially its uncompressed length when the compression is removed. The truss structure is adapted to provide a resilient electrical connection between two opposing conductive areas when the distal ends of the truss structure engage and are compressed between the two areas.
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公开(公告)号：US10104773B2
公开(公告)日：2018-10-16
申请号：US15007743
申请日：2016-01-27
Applicant: Northrop Grumman Systems Corporation
Inventor： Matthew J. Pirih , Steven J. Mass , Andrew Yurko
Abstract: In an exemplary method, three dimensional printing forms a micro lattice truss structure with a first end formed in contact with a conductive area on a PCB so that the truss structure is adhered to the conductive area due to the three dimensional printing. The truss structure extends outward from the PCB and has a distal end. The truss structure is formed with resiliency so that the truss structure maintains structural integrity during end-to-end compression. The resiliency of the micro lattice truss structure enables the truss structure to return to substantially its uncompressed length when the compression is removed. The truss structure is conductive so that a resilient electrical connection can be formed between the conductive area of the PCB and another spaced apart surface parallel with the PCB when the distal end of the truss structure is in contact with and compressed by the other surface.
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公开(公告)号：US12028978B2
公开(公告)日：2024-07-02
申请号：US17397314
申请日：2021-08-09
Applicant: Northrop Grumman Systems Corporation
Inventor： Matthew J. Pirih , Steven J. Mass , Andrew Yurko
CPC classification number: H05K1/144 , B33Y80/00 , H05K3/368 , H05K3/4015 , H05K2201/042 , H05K2201/10265 , H05K2201/10348 , H05K2203/0723 , H05K2203/095 , H05K2203/107
Abstract: An elongate, three dimensional, conductive, micro lattice truss structure has parallel layers of resilient strands so that the truss structure maintains structural integrity during end-to-end compression which shortens its uncompressed length. The resiliency of the micro lattice truss structure enables the truss structure to return to substantially its uncompressed length when the compression is removed. The truss structure is adapted to provide a resilient electrical connection between two opposing conductive areas on parallel spaced-apart printed circuit boards when the distal ends of the truss structure engage and are compressed between the two areas.
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Patent Agency Ranking
公开(公告)号：US20220068752A1
公开(公告)日：2022-03-03
申请号：US17011382
申请日：2020-09-03
Applicant: NORTHROP GRUMMAN SYSTEMS CORPORATION
Inventor： Jesse Tice , Steven J. Mass , Michael T. Barako
IPC: H01L23/367 , H01L21/02 , H01L23/66 , H01L23/373
Abstract: An integrated circuit assembly including an integrated circuit formed on one side of a substrate and a thermal spreading layer composed of a silver ink directly printed on an opposite side of the substrate from the integrated circuit, where the thermal spreading layer removes heat generated by the integrated circuit. The assembly also includes a heat sink thermally attached to the thermal spreading layer opposite to the substrate, where the heat sink is attached to the thermal spreading layer by printing the same material on the heat sink as the thermal spreading layer and pressing the spreading layer to the heat sink.
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公开(公告)号：US20190081381A1
公开(公告)日：2019-03-14
申请号：US16149672
申请日：2018-10-02
Applicant: Northrop Grumman Systems Corporation
Inventor： Steven J. Mass , Anthony L. Long , Mansoor K. Siddiqui , Marijan D. Grgas , Gershon Akerling
Abstract: A method of making an electrical structure having a foam housing is set forth. The foam housing includes an interior surface forming a conductive cavity adapted to carry energized waveforms therethrough. An electrical component of the electrical structure is integrally formed with the interior surface as the foam housing of the structure is assembled. The method includes the steps of depositing a plating material into a mold, pouring a foam polymer into the mold and removing the plated foam structure from the mold without etching the section from the mold. The method further includes steps of forming a metallic form into a planar structure, filling the open pores of the foam with a material such as photo-resist, machining a cavity from the foam, electroplating the cavity in the foam then removing the photo-resist material.
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公开(公告)号：US20210368622A1
公开(公告)日：2021-11-25
申请号：US17397314
申请日：2021-08-09
Applicant: Northrop Grumman Systems Corporation
Inventor： Matthew J. Pirih , Steven J. Mass , Andrew Yurko
Abstract: An elongate, three dimensional, conductive, micro lattice truss structure has parallel layers of resilient strands so that the truss structure maintains structural integrity during end-to-end compression which shortens its uncompressed length. The resiliency of the micro lattice truss structure enables the truss structure to return to substantially its uncompressed length when the compression is removed. The truss structure is adapted to provide a resilient electrical connection between two opposing conductive areas on parallel spaced-apart printed circuit boards when the distal ends of the truss structure engage and are compressed between the two areas.
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公开(公告)号：US11056760B2
公开(公告)日：2021-07-06
申请号：US16149672
申请日：2018-10-02
Applicant: Northrop Grumman Systems Corporation
Inventor： Steven J. Mass , Anthony L. Long , Mansoor K. Siddiqui , Marijan D. Grgas , Gershon Akerling
Abstract: A method of making an electrical structure having a foam housing is set forth. The foam housing includes an interior surface forming a conductive cavity adapted to carry energized waveforms therethrough. An electrical component of the electrical structure is integrally formed with the interior surface as the foam housing of the structure is assembled. The method includes the steps of depositing a plating material into a mold, pouring a foam polymer into the mold and removing the plated foam structure from the mold without etching the section from the mold. The method further includes steps of forming a metallic form into a planar structure, filling the open pores of the foam with a material such as photo-resist, machining a cavity from the foam, electroplating the cavity in the foam then removing the photo-resist material.
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公开(公告)号：US20160149286A1
公开(公告)日：2016-05-26
申请号：US15013551
申请日：2016-02-02
Applicant: Northrop Grumman Systems Corporation
Inventor： Steven J. Mass , Anthony L. Long , Mansoor K. Siddiqui , Marijan D. Grgas , Gershon Akerling
IPC: H01P11/00
CPC classification number: H01P11/006 , C04B35/6269 , H01B3/30 , H01P3/06 , H01P3/08 , H01P3/087 , H01P3/12 , H01P3/121 , H01P11/001 , H01P11/002 , Y10T29/49016 , Y10T29/49018
Abstract: A method of making an electrical structure having a foam housing is set forth. The foam housing includes an interior surface forming a conductive cavity adapted to carry energized waveforms therethrough. An electrical component of the electrical structure is integrally formed with the interior surface as the foam housing of the structure is assembled. The method includes the steps of depositing a plating material into a mold, pouring a foam polymer into the mold and removing the plated foam structure from the mold without etching the section from the mold. The method further includes steps of forming a metallic form into a planar structure, filling the open pores of the foam with a material such as photo-resist, machining a cavity from the foam, electroplating the cavity in the foam then removing the photo-resist material.
Abstract translation: 阐述了制造具有泡沫外壳的电气结构的方法。 泡沫壳体包括形成适于承载通电波形的导电腔的内表面。 当结构的泡沫壳体组装时，电气结构的电气部件与内表面一体地形成。 该方法包括以下步骤：将电镀材料沉积到模具中，将泡沫聚合物注入模具中，并从模具中除去镀覆的泡沫结构物，而不从模具中蚀刻该部分。 该方法还包括以下步骤：将金属形式形成平面结构，用诸如光致抗蚀剂的材料填充泡沫的开孔，从泡沫中加工空腔，将泡沫中的空腔电镀，然后除去光致抗蚀剂 材料。
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