公开(公告)号：US20170172389A1

公开(公告)日：2017-06-22

申请号：US15449627

申请日：2017-03-03

Applicant: OLYMPUS CORPORATION

Inventor： Ken FUJISAKI ,  Hiroyuki ARAKI ,  Kazuhiro YOSHIDA

IPC: A61B1/00 ,  A61B1/05 ,  A61B1/015 ,  A61B1/07 ,  A61B17/24 ,  A61B1/233

Abstract: An endoscopic treatment instrument includes a guide sheath. The guide sheath includes a second distal end, which has an inside diameter to insert the insertion portion therethrough so that the distal end of the insertion portion is configured to protrude relative to the second distal end. The guide sheath is inserted through the guide pipe so that the second distal end is configured to protrude relative to the first distal end of the guide pipe.

公开(公告)号：US20200054190A1

公开(公告)日：2020-02-20

申请号：US16662599

申请日：2019-10-24

Applicant: OLYMPUS CORPORATION

Inventor： Kazuhiro YOSHIDA

IPC: A61B1/00 ,  G06T7/00 ,  A61B1/05 ,  H01L25/065

Abstract: An endoscope includes an image pickup apparatus, and the image pickup apparatus includes an imager includes an external electrode, a stacked device, a top electrode on a top surface, and a bottom electrode on a bottom surface, a three-dimensional wiring board having a first zone to which the external electrode is bonded, a second zone to which the top electrode or the bottom electrode is bonded, a third zone to which the top electrode or the bottom electrode is bonded, and a fifth zone arranged on a side surface of the stacked device, wherein the top surface, the bottom surface, and at least two side surfaces of the stacked device are covered with the wiring board.

公开(公告)号：US20170317130A1

公开(公告)日：2017-11-02

申请号：US15652833

申请日：2017-07-18

Applicant: OLYMPUS CORPORATION

Inventor： Kazuhiro YOSHIDA

IPC: H01L27/146 ,  A61B1/005 ,  A61B1/00 ,  A61B1/05

Abstract: An image pickup apparatus includes a silicon layer, a wire layer that contains an insulator having a lower dielectric constant than silicon oxide, a cover glass that covers a light receiving portion on a light receiving surface of the silicon layer, and a silicon substrate that covers a back surface of the wire layer, in which a guard ring is formed along an outer edge on the wire layer, a through-hole having a bottom surface that is configured by an electrode pad configured by a conductor of the wire layer and having an outer periphery portion in contact with the silicon layer over a whole periphery is provided in a region of the silicon layer that is not covered with the cover glass, and the insulator of the wire layer is not exposed to an inner surface of the through-hole.

公开(公告)号：US20170273707A1

公开(公告)日：2017-09-28

申请号：US15082625

申请日：2016-03-28

Applicant: OLYMPUS CORPORATION

Inventor： Takamitsu SAKAMOTO ,  Chie ONUMA ,  Ken FUJISAKI ,  Kiichiro SAWADA ,  Kazuhiro YOSHIDA ,  Satoshi TAKEKOSHI ,  Sohei UEDA ,  Yasuo TANIGAMI

IPC: A61B17/32 ,  A61B1/00 ,  A61B1/04 ,  A61B1/317 ,  A61B1/06

CPC classification number: A61B17/320016 ,  A61B1/00087 ,  A61B1/043 ,  A61B1/0638 ,  A61B1/0646 ,  A61B1/0661 ,  A61B1/317 ,  A61B17/16 ,  A61B17/1659 ,  A61B17/320068 ,  A61B2017/320075 ,  A61B2017/320082

Abstract: An arthroscopical surgical method using an ultrasonic treatment device for a joint includes: transmitting ultrasonic vibration to a treatment portion of the ultrasonic treatment device, removing an injured region of an articular cartilage so that a subchondral bone is exposed, and forming a cartilage edge which is nearly angled at 90° with the exposed surface of the subchondral bone to form a pool-shaped depression; forming a hole which pierces up to a cancellous bone of the subchondral bone through the depression, and scratching blood vessels in the cancellous bone; causing bleeding from the blood vessels so that blood is retained in the depression via the hole.

公开(公告)号：US20150228678A1

公开(公告)日：2015-08-13

申请号：US14691920

申请日：2015-04-21

Applicant: OLYMPUS CORPORATION

Inventor： Kazuhiro YOSHIDA ,  Takashi NAKAYAMA

IPC: H01L27/146 ,  A61B1/00 ,  A61B1/05

CPC classification number: H01L27/1464 ,  A61B1/00071 ,  A61B1/0011 ,  A61B1/05 ,  A61B1/051 ,  A61B1/128 ,  H01L27/14636 ,  H01L27/14683 ,  H04N5/2253 ,  H04N2005/2255

Abstract: An image pickup apparatus includes: an image pickup device chip that has junction terminals, which is connected with an image pickup unit, on a reverse surface; a cable having lead wires connected with the image pickup unit; and a wiring board that includes junction electrodes joined to the junction terminals, terminal electrodes connected with the lead wires, wirings that connect the junction electrodes formed at a central portion and the terminal electrodes formed at extending portions, and a heat transmission pattern formed in a region where the junction electrodes, the terminal electrodes and the wirings are not formed, the extending portions being bent and thereby the wiring board being arranged within a projected plane of the image pickup device chip.

Abstract translation: 图像拾取装置包括：在反面上具有与图像拾取单元连接的接合端子的图像拾取器件芯片; 具有与图像拾取单元连接的引线的电缆; 以及布线板，其包括接合到接线端子的接合电极，与引线连接的端子电极，连接形成在中心部分的接合电极的布线和形成在延伸部分的端子电极的布线，以及形成在引线 没有形成接合电极，端子电极和布线的区域，延伸部分被弯曲，从而布线板被布置在图像拾取器件芯片的投影平面内。

公开(公告)号：US20190175003A1

公开(公告)日：2019-06-13

申请号：US16276873

申请日：2019-02-15

Applicant: OLYMPUS CORPORATION

Inventor： Kazuhiro YOSHIDA ,  Kensuke SUGA

IPC: A61B1/05 ,  A61B1/00 ,  A61B1/045

Abstract: An image pickup unit for endoscope includes: an image pickup portion having a rectangular parallelepiped shape on which a plurality of semiconductor devices including a first semiconductor device and a second semiconductor device are stacked, the image pickup portion including an image pickup device, a device stack bonded to a rear surface of the image pickup device, and a reinforcing member formed by resin covering an outer peripheral surface of the device stack; and a signal cable connected to the image pickup portion, in which: the first semiconductor device on a rear end side is smaller than the second semiconductor device on an image pickup device side; and the reinforcing member has a thickness on the rear end side that is thicker than a thickness on the image pickup device side.

公开(公告)号：US20150085094A1

公开(公告)日：2015-03-26

申请号：US14556831

申请日：2014-12-01

Applicant: OLYMPUS CORPORATION

Inventor： Noriyuki FUJIMORI ,  Takatoshi IGARASHI ,  Kazuhiro YOSHIDA

IPC: H01L27/146 ,  H01L23/31 ,  H01L23/00 ,  H04N5/369

CPC classification number: H01L27/14636 ,  H01L23/3114 ,  H01L24/32 ,  H01L25/042 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/32225 ,  H01L2924/0002 ,  H01L2924/12042 ,  H04N5/369 ,  H01L2924/00

Abstract: An image pickup apparatus includes: an image pickup chip including a light receiving section and electrode pads, on a first main face, and a plurality of connection electrodes, each of which is connected to each of the electrode pads via each of a plurality of through-hole interconnections, on a second main face; a transparent cover glass having a larger plan-view dimension than the image pickup chip; a transparent adhesive layer that bonds the first main face of the image pickup chip and the cover glass; and a sealing member that covers a side face of the image pickup chip and a side face of the adhesive layer, and is made of an insulating material having a same plan-view dimension as the cover glass.

Abstract translation: 一种图像拾取装置包括：图像拾取芯片，包括在第一主面上的光接收部分和电极焊盘以及多个连接电极，每个连接电极通过多个通孔中的每一个连接到每个电极焊盘 在第二主面上的孔互连; 具有比图像拾取芯片更大的平面视图尺寸的透明盖玻璃; 将图像拾取芯片的第一主面和盖玻璃接合的透明粘合剂层; 以及覆盖图像拾取芯片的侧面和粘合剂层的侧面的密封构件，并且由具有与盖玻璃相同的平面尺寸的绝缘材料制成。

公开(公告)号：US20200344386A1

公开(公告)日：2020-10-29

申请号：US16924280

申请日：2020-07-09

Applicant: OLYMPUS CORPORATION

Inventor： Ken YAMAMOTO ,  Takatoshi IGARASHI ,  Takuro SUYAMA ,  Kazuhiro YOSHIDA ,  Kensuke SUGA

IPC: H04N5/225 ,  G02B23/24 ,  H01L27/146 ,  A61B1/00 ,  A61B1/05

Abstract: An image pickup apparatus disposed in an endoscope includes an optical unit in which a plurality of optical members are stacked, an image pickup unit including an image pickup device and a plurality of semiconductor devices, mold resin covering the optical unit and the image pickup unit, and a wiring board bonded to the image pickup unit, in which a recess is provided on an outer peripheral surface of the mold resin.

公开(公告)号：US20180296076A1

公开(公告)日：2018-10-18

申请号：US15960766

申请日：2018-04-24

Applicant: OLYMPUS CORPORATION

Inventor： Kazuhiro YOSHIDA

IPC: A61B1/00 ,  A61B1/05 ,  A61B1/12

Abstract: An imaging apparatus includes: a lens unit in which a plurality of optical elements including one or more wafer-level lenses and a spacer are laminated; an imaging element configured to receive light incident from the lens unit, perform photoelectric conversion on the light, and generate an image signal; and a moisture-proof member that is bent and arranged so as to come in contact with at least a part of side surfaces of the lens unit to prevent moisture from entering a gap between the optical element and the spacer and/or a gap between the optical elements.

公开(公告)号：US20170273709A1

公开(公告)日：2017-09-28

申请号：US15094131

申请日：2016-04-08

Applicant: OLYMPUS CORPORATION

Inventor： Takamitsu SAKAMOTO ,  Chie ONUMA ,  Ken FUJISAKI ,  Kiichiro SAWADA ,  Kazuhiro YOSHIDA ,  Satoshi TAKEKOSHI ,  Sohei UEDA ,  Yasuo TANIGAMI

IPC: A61B17/32 ,  A61B17/00

CPC classification number: A61B17/320068 ,  A61B17/00234 ,  A61B17/32002 ,  A61B2017/320072 ,  A61B2217/007

Abstract: In an arthroendoscopical surgical method, a resection target area, which is emphasized by fluorescence with use of a fluorescent agent under excitation light, is identified on a meniscus, and a resection line or an imaginary resection line is drawn. Using an ultrasonic treatment tool and an arthroscope, the resection target area is resected by a probe which generates ultrasonic vibrations, based on the resection line or imaginary resection line under visible-light illumination, and an inclined resection surface is formed.