公开(公告)号：US20210382250A1

公开(公告)日：2021-12-09

申请号：US17411710

申请日：2021-08-25

Applicant: OLYMPUS CORPORATION

Inventor： Takashi NAKAYAMA

IPC: G02B6/42 ,  G02B23/26 ,  H04N5/225

Abstract: A manufacturing method for an image pickup apparatus for endoscope includes forming a plurality of insertion holes in a first wafer and forming, in a second wafer, a plurality of through-holes including guide surfaces, bonding the first wafer and the second wafer to produce a bonded wafer, cutting the bonded wafer to thereby produce ferrules to which guide members are bonded, and mounting an optical element on each of the ferrules and fixing optical fibers with resin in a state in which the optical fibers are inserted into the insertion holes by passing through the guide members.

公开(公告)号：US20180041666A1

公开(公告)日：2018-02-08

申请号：US15786093

申请日：2017-10-17

Applicant: OLYMPUS CORPORATION

Inventor： Takashi NAKAYAMA

IPC: H04N5/225 ,  H01L29/423 ,  H01L27/146 ,  H01L27/14 ,  H04N7/18

CPC classification number: H04N5/225 ,  A61B1/00002 ,  A61B1/05 ,  H01L24/85 ,  H01L27/14 ,  H01L27/146 ,  H01L29/42396 ,  H01L2224/49175 ,  H04N5/2251 ,  H04N7/183 ,  H04N2005/2255

Abstract: An image pickup apparatus includes: an image pickup device including a light receiving surface, an opposite surface, and an inclined surface inclined at a first angle, and provided with light receiving surface electrodes on the light receiving surface; a cover glass; and a wiring board including a first main surface and a second main surface, and including wires each connected with each of the light receiving surface electrodes, back surfaces of the light receiving surface electrodes are exposed to a side of the opposite surface, distal end portions of the wires are flying leads bent at a second angle in a relation of a supplementary angle to the first angle and connected with the light receiving surface electrodes, and the second main surface at a distal end portion of the wiring board is directly fixed to the opposite surface arranged in parallel with the second main surface.

公开(公告)号：US20150228678A1

公开(公告)日：2015-08-13

申请号：US14691920

申请日：2015-04-21

Applicant: OLYMPUS CORPORATION

Inventor： Kazuhiro YOSHIDA ,  Takashi NAKAYAMA

IPC: H01L27/146 ,  A61B1/00 ,  A61B1/05

CPC classification number: H01L27/1464 ,  A61B1/00071 ,  A61B1/0011 ,  A61B1/05 ,  A61B1/051 ,  A61B1/128 ,  H01L27/14636 ,  H01L27/14683 ,  H04N5/2253 ,  H04N2005/2255

Abstract: An image pickup apparatus includes: an image pickup device chip that has junction terminals, which is connected with an image pickup unit, on a reverse surface; a cable having lead wires connected with the image pickup unit; and a wiring board that includes junction electrodes joined to the junction terminals, terminal electrodes connected with the lead wires, wirings that connect the junction electrodes formed at a central portion and the terminal electrodes formed at extending portions, and a heat transmission pattern formed in a region where the junction electrodes, the terminal electrodes and the wirings are not formed, the extending portions being bent and thereby the wiring board being arranged within a projected plane of the image pickup device chip.

Abstract translation: 图像拾取装置包括：在反面上具有与图像拾取单元连接的接合端子的图像拾取器件芯片; 具有与图像拾取单元连接的引线的电缆; 以及布线板，其包括接合到接线端子的接合电极，与引线连接的端子电极，连接形成在中心部分的接合电极的布线和形成在延伸部分的端子电极的布线，以及形成在引线 没有形成接合电极，端子电极和布线的区域，延伸部分被弯曲，从而布线板被布置在图像拾取器件芯片的投影平面内。

公开(公告)号：US20190273110A1

公开(公告)日：2019-09-05

申请号：US16411693

申请日：2019-05-14

Applicant: OLYMPUS CORPORATION

Inventor： Takashi NAKAYAMA

IPC: H01L27/146 ,  H01L23/00 ,  A61B1/00 ,  A61B1/05

Abstract: A device-bonded body includes: a first device where a plated bump is disposed; a second device where a bonding electrode bonded to the plated bump is disposed; and a sealing layer made of NCF or NCP, the sealing layer being disposed between the first device and the second device and including filler particles made of inorganic material; wherein a surface of the plated bump includes a first area and a second area higher than the first area; and at least a part of a side surface of an outer circumferential portion of the second area intersects with a surface of the first area.

公开(公告)号：US20180040659A1

公开(公告)日：2018-02-08

申请号：US15783616

申请日：2017-10-13

Applicant: OLYMPUS CORPORATION

Inventor： Takashi NAKAYAMA

IPC: H01L27/146 ,  H01L23/00 ,  H04N5/225

CPC classification number: H01L27/14636 ,  H01L24/02 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L27/14 ,  H01L2224/02371 ,  H01L2224/02372 ,  H01L2224/02373 ,  H01L2224/02375 ,  H01L2224/02377 ,  H01L2224/02381 ,  H01L2224/13024 ,  H01L2224/14131 ,  H01L2224/14153 ,  H01L2224/16227 ,  H01L2224/17517 ,  H04N5/2253 ,  H04N5/2257

Abstract: An image pickup apparatus includes: an image pickup device including a light receiving surface, an opposite surface, and an inclined surface, and provided with light receiving surface electrodes formed on the light receiving surface; cover glass joined so as to cover the light receiving surface; and a wiring board including second bond electrodes, wherein back surfaces of the light receiving surface electrodes being exposed to an opposite surface side, extended wiring patterns extended from the respective back surfaces of the light receiving surface electrodes through the inclined surface to the opposite surface, each of the extended wiring patterns including a first bond electrode, and the first bond electrode and the second bond electrode being bonded through a bump.

公开(公告)号：US20140264697A1

公开(公告)日：2014-09-18

申请号：US14291178

申请日：2014-05-30

Applicant: OLYMPUS CORPORATION

Inventor： Takashi NAKAYAMA

IPC: H01L31/02

CPC classification number: H01L31/02005 ,  G02B7/02 ,  H01L27/14618 ,  H01L27/1469 ,  H01L2924/0002 ,  H04N5/2253 ,  H04N5/2257 ,  H01L2924/00

Abstract: An image pickup module includes: a wiring board including a first main surface on which chip electrodes are disposed and a second main surface on which the cable electrodes connected respectively to the chip electrodes via respective through wirings are disposed; an image pickup device chip including external electrodes bonded respectively to the chip electrodes; and a cable including conductive wires bonded respectively to the cable electrodes, in which all of the cable electrodes are disposed in a region not facing a region where the chip electrodes are disposed.

Abstract translation: 图像拾取模块包括：布线板，其包括设置有芯片电极的第一主表面和分别通过布线连接到芯片电极的电缆电极的第二主表面; 图像拾取器件芯片，包括分别与芯片电极结合的外部电极; 以及包括分别粘合到电缆电极的导线的电缆，其中所有电缆电极设置在不面向设置芯片电极的区域的区域中。