公开(公告)号：US20150054106A1

公开(公告)日：2015-02-26

申请号：US14528991

申请日：2014-10-30

Applicant: OMNIVISION TECHNOLOGIES, INC.

Inventor： Gang Chen ,  Ashish Shah ,  Duli Mao ,  Hsin-Chih Tai ,  Howard E. Rhodes

IPC: H01L27/146

CPC classification number: H01L27/14645 ,  H01L27/14605 ,  H01L27/1462 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/1469

Abstract: Embodiments of the invention relate to a camera assembly including a rear-facing camera and a front-facing camera operatively coupled together (e.g., bonded, stacked on a common substrate).In some embodiments of the invention, a system having an array of frontside illuminated (FSI) imaging pixels is bonded to a system having an array of backside illuminated (BSI) imaging pixels, creating a camera assembly with a minimal size (e.g., a reduced thickness compared to prior art solutions). An FSI image sensor wafer may be used as a handle wafer for a BSI image sensor wafer when it is thinned, thereby decreasing the thickness of the overall camera module. According to other embodiments of the invention, two package dies, one a BSI image sensor, the other an FSI image sensor, are stacked on a common substrate such as a printed circuit board, and are operatively coupled together via redistribution layers.

Abstract translation: 本发明的实施例涉及一种照相机组件，其包括背面照相机和可操作地耦合在一起的例如相机（例如，粘合的，堆叠在公共衬底上）的前置照相机。 在本发明的一些实施例中，具有前侧照明（FSI）成像像素阵列的系统被结合到具有背面照明（BSI）成像像素阵列的系统，从而产生具有最小尺寸的照相机组件（例如，减小的 厚度与现有技术的解决方案相比）。 可以使用FSI图像传感器晶片作为BSI图像传感器晶片的处理晶片，当其变薄时，从而减小整个相机模块的厚度。 根据本发明的其它实施例，两个封装管芯，一个BSI图像传感器，另一个是FSI图像传感器，堆叠在诸如印刷电路板的公共基板上，并且通过再分配层可操作地耦合在一起。

公开(公告)号：US08900912B2

公开(公告)日：2014-12-02

申请号：US13927495

申请日：2013-06-26

Applicant: Omnivision Technologies, Inc.

Inventor： Gang Chen ,  Ashish Shah ,  Duli Mao ,  Hsin-Chih Tai ,  Howard E. Rhodes

IPC: H01L21/00 ,  H01L27/146

CPC classification number: H01L27/14645 ,  H01L27/14605 ,  H01L27/1462 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/1469

Abstract: Embodiments of the invention relate to a camera assembly including a rear-facing camera and a front-facing camera operatively coupled together (e.g., bonded, stacked on a common substrate).In some embodiments of the invention, a system having an array of frontside illuminated (FSI) imaging pixels is bonded to a system having an array of backside illuminated (BSI) imaging pixels, creating a camera assembly with a minimal size (e.g., a reduced thickness compared to prior art solutions). An FSI image sensor wafer may be used as a handle wafer for a BSI image sensor wafer when it is thinned, thereby decreasing the thickness of the overall camera module. According to other embodiments of the invention, two package dies, one a BSI image sensor, the other an FSI image sensor, are stacked on a common substrate such as a printed circuit board, and are operatively coupled together via redistribution layers.

Abstract translation: 本发明的实施例涉及一种照相机组件，其包括背面照相机和可操作地耦合在一起的例如相机（例如，粘合的，堆叠在公共衬底上）的前置照相机。 在本发明的一些实施例中，具有前侧照明（FSI）成像像素阵列的系统被结合到具有背面照明（BSI）成像像素阵列的系统，从而产生具有最小尺寸的照相机组件（例如，减小的 厚度与现有技术的解决方案相比）。 可以使用FSI图像传感器晶片作为BSI图像传感器晶片的处理晶片，当其变薄时，从而减小整个相机模块的厚度。 根据本发明的其它实施例，两个封装管芯，一个BSI图像传感器，另一个是FSI图像传感器，堆叠在诸如印刷电路板的公共基板上，并且通过再分配层可操作地耦合在一起。

公开(公告)号：US20130285183A1

公开(公告)日：2013-10-31

申请号：US13927495

申请日：2013-06-26

Applicant: OMNIVISION TECHNOLOGIES, INC.

Inventor： Gang Chen ,  Ashish Shah ,  Duli Mao ,  Hsin-Chih Tai ,  Howard E. Rhodes

IPC: H01L27/146

CPC classification number: H01L27/14645 ,  H01L27/14605 ,  H01L27/1462 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/1469

Abstract: Embodiments of the invention relate to a camera assembly including a rear-facing camera and a front-facing camera operatively coupled together (e.g., bonded, stacked on a common substrate).In some embodiments of the invention, a system having an array of frontside illuminated (FSI) imaging pixels is bonded to a system having an array of backside illuminated (BSI) imaging pixels, creating a camera assembly with a minimal size (e.g., a reduced thickness compared to prior art solutions). An FSI image sensor wafer may be used as a handle wafer for a BSI image sensor wafer when it is thinned, thereby decreasing the thickness of the overall camera module. According to other embodiments of the invention, two package dies, one a BSI image sensor, the other an FSI image sensor, are stacked on a common substrate such as a printed circuit board, and are operatively coupled together via redistribution layers.

公开(公告)号：US09305962B2

公开(公告)日：2016-04-05

申请号：US14528991

申请日：2014-10-30

Applicant: OMNIVISION TECHNOLOGIES, INC.

Inventor： Gang Chen ,  Ashish Shah ,  Duli Mao ,  Hsin-Chih Tai ,  Howard E. Rhodes

IPC: H01L31/062 ,  H01L31/113 ,  H01L27/146

CPC classification number: H01L27/14645 ,  H01L27/14605 ,  H01L27/1462 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/1469

Abstract: Embodiments of the invention relate to a camera assembly including a rear-facing camera and a front-facing camera operatively coupled together (e.g., bonded, stacked on a common substrate). In some embodiments of the invention, a system having an array of frontside illuminated (FSI) imaging pixels is bonded to a system having an array of backside illuminated (BSI) imaging pixels, creating a camera assembly with a minimal size (e.g., a reduced thickness compared to prior art solutions). An FSI image sensor wafer may be used as a handle wafer for a BSI image sensor wafer when it is thinned, thereby decreasing the thickness of the overall camera module. According to other embodiments of the invention, two package dies, one a BSI image sensor, the other an FSI image sensor, are stacked on a common substrate such as a printed circuit board, and are operatively coupled together via redistribution layers.