公开(公告)号：US20150028754A1

公开(公告)日：2015-01-29

申请号：US14373063

申请日：2013-01-21

Applicant: OSRAM SYLVANIA Inc.

Inventor： Bernhard Siessegger ,  Norwin von Malm ,  Phil Moskowitz ,  Warren Moskowitz

IPC: H05B33/08 ,  H01L33/62 ,  H01L27/15

CPC classification number: H02M7/06 ,  G01R31/028 ,  G01R31/2635 ,  G01R31/40 ,  G01R31/44 ,  H01L25/0753 ,  H01L25/167 ,  H01L27/156 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2924/12032 ,  H01L2924/12044 ,  H01L2924/1301 ,  H01L2924/13033 ,  H01L2924/1305 ,  H01L2924/13091 ,  H02M1/4258 ,  H02M3/335 ,  H05B33/0806 ,  H05B33/0812 ,  H05B33/0815 ,  H05B33/0821 ,  H05B33/083 ,  H05B33/0845 ,  H05B33/086 ,  H05B33/0893 ,  Y02B20/343 ,  Y02B20/345 ,  Y02B20/346 ,  Y02B20/347 ,  Y10T307/615 ,  H01L2924/00014 ,  H01L2924/00

Abstract: LED devices are provided that include LED chips on LED chip carriers. The LED device can in turn be housed in a package, such as a small-outline transistor (SOT) package or a radial LED device package. A single LED device or a serial connection of a plurality of such LED devices can be operated directly from an AC (line) voltage or a rectified version thereof. In some example embodiments, switching circuitry is integrated into the LED chip carrier for controlling current flow through the LED(s) in response to, for example, a brightness regulating control signal. Numerous example embodiments of the monolithic LED devices are provided, including manufacturing processes as well as various example packages for such LED devices.

Abstract translation: 提供LED器件，其中包括LED芯片载体上的LED芯片。 LED器件又可以容纳在诸如小外形晶体管（SOT）封装或径向LED器件封装的封装中。 可以直接从AC（线路）电压或其整流版本操作多个这样的LED器件的单个LED器件或串联连接。 在一些示例性实施例中，开关电路集成到LED芯片载体中，以响应于例如亮度调节控制信号来控制通过LED的电流。 提供了单片LED器件的许多示例实施例，包括制造工艺以及用于这种LED器件的各种示例封装。