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公开(公告)号：US10651353B2
公开(公告)日：2020-05-12
申请号：US15868952
申请日：2018-01-11
Inventor： Takuya Senuki , Toshiya Fukudome , Shigeo Hayashi
IPC: H01L33/54 , H01L33/60 , H01L25/16 , H01L25/075 , H01L33/50
Abstract: A light-emitting device includes a light-emitting element disposed on a mount substrate, a reflective member disposed around the light-emitting element to cover the light-emitting element, and a dam disposed on opposite sides of the reflective member. The dam includes a resin dam, and a surface layer covering at least part of a surface of the resin dam. The inner lateral surface of the resin dam facing the light-emitting element is covered with the surface layer, and at least part of the outer lateral surface of the resin dam not facing the light-emitting element is an exposed surface.
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公开(公告)号：US10546988B2
公开(公告)日：2020-01-28
申请号：US15886543
申请日：2018-02-01
Inventor： Masahiro Hayashi , Tetsuya Kamada , Takashi Kuwaharada , Kiyomi Hagihara , Toshikazu Shimokatano , Shigeo Hayashi , Hiroki Shirozono , Hideaki Usukubo
Abstract: A light emitting device includes a light emitting element; a sub-mount including a sub-mount substrate with a front surface on which the light emitting element is disposed, and a back surface electrode disposed in a back surface that is on a back side of the front surface of the sub-mount substrate; a main-mount in which the sub-mount is disposed, the main-mount including a front surface metal pattern including a wiring electrode bonded to the back surface electrode via solder. The front surface metal pattern has a slit, in a plan view, at a position away from a disposition region in which the sub-mount is disposed.
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公开(公告)号：US10355180B2
公开(公告)日：2019-07-16
申请号：US15874422
申请日：2018-01-18
Inventor： Tooru Aoyagi , Shigeo Hayashi
Abstract: A light emitting device including: a light emitting element including a growth substrate and a semiconductor layer located below the growth substrate; a light transmissive member disposed above a top surface of the light emitting element; and a transparent resin bonding the top surface and a bottom surface of the light transmissive member, wherein the bottom surface encompasses the top surface, the transparent resin continuously covers the bottom surface and a side surface of the semiconductor layer. The transparent resin is disposed to cover a covered portion located at a central portion of the semiconductor layer and to expose an exposed portion located at a side edge portion of the semiconductor layer in a direction parallel to the top surface in a side view, and covers the side surface of the semiconductor layer so that at least 20% in length of the semiconductor layer in the direction is covered.
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公开(公告)号：US11181245B2
公开(公告)日：2021-11-23
申请号：US16790594
申请日：2020-02-13
Inventor： Ryota Yuge , Shigeo Hayashi , Tooru Aoyagi , Tetsuya Kamada
IPC: F21S41/00 , F21S41/153 , F21S41/675 , F21S41/25 , F21S41/365 , F21S41/125 , F21S41/143 , F21S41/20 , F21Y105/12 , F21Y115/10
Abstract: A light source device includes: a substrate; a light-emitting unit matrix including a plurality of light-emitting units disposed in a matrix on the substrate; and a reflective resin disposed in a region, on the substrate, including a region where the light-emitting unit matrix is disposed. The plurality of light-emitting units include a first light-emitting unit and a second light-emitting unit adjacent to each other in a column direction of the light-emitting unit matrix. The reflective resin includes a first reflective portion disposed between the first light-emitting unit and the second light-emitting unit and extending in a direction intersecting the column direction. At least a portion of an upper surface of the first reflective portion protrudes beyond an upper surface of the first light-emitting unit and an upper surface of the second light-emitting unit.
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