公开(公告)号：US20250085234A1

公开(公告)日：2025-03-13

申请号：US18829227

申请日：2024-09-09

Applicant: PDF Solutions, Inc.

Inventor： Hans Eisenmann ,  Markus Rauscher ,  Christian Sendner

IPC: G01N21/95

Abstract: A vector e-beam machine for random defect inspection is disclosed. Contrary to traditional wisdom, it is shown that through a careful choice of target locations, vector machines can provide high-throughput and high coverage even when scanning for random defects. Additionally, by not wastefully scanning locations that provide no additional fault observability, charge accumulation on the wafer—a major concern in e-beam scanning—is reduced.
In a preferred embodiment, two approaches are combined: 1) Scan/target only at locations where a random failure can be observed. 2) From the defined list of observable locations, scan/target only the points which have the highest efficiency. Use of these and/or other disclosed techniques enables the scanner to target and evaluate a majority of the total observable defects in a single pass.

公开(公告)号：US10777472B1

公开(公告)日：2020-09-15

申请号：US16147631

申请日：2018-09-29

Applicant: PDF Solutions, Inc.

Inventor： Stephen Lam ,  Dennis Ciplickas ,  Tomasz Brozek ,  Jeremy Cheng ,  Simone Comensoli ,  Indranil De ,  Kelvin Doong ,  Hans Eisenmann ,  Timothy Fiscus ,  Jonathan Haigh ,  Christopher Hess ,  John Kibarian ,  Sherry Lee ,  Marci Liao ,  Sheng-Che Lin ,  Hideki Matsuhashi ,  Kimon Michaels ,  Conor O'Sullivan ,  Markus Rauscher ,  Vyacheslav Rovner ,  Andrzej Strojwas ,  Marcin Strojwas ,  Carl Taylor ,  Rakesh Vallishayee ,  Larg Weiland ,  Nobuharu Yokoyama

IPC: H01L23/58 ,  H01L21/66 ,  H01L23/528

Abstract: An IC includes a contiguous standard cell area with first, second, and third TS-GATE-short-configured test area geometries disposed therein. In some embodiments, the contiguous standard cell area may further include: fourth and fifth TS-GATE-short-configured test area geometries, and/or other test area geometries, such as tip-to-tip-short, tip-to-side-short, diagonal-short, corner-short, interlayer-overlap-short, via-chamfer-short, merged-via-short, snake-open, stitch-open, via-open, or metal-island-open.

公开(公告)号：US10199293B1

公开(公告)日：2019-02-05

申请号：US15937182

申请日：2018-03-27

Applicant: PDF Solutions, Inc.

Inventor： Stephen Lam ,  Dennis Ciplickas ,  Tomasz Brozek ,  Jeremy Cheng ,  Simone Comensoli ,  Indranil De ,  Kelvin Doong ,  Hans Eisenmann ,  Timothy Fiscus ,  Jonathan Haigh ,  Christopher Hess ,  John Kibarian ,  Sherry Lee ,  Marci Liao ,  Sheng-Che Lin ,  Hideki Matsuhashi ,  Kimon Michaels ,  Conor O'Sullivan ,  Markus Rauscher ,  Vyacheslav Rovner ,  Andrzej Strojwas ,  Marcin Strojwas ,  Carl Taylor ,  Rakesh Vallishayee ,  Larg Weiland ,  Nobuharu Yokoyama

IPC: H01L23/58 ,  H01L21/66 ,  H01L27/118 ,  H01L27/02 ,  H01L23/528 ,  H01L29/06

Abstract: A method for processing a semiconductor wafer uses non-contact electrical measurements indicative of at least one tip-to-tip short or leakage, at least one side-to-side short or leakage, and at least one chamfer short or leakage, where such measurements are obtained from non-contact pads associated with respective tip-to-tip short, side-to-side short, and chamfer short test areas.

公开(公告)号：US10199284B1

公开(公告)日：2019-02-05

申请号：US15936825

申请日：2018-03-27

Applicant: PDF Solutions, Inc.

Inventor： Stephen Lam ,  Dennis Ciplickas ,  Tomasz Brozek ,  Jeremy Cheng ,  Simone Comensoli ,  Indranil De ,  Kelvin Doong ,  Hans Eisenmann ,  Timothy Fiscus ,  Jonathan Haigh ,  Christopher Hess ,  John Kibarian ,  Sherry Lee ,  Marci Liao ,  Sheng-Che Lin ,  Hideki Matsuhashi ,  Kimon Michaels ,  Conor O'Sullivan ,  Markus Rauscher ,  Vyacheslav Rovner ,  Andrzej Strojwas ,  Marcin Strojwas ,  Carl Taylor ,  Rakesh Vallishayee ,  Larg Weiland ,  Nobuharu Yokoyama

IPC: H01L21/66 ,  H01L27/02 ,  H01L23/528 ,  H01L23/58 ,  H01L29/06

Abstract: A method for processing a semiconductor wafer uses non-contact electrical measurements indicative of at least one tip-to-tip short or leakage, at least one tip-to-side short or leakage, and at least one chamfer short or leakage, where such measurements are obtained from non-contact pads associated with respective tip-to-tip short, tip-to-side short, and chamfer short test areas.

公开(公告)号：US10096530B1

公开(公告)日：2018-10-09

申请号：US15635357

申请日：2017-06-28

Applicant: PDF Solutions, Inc.

Inventor： Stephen Lam ,  Dennis Ciplickas ,  Tomasz Brozek ,  Jeremy Cheng ,  Simone Comensoli ,  Indranil De ,  Kelvin Doong ,  Hans Eisenmann ,  Timothy Fiscus ,  Jonathan Haigh ,  Christopher Hess ,  John Kibarian ,  Sherry Lee ,  Marci Liao ,  Sheng-Che Lin ,  Hideki Matsuhashi ,  Kimon Michaels ,  Conor O'Sullivan ,  Markus Rauscher ,  Vyacheslav Rovner ,  Andrzej Strojwas ,  Marcin Strojwas ,  Carl Taylor ,  Rakesh Vallishayee ,  Larg Weiland ,  Nobuharu Yokoyama

IPC: H01L29/00 ,  H01L21/66 ,  G06F17/50 ,  H01L27/02 ,  G06F11/07 ,  H01L29/06

Abstract: A process for making and using a semiconductor wafer includes instantiating first and second designs of experiments (DOES), each comprised of at least two fill cells. The fill cells contain structures configured to obtain in-line data via non-contact electrical measurements (“NCEM”). The first DOE contains fill cells configured to enable non-contact (NC) detection of merged-via opens, and the second DOE contains fill cells configured to enable NC detection of stitch opens. The process may further include obtaining NC measurements from the first and/or second DOE(s) and using such measurements, at least in part, to selectively perform additional processing, metrology or inspection steps on the wafer, and/or on other wafer(s) currently being manufactured.

公开(公告)号：US09818660B1

公开(公告)日：2017-11-14

申请号：US15633920

申请日：2017-06-27

Applicant: PDF Solutions, Inc.

Inventor： Stephen Lam ,  Dennis Ciplickas ,  Tomasz Brozek ,  Jeremy Cheng ,  Simone Comensoli ,  Indranil De ,  Kelvin Doong ,  Hans Eisenmann ,  Timothy Fiscus ,  Jonathan Haigh ,  Christopher Hess ,  John Kibarian ,  Sherry Lee ,  Marci Liao ,  Sheng-Che Lin ,  Hideki Matsuhashi ,  Kimon Michaels ,  Conor O'Sullivan ,  Markus Rauscher ,  Vyacheslav Rovner ,  Andrzej Strojwas ,  Marcin Strojwas ,  Carl Taylor ,  Rakesh Vallishayee ,  Larg Weiland ,  Nobuharu Yokoyama

IPC: H01L29/00 ,  H01L21/66 ,  G06F11/07 ,  G06F17/50 ,  H01L29/06 ,  H01L27/02

CPC classification number: H01L22/20 ,  G01R31/303 ,  G06F11/079 ,  G06F17/5045 ,  G06F17/5068 ,  G06F17/5072 ,  G06F17/5081 ,  G06F2217/06 ,  H01L21/823437 ,  H01L21/823475 ,  H01L22/26 ,  H01L22/32 ,  H01L22/34 ,  H01L23/5226 ,  H01L23/528 ,  H01L27/0207 ,  H01L27/088 ,  H01L27/11803 ,  H01L27/11807 ,  H01L28/00 ,  H01L29/0649 ,  H01L29/0684 ,  H01L29/0847 ,  H01L29/41725 ,  H01L29/45 ,  H01L2027/11866 ,  H01L2027/11875 ,  H01L2027/11888

Abstract: An IC includes first and second designs of experiments (DOEs), each comprised of at least two fill cells. The fill cells contain structures configured to obtain in-line data via non-contact electrical measurements (“NCEM”). The first DOE contains fill cells configured to enable non-contact (NC) detection of via opens, and the second DOE contains fill cells configured to enable NC detection of metal island opens.

公开(公告)号：US09786649B1

公开(公告)日：2017-10-10

申请号：US15634896

申请日：2017-06-27

Applicant: PDF Solutions, Inc.

Inventor： Stephen Lam ,  Dennis Ciplickas ,  Tomasz Brozek ,  Jeremy Cheng ,  Simone Comensoli ,  Indranil De ,  Kelvin Doong ,  Hans Eisenmann ,  Timothy Fiscus ,  Jonathan Haigh ,  Christopher Hess ,  John Kibarian ,  Sherry Lee ,  Marci Liao ,  Sheng-Che Lin ,  Hideki Matsuhashi ,  Kimon Michaels ,  Conor O'Sullivan ,  Markus Rauscher ,  Vyacheslav Rovner ,  Andrzej Strojwas ,  Marcin Strojwas ,  Carl Taylor ,  Rakesh Vallishayee ,  Larg Weiland ,  Nobuharu Yokoyama

IPC: H01L29/00 ,  H01L27/02 ,  H01L21/66 ,  H01L29/417 ,  H01L29/06 ,  H01L23/528 ,  G06F17/50 ,  G06F11/07

CPC classification number: H01L27/0207 ,  G06F11/079 ,  G06F17/5045 ,  G06F17/5072 ,  G06F17/5081 ,  H01L22/14 ,  H01L22/20 ,  H01L22/26 ,  H01L22/34 ,  H01L23/528 ,  H01L27/11807 ,  H01L29/0649 ,  H01L29/0684 ,  H01L29/41725 ,  H01L2027/11875

Abstract: A process for making and using a semiconductor wafer includes instantiating first and second designs of experiments (DOES), each comprised of at least two fill cells. The fill cells contain structures configured to obtain in-line data via non-contact electrical measurements (“NCEM”). The first DOE contains fill cells configured to enable non-contact (NC) detection of via opens, and the second DOE contains fill cells configured to enable NC detection of stitch opens. The process may further include obtaining NC measurements from the first and/or second DOE(s) and using such measurements, at least in part, to selectively perform additional processing, metrology or inspection steps on the wafer, and/or on other wafer(s) currently being manufactured.

公开(公告)号：US09773773B1

公开(公告)日：2017-09-26

申请号：US15395751

申请日：2016-12-30

Applicant: PDF Solutions, Inc.

Inventor： Stephen Lam ,  Dennis Ciplickas ,  Tomasz Brozek ,  Jeremy Cheng ,  Simone Comensoli ,  Indranil De ,  Kelvin Doong ,  Hans Eisenmann ,  Timothy Fiscus ,  Jonathan Haigh ,  Christopher Hess ,  John Kibarian ,  Sherry Lee ,  Marci Liao ,  Sheng-Che Lin ,  Hideki Matsuhashi ,  Kimon Michaels ,  Conor O'Sullivan ,  Markus Rauscher ,  Vyacheslav Rovner ,  Andrzej Strojwas ,  Marcin Strojwas ,  Carl Taylor ,  Rakesh Vallishayee ,  Larg Weiland ,  Nobuharu Yokoyama

IPC: H01L27/00 ,  H01L27/02 ,  H01L21/66 ,  G06F11/07 ,  H01L29/06 ,  G06F17/50

CPC classification number: H01L22/20 ,  G01R31/303 ,  G06F11/079 ,  G06F17/5045 ,  G06F17/5068 ,  G06F17/5072 ,  G06F17/5081 ,  G06F2217/06 ,  H01L21/823437 ,  H01L21/823475 ,  H01L22/26 ,  H01L22/32 ,  H01L22/34 ,  H01L23/5226 ,  H01L23/528 ,  H01L27/0207 ,  H01L27/088 ,  H01L27/11803 ,  H01L27/11807 ,  H01L28/00 ,  H01L29/0649 ,  H01L29/0684 ,  H01L29/0847 ,  H01L29/41725 ,  H01L29/45 ,  H01L2027/11866 ,  H01L2027/11875 ,  H01L2027/11888

Abstract: An IC includes logic cells, selected from a standard cell library, and fill cells, configured for compatibility with the standard logic cells. The fill cells contain structures configured to obtain in-line data via non-contact electrical measurements (“NCEM”). The IC includes such NCEM-enabled fill cells configured to enable detection and/or measurement of a variety of short-circuit failure modes, including at least one chamfer-short-related failure mode, one AACNT-short-related failure mode, one GATE-short-related failure mode, and one GATECNT-short-related failure mode.

公开(公告)号：US09766970B1

公开(公告)日：2017-09-19

申请号：US15635259

申请日：2017-06-28

Applicant: PDF Solutions, Inc.

Inventor： Stephen Lam ,  Dennis Ciplickas ,  Tomasz Brozek ,  Jeremy Cheng ,  Simone Comensoli ,  Indranil De ,  Kelvin Doong ,  Hans Eisenmann ,  Timothy Fiscus ,  Jonathan Haigh ,  Christopher Hess ,  John Kibarian ,  Sherry Lee ,  Marci Liao ,  Sheng-Che Lin ,  Hideki Matsuhashi ,  Kimon Michaels ,  Conor O'Sullivan ,  Markus Rauscher ,  Vyacheslav Rovner ,  Andrzej Strojwas ,  Marcin Strojwas ,  Carl Taylor ,  Rakesh Vallishayee ,  Larg Weiland ,  Nobuharu Yokoyama

IPC: H01L29/00 ,  G06F11/07 ,  G06F17/50 ,  H01L27/02 ,  H01L29/06

CPC classification number: H01L22/20 ,  G01R31/303 ,  G06F11/079 ,  G06F17/5045 ,  G06F17/5068 ,  G06F17/5072 ,  G06F17/5081 ,  G06F2217/06 ,  H01L21/823437 ,  H01L21/823475 ,  H01L22/26 ,  H01L22/32 ,  H01L22/34 ,  H01L23/5226 ,  H01L23/528 ,  H01L27/0207 ,  H01L27/088 ,  H01L27/11803 ,  H01L27/11807 ,  H01L28/00 ,  H01L29/0649 ,  H01L29/0684 ,  H01L29/0847 ,  H01L29/41725 ,  H01L29/45 ,  H01L2027/11866 ,  H01L2027/11875 ,  H01L2027/11888

Abstract: An IC includes first and second designs of experiments (DOES), each comprised of at least two fill cells. The fill cells contain structures configured to obtain in-line data via non-contact electrical measurements (“NCEM”). The first DOE contains fill cells configured to enable non-contact (NC) detection of merged-via opens, and the second DOE contains fill cells configured to enable NC detection of metal island opens.

公开(公告)号：US09761502B1

公开(公告)日：2017-09-12

申请号：US15633040

申请日：2017-06-26

Applicant: PDF Solutions, Inc.

Inventor： Stephen Lam ,  Dennis Ciplickas ,  Tomasz Brozek ,  Jeremy Cheng ,  Simone Comensoli ,  Indranil De ,  Kelvin Doong ,  Hans Eisenmann ,  Timothy Fiscus ,  Jonathan Haigh ,  Christopher Hess ,  John Kibarian ,  Sherry Lee ,  Marci Liao ,  Sheng-Che Lin ,  Hideki Matsuhashi ,  Kimon Michaels ,  Conor O'Sullivan ,  Markus Rauscher ,  Vyacheslav Rovner ,  Andrzej Strojwas ,  Marcin Strojwas ,  Carl Taylor ,  Rakesh Vallishayee ,  Larg Weiland ,  Nobuharu Yokoyama

IPC: H01L27/00 ,  H01L21/66 ,  G06F11/07 ,  G06F17/50 ,  H01L29/06 ,  H01L27/02

CPC classification number: H01L22/20 ,  G01R31/303 ,  G06F11/079 ,  G06F17/5045 ,  G06F17/5068 ,  G06F17/5072 ,  G06F17/5081 ,  G06F2217/06 ,  H01L21/823437 ,  H01L21/823475 ,  H01L22/26 ,  H01L22/32 ,  H01L22/34 ,  H01L23/5226 ,  H01L23/528 ,  H01L27/0207 ,  H01L27/088 ,  H01L27/11803 ,  H01L27/11807 ,  H01L28/00 ,  H01L29/0649 ,  H01L29/0684 ,  H01L29/0847 ,  H01L29/41725 ,  H01L29/45 ,  H01L2027/11866 ,  H01L2027/11875 ,  H01L2027/11888

Abstract: An IC includes first and second designs of experiments (DOEs), each comprised of at least two fill cells. The fill cells contain structures configured to obtain in-line data via non-contact electrical measurements (“NCEM”). The first DOE contains fill cells configured to enable non-contact (NC) detection of via opens, and the second DOE contains fill cells configured to enable NC detection of merged-via opens.