公开(公告)号：US08022556B2

公开(公告)日：2011-09-20

申请号：US10542841

申请日：2003-12-16

申请人： Peter Selmeier ,  Tobias Krems

发明人： Peter Selmeier ,  Tobias Krems

IPC分类号： H01L23/48

CPC分类号： H03H9/6469 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16225 ,  H03H9/02637 ,  H03H9/02992 ,  H03H9/14594 ,  H03H9/643 ,  H03H9/6483 ,  H01L2924/00014

摘要： An electrical component includes a substrate, component structures on the substrate, and solder metal platings electrically connected to the component structures. The substrate is electrically and mechanically connected in a flip chip arrangement to a carrier via connections formed by solder bumps. The solder bumps mate to the solder metal platings. At least one of the solder bumps is on a first solder metal plating. The first solder metal plating has first and second dimensions, where the first dimension is larger than the second dimension.

摘要翻译： 电气部件包括基板，基板上的部件结构以及电连接到部件结构的焊接金属电镀。 基板通过由焊料凸块形成的连接以倒装芯片布置电连接和机械连接到载体。 焊锡凸块与焊料金属镀层配合。 至少一个焊料凸块位于第一焊料金属镀层上。 第一焊料金属镀层具有第一和第二尺寸，其中第一尺寸大于第二尺寸。

公开(公告)号：US20070029679A1

公开(公告)日：2007-02-08

申请号：US10542841

申请日：2003-12-16

申请人： Peter Selmeier ,  Tobias Krems

发明人： Peter Selmeier ,  Tobias Krems

IPC分类号： H01L23/48

CPC分类号： H03H9/6469 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16225 ,  H03H9/02637 ,  H03H9/02992 ,  H03H9/14594 ,  H03H9/643 ,  H03H9/6483 ,  H01L2924/00014

摘要： An electrical component having reduced substrate area is suggested, in which a substrate (S) having component structures (BS), on one surface of which solder metal platings (LA), which are electrically connected to the component structures, are positioned, is electrically and mechanically connected in a flip chip arrangement to a carrier (T) via bump connections formed by solder bumps (B). The solder bumps are seated on the solder metal platings of the substrate. At least one of the bump connections is seated on a non-round solder metal plating, which has a relatively small dimension along a first axis and a larger dimension along a second axis positioned transversely thereto.

摘要翻译： 提出了具有减小的衬底面积的电气部件，其中在其一个表面上具有组件结构（BS）的衬底（S）在其一个表面上与组件结构电连接的焊料金属电镀（LA）被定位， 并且通过由焊料凸块（B）形成的凸点连接以倒装芯片装置机械地连接到载体（T）。 焊料凸点位于衬底的焊料金属镀层上。 凸块连接中的至少一个位于非圆形焊料金属电镀上，该非金属焊料金属镀层沿着第一轴具有相对较小的尺寸，沿着横向于其的第二轴具有较大的尺寸。

公开(公告)号：US08981872B2

公开(公告)日：2015-03-17

申请号：US13122816

申请日：2009-10-15

申请人： Helmut Klamm ,  Peter Selmeier

发明人： Helmut Klamm ,  Peter Selmeier

IPC分类号： H03H9/70 ,  H03H9/72

CPC分类号： H03H9/706 ,  H03H9/725

摘要： An antenna duplexer includes a transmission filter which operates in a transmission frequency band and has a transmission filter output. A reception filter operates in a reception frequency band and has a reception filter output. An antenna connection is connected to the transmission filter output and a matching element is connected between the antenna connection and the reception filter input. The circuit formed from the transmission filter, reception filter and matching element attenuates transmission signals in a frequency band whose frequencies f are in the interval 0.50*f0

摘要翻译： 天线双工器包括在发送频带中操作并具有发送滤波器输出的发送滤波器。 接收滤波器在接收频带中工作并具有接收滤波器输出。 天线连接连接到发射滤波器输出，匹配元件连接在天线连接和接收滤波器输入端之间。 由发送滤波器，接收滤波器和匹配元件形成的电路衰减频率f在区间0.50 * f0 <= f <= 0.75 * f0的频带内的发送信号，其中f0是接收频率的中频 带。

公开(公告)号：US06351197B1

公开(公告)日：2002-02-26

申请号：US09484798

申请日：2000-01-18

申请人： Peter Selmeier ,  Maximilian Pitschi

发明人： Peter Selmeier ,  Maximilian Pitschi

IPC分类号： H03H964

CPC分类号： H03H9/6483

摘要： A surface acoustic wave (SAW) filter having an improved edge steepness includes at least three resonators connected in series and/or parallel with one another. An edge steepness of a pass band is improved if a plurality of resonators with different finger periodicities of interdigital transducers are provided.

摘要翻译： 具有改善的边缘陡度的表面声波（SAW）滤波器包括彼此串联和/或并联连接的至少三个谐振器。 如果提供具有叉指换能器的不同手指周期性的多个谐振器，则通带的边缘陡度得到改善。

公开(公告)号：US07518249B2

公开(公告)日：2009-04-14

申请号：US11659146

申请日：2005-06-08

申请人： Hans Krueger ,  Karl Nicolaus ,  Juergen Portmann ,  Peter Selmeier

发明人： Hans Krueger ,  Karl Nicolaus ,  Juergen Portmann ,  Peter Selmeier

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L23/49838 ,  H01L23/50 ,  H01L23/562 ,  H01L24/14 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/10135 ,  H01L2224/14132 ,  H01L2224/81136 ,  H01L2224/81139 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2224/29099 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A component includes a carrier substrate having a coefficient of thermal expansion αp and a chip mounted on the carrier substrate by a plurality of bumps. The chip has a first coefficient of thermal expansion α1 in a first direction x1 and a first expansion difference, Δα1 equal to the absolute value of αp−α1. The chip also has a second coefficient of thermal expansion α2 in a second direction x2 and a second expansion difference Δα2 is equal to the absolute value of αp−α2,. The bumps are arranged such that a first distance, Δx1, corresponding to a normal projection of a line between centers of terminally situated bumps in the first direction onto an axis running parallel to direction x1 is less than a second distance corresponding to a normal projection of a line between centers of terminally situated bumps in the second direction onto an axis parallel to direction x2.

摘要翻译： 组件包括具有热膨胀系数的载体衬底和通过多个凸块安装在载体衬底上的芯片。 芯片在第一方向x1具有第一热膨胀系数α1和第一膨胀差，Δalpha1等于alphap-α1的绝对值。 该芯片还具有第二方向x2的第二热膨胀系数α2，第二扩张差Δalpha2等于alphap-α2的绝对值。 凸块被布置成使得对应于在第一方向上的终端位置的凸块的中心之间的线的正常投影的平行于方向x1的轴线的第一距离Deltax1小于对应于方向x1的正常投影的第二距离 在第二方向上的终端位置的中心之间的线与平行于方向x2的轴线之间的线。

公开(公告)号：US06747530B1

公开(公告)日：2004-06-08

申请号：US10030856

申请日：2002-01-10

申请人： Peter Selmeier

发明人： Peter Selmeier

IPC分类号： H03H964

CPC分类号： H03H9/6483

摘要： In a SAW filter of the reactance type having at least two SAW resonators in two parallel branches and a SAW resonator in a serial branch, the invention provides that an electrical connection fashioned on the substrate of the ground sides of the two SAW resonators in the parallel branches is done before the bonding to the housing in order to achieve a shift of the pole point belonging to the parallel branch to a lower frequency.

摘要翻译： 在具有两个并联分支中的至少两个SAW谐振器和串联分支中的SAW谐振器的电抗型SAW滤波器中，本发明提供了一种电连接，其形成在并联的两个SAW谐振器的接地侧的基板上 在结合到壳体之前完成分支，以便将属于并联支路的极点的移位实现为较低的频率。

公开(公告)号：US20110248794A1

公开(公告)日：2011-10-13

申请号：US13122816

申请日：2009-10-15

申请人： Helmut Klamm ,  Peter Selmeier

发明人： Helmut Klamm ,  Peter Selmeier

IPC分类号： H03H9/70 ,  H03H9/64

CPC分类号： H03H9/706 ,  H03H9/725

摘要： An antenna duplexer includes a transmission filter which operates in a transmission frequency band and has a transmission filter output. A reception filter operates in a reception frequency band and has a reception filter output. An antenna connection is connected to the transmission filter output and a matching element is connected between the antenna connection and the reception filter input. The circuit formed from the transmission filter, reception filter and matching element attenuates transmission signals in a frequency band whose frequencies f are in the interval 0.50*f0

摘要翻译： 天线双工器包括在发送频带中操作并具有发送滤波器输出的发送滤波器。 接收滤波器在接收频带中工作并具有接收滤波器输出。 天线连接连接到发射滤波器输出，匹配元件连接在天线连接和接收滤波器输入端之间。 由发送滤波器，接收滤波器和匹配元件形成的电路衰减频率f在区间0.50 * f0 <= f <= 0.75 * f0的频带内的发送信号，其中f0是接收频率的中频 带。

公开(公告)号：US20080048317A1

公开(公告)日：2008-02-28

申请号：US11659146

申请日：2005-06-08

申请人： Hans Krueger ,  Karl Nicolaus ,  Juergen Portmann ,  Peter Selmeier

发明人： Hans Krueger ,  Karl Nicolaus ,  Juergen Portmann ,  Peter Selmeier

IPC分类号： H01L21/60

CPC分类号： H01L23/49838 ,  H01L23/50 ,  H01L23/562 ,  H01L24/14 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/10135 ,  H01L2224/14132 ,  H01L2224/81136 ,  H01L2224/81139 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2224/29099 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A component includes a carrier substrate having a coefficient of thermal expansion αp and a chip mounted on the carrier substrate by a plurality of bumps. The chip has a first coefficient of thermal expansion α1 in a first direction x1 and a first expansion difference, Δα1 equal to the absolute value of αp−α1. The chip also has a second coefficient of thermal expansion α2 in a second direction x2 and a second expansion difference Δα2 is equal to the absolute value of αp−α2,. The bumps are arranged such that a first distance, Δx1, corresponding to a normal projection of a line between centers of terminally situated bumps in the first direction onto an axis running parallel to direction x1 is less than a second distance corresponding to a normal projection of a line between centers of terminally situated bumps in the second direction onto an axis parallel to direction x2.

摘要翻译： 一种组件包括具有热膨胀系数α载体的载体衬底和通过多个凸块安装在载体衬底上的芯片。 该芯片在第一方向x 1上具有第一热膨胀系数α1，并且第一膨胀差Δalpha1等于绝对值 αα-α1的值。 芯片还具有在第二方向x 2 2上的第二热膨胀系数α2 2和第二膨胀差Δα2 2等于 α2α2的绝对值。 凸块被布置成使得与第一方向上的终端位置的凸块的中心之间的线的正常投影对应于平行于方向x的轴线上的第一距离Deltax 1 小于与第二方向上的终端位置的凸块的中心之间的线的正常投影对应于平行于方向x 2的轴线的第二距离。

公开(公告)号：US06791437B2

公开(公告)日：2004-09-14

申请号：US10239373

申请日：2003-02-25

申请人： Peter Hagn ,  Peter Selmeier

发明人： Peter Hagn ,  Peter Selmeier

IPC分类号： H03H964

CPC分类号： H03H9/0057 ,  H03H9/0028 ,  H03H9/0038 ,  H03H9/0061 ,  H03H9/14588

摘要： A DMS filter is proposed with first and second interdigital transducers as a signal input or output that are located between reflector structures, wherein at least one acoustic track has a middle transducer that is split into partial transducers symmetric with respect to the perpendicular to the direction of propagation. The DMS filter is connected in a symmetrical manner to a housing using connection pads or connection pins in order to produce an axis-symmetrical connection layout.

摘要翻译： 提出了一种DMS滤波器，其具有第一和第二叉指换能器作为位于反射器结构之间的信号输入或输出，其中至少一个声轨具有中间换能器，该中间换能器被分成相对于垂直于 传播。 DMS滤波器以对称的方式连接到使用连接焊盘或连接引脚的壳体，以便产生轴对称的连接布局。