公开(公告)号：US20190132942A1

公开(公告)日：2019-05-02

申请号：US15798071

申请日：2017-10-30

Applicant: QUALCOMM Incorporated

Inventor： Changhan Hobie YUN ,  Jonghae KIM ,  Xiaoju YU ,  Mario Francisco VELEZ ,  Wei-Chuan CHEN ,  Niranjan Sunil MUDAKATTE ,  Matthew Michael NOWAK ,  Christian HOFFMANN ,  Rodrigo PACHER FERNANDES ,  Manuel HOFER ,  Peter BAINSCHAB ,  Edgar SCHMIDHAMMER ,  Stefan Leopold HATZL

IPC: H05K1/02 ,  H03H9/02 ,  H05K3/32

CPC classification number: H05K1/0233 ,  H03H3/02 ,  H03H3/08 ,  H03H9/02086 ,  H03H9/0547 ,  H03H9/1014 ,  H03H9/1071 ,  H05K3/32

Abstract: A passive on glass (POG) on filter capping apparatus may include an acoustic filter die. The apparatus may further include a capping die electrically coupled to the acoustic filter die. The capping die may include a 3D inductor.

公开(公告)号：US20240097648A1

公开(公告)日：2024-03-21

申请号：US17948984

申请日：2022-09-20

Applicant: QUALCOMM Incorporated

Inventor： Sebastian BRUNNER ,  Changhan Hobie YUN ,  Stefan Leopold HATZL ,  Manuel HOFER ,  Horst DROESCHER ,  Christian HOFFMANN

IPC: H03H9/10

CPC classification number: H03H9/1014 ,  H03H9/1071

Abstract: A package comprising an acoustic device, a polymer frame coupled to the acoustic device, a plurality of frame interconnects located in the polymer frame, where the plurality of frame interconnects are coupled to the acoustic device, a polymer cap layer coupled to the acoustic device though the polymer frame, where the polymer cap layer is configured as a cap for the acoustic device, a plurality of cap interconnects located in the polymer cap layer, where the plurality of cap interconnects are coupled to the plurality of frame interconnects, and a cavity located between the acoustic device and the polymer cap layer. The acoustic device includes a substrate and an acoustic element coupled to the substrate.