公开(公告)号：US20170338179A1

公开(公告)日：2017-11-23

申请号：US15161126

申请日：2016-05-20

Applicant: QUALCOMM Incorporated

Inventor： Paragkumar Ajaybhai THADESAR ,  Young Kyu SONG ,  John Jong-Hoon LEE ,  Sangjo CHOI

IPC: H01L23/522 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L24/85 ,  H01L23/3121 ,  H01L23/552 ,  H01L23/645 ,  H01L24/09 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/19107 ,  H01L2224/45099

Abstract: Low inductance to ground can be provided in wire-bond based device packages. An example device package may include a die on a package substrate, a mold on the package substrate and encapsulating the die, an upper ground conductor on the mold, and ground wire bonds within the mold. The die may include a plurality of terminals on an upper surface of the die. The plurality of ground wire bonds may electrically couple the die and the upper ground conductor. For each ground wire bond, a first end of that ground wire bond may be configured to electrically couple to a corresponding terminal on the upper surface of the die and a second end of that ground wire bond may be configured to electrically couple to the upper ground conductor at the upper surface of the mold.