公开(公告)号：US20220264745A1

公开(公告)日：2022-08-18

申请号：US17174904

申请日：2021-02-12

Applicant: RAYTHEON COMPANY

Inventor： Channing Paige Favreau ,  James E. Benedict ,  Mikhail Pevzner ,  Thomas V. Sikina

IPC: H05K1/11 ,  H05K3/46 ,  H05K3/32 ,  H05K1/02

Abstract: A method of fabricating a printed circuit assembly includes providing a flexible-hybrid circuit having a base and at least one side panel. The at least one side panel is hingedly connected to the base. The method further includes disposing a support structure on the flexible-hybrid circuit. The support structure includes a base, which is disposed on the base of the flexible-hybrid circuit, and at least one side that corresponds to the at least one side panel of the flexible-hybrid circuit. The method further includes folding the at least one side panel of the flexible-hybrid circuit so that the at least one side panel is disposed co-planar with the at least one side of the support structure to create a printed circuit assembly.

公开(公告)号：US11497118B2

公开(公告)日：2022-11-08

申请号：US17174904

申请日：2021-02-12

Applicant: RAYTHEON COMPANY

Inventor： Channing Paige Favreau ,  James E. Benedict ,  Mikhail Pevzner ,  Thomas V. Sikina

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/32 ,  H05K3/46

Abstract: A method of fabricating a printed circuit assembly includes providing a flexible-hybrid circuit having a base and at least one side panel. The at least one side panel is hingedly connected to the base. The method further includes disposing a support structure on the flexible-hybrid circuit. The support structure includes a base, which is disposed on the base of the flexible-hybrid circuit, and at least one side that corresponds to the at least one side panel of the flexible-hybrid circuit. The method further includes folding the at least one side panel of the flexible-hybrid circuit so that the at least one side panel is disposed co-planar with the at least one side of the support structure to create a printed circuit assembly.

公开(公告)号：US12249752B2

公开(公告)日：2025-03-11

申请号：US17929374

申请日：2022-09-02

Applicant: Raytheon Company

Inventor： Channing Paige Favreau ,  Mikhail Pevzner ,  Alexander T. Gilbert ,  Thomas V. Sikina

IPC: H01Q1/12 ,  H01Q1/28 ,  H01Q1/48 ,  H01Q9/04

Abstract: A compressible dielectric standoff configured to mount at least one antenna on a ground plane of an antenna assembly includes a ground plane end configured to contact the ground plane and at least one antenna end configured to contact the at least one antenna. The compressible dielectric standoff is movable between a compressed state in which the ground plane end is spaced apart from the at least one antenna end a first distance, and an expanded state in which the ground plane end is spaced apart from the at least one antenna end a second distance. The first distance is smaller than the second distance.

公开(公告)号：US20230198117A1

公开(公告)日：2023-06-22

申请号：US18053521

申请日：2022-11-08

Applicant: Raytheon Company

Inventor： Channing Paige Favreau

IPC: H01P3/08 ,  H01P11/00 ,  H01P1/30

CPC classification number: H01P3/08 ,  H01P11/003 ,  H01P1/30

Abstract: Methods and apparatus for a self-supported stripline structure including a center conductor having stubs. Opposing first and second ground planes form a cavity in which the center conductor is located. Opposing first and second lateral structures enclose the cavity sides. A first one of the stubs is connected to the first lateral structure to fix the center conductor in position within the cavity.

公开(公告)号：US20230170599A1

公开(公告)日：2023-06-01

申请号：US17929374

申请日：2022-09-02

Applicant: Raytheon Company

Inventor： Channing Paige Favreau ,  Mikhail Pevzner ,  Alexander T. Gilbert ,  Thomas V. Sikina

IPC: H01Q1/12 ,  H01Q1/48 ,  H01Q1/28 ,  H01Q9/04

CPC classification number: H01Q1/1235 ,  H01Q1/48 ,  H01Q1/28 ,  H01Q9/0407

Abstract: A compressible dielectric standoff configured to mount at least one antenna on a ground plane of an antenna assembly includes a ground plane end configured to contact the ground plane and at least one antenna end configured to contact the at least one antenna. The compressible dielectric standoff is movable between a compressed state in which the ground plane end is spaced apart from the at least one antenna end a first distance, and an expanded state in which the ground plane end is spaced apart from the at least one antenna end a second distance. The first distance is smaller than the second distance.