公开(公告)号：US20160087729A1

公开(公告)日：2016-03-24

申请号：US14960768

申请日：2015-12-07

Applicant: RENESAS ELECTRONICS CORPORATION

Inventor： Kazuhiro MITAMURA ,  Shigeru MORIBAYASHI ,  Ryuta YAGINUMA

IPC: H04B10/80

CPC classification number: H04B10/802

Abstract: A photocoupler comprises an input side lead frame; an output side lead frame disposed facing the input side lead frame with a gap therebetween; a light emitting device mounted on a face of the input side lead frame facing the output side lead frame side; a light receiving device mounted on a face of the output side lead frame facing the input side lead frame side, opposite to and having a gap with the light emitting device; and a protrusion disposed on at least a part of an area around the light receiving device on the output side lead frame and being formed of conductive bonding wire or a bump, protruding to the input side lead frame side.

Abstract translation: 光电耦合器包括输入侧引线框架; 输出侧引线框架，其面向所述输入侧引线框架设置，其间具有间隙; 安装在所述输入侧引线框架的面向所述输出侧引线框架侧的面上的发光器件; 安装在输出侧引线框架的面向输入侧引线框架侧的与发光器件相对并且与发光器件具有间隙的光接收器件; 以及设置在输出侧引线框架周围的光接收装置周围的区域的至少一部分上的突起，并且由导电接合线或凸块形成，突出到输入侧引线框架侧。

公开(公告)号：US20160043811A1

公开(公告)日：2016-02-11

申请号：US14812492

申请日：2015-07-29

Applicant: Renesas Electronics Corporation

Inventor： Ryuta YAGINUMA

IPC: H04B10/80 ,  H01L25/16 ,  H01L25/00

CPC classification number: H04B10/802 ,  H01L23/49537 ,  H01L23/49575 ,  H01L24/97 ,  H01L25/167 ,  H01L25/50 ,  H01L31/14 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The alignment accuracy between light emitting elements, light receiving elements, and an insulating film is improved. A photocoupling device manufacturing method includes preparing a first lead frame having a first frame part supporting light receiving elements and a second lead frame having a second frame part supporting light emitting elements. The method also includes superposing the first and the second lead frame such that the light receiving elements and the light emitting elements mutually oppose via a first light-transmissive resin covering the light receiving elements, a second light-transmissive resin covering the light emitting elements, and an insulating film sheet positioned between the first and the second light-transmissive resin. The insulating film sheet includes body parts positioned between the light receiving elements and the light emitting elements, joining parts joined to the body parts, and a third frame part fixed between the first and the second frame part.

Abstract translation: 发光元件，光接收元件和绝缘膜之间的对准精度提高。 光耦合器件制造方法包括制备具有支撑光接收元件的第一框架部分的第一引线框架和具有支撑发光元件的第二框架部件的第二引线框架。 该方法还包括叠加第一引线框和第二引线框，使得光接收元件和发光元件经由覆盖光接收元件的第一透光树脂相互对置，覆盖发光元件的第二透光树脂， 以及位于第一和第二透光树脂之间的绝缘膜片。 绝缘膜片包括位于光接收元件和发光元件之间的身体部分，接合到身体部分的接合部分和固定在第一和第二框架部分之间的第三框架部分。

公开(公告)号：US20140070120A1

公开(公告)日：2014-03-13

申请号：US14023027

申请日：2013-09-10

Applicant: Renesas Electronics Corporation

Inventor： Kazuhiro MITAMURA ,  Shigeru MORIBAYASHI ,  Ryuta YAGINUMA

IPC: H04B10/80

CPC classification number: H04B10/802

Abstract: A photocoupler comprises an input side lead frame; an output side lead frame disposed facing the input side lead frame with a gap therebetween; a light emitting device mounted on a face of the input side lead frame facing the output side lead frame side; a light receiving device mounted on a face of the output side lead frame facing the input side lead frame side, opposite to and having a gap with the light emitting device; and a protrusion disposed on at least a part of an area around the light receiving device on the output side lead frame and being formed of conductive bonding wire or a bump, protruding to the input side lead frame side.

Abstract translation: 光电耦合器包括输入侧引线框架; 输出侧引线框架，其面向所述输入侧引线框架设置，其间具有间隙; 安装在所述输入侧引线框架的面向所述输出侧引线框架侧的面上的发光器件; 安装在输出侧引线框架的面向输入侧引线框架侧的与发光器件相对并且与发光器件具有间隙的光接收器件; 以及设置在输出侧引线框架周围的光接收装置周围的区域的至少一部分上的突起，并且由导电接合线或凸块形成，突出到输入侧引线框架侧。