公开(公告)号：US20170328800A1

公开(公告)日：2017-11-16

申请号：US15649062

申请日：2017-07-13

Applicant: RICHTEK TECHNOLOGY CORPORATION

Inventor： Cheng-Syun Li ,  Chiung-Cheng Lo ,  Chia-Yu Wu ,  Shih-Chieh Lin

IPC: G01L19/00 ,  B81B7/02 ,  G01L9/00

CPC classification number: G01L19/0092 ,  B81B7/02 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/025 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2203/0353 ,  B81B2207/11 ,  B81C1/00309 ,  G01L9/0042 ,  G01L9/0054 ,  G01L9/0072 ,  G01L9/0073 ,  G01L19/0618

Abstract: The invention provides a combo MEMS device. The combo MEMS device includes a substrate, a device layer, a cap, and at least two sensor units. The device layer is on the substrate. The cap is on the device layer. At least two sensor units which are adjacent to each other are both formed by the substrate, the device layer, and the cap. The first sensor unit includes a sealed space, and the second sensor unit includes a membrane and a semi-sealed space. The membrane is formed by reducing a thickness of a portion of the device layer. The semi-sealed space is formed between the substrate and the device layer or between the device layer and the cap, to receive an external pressure through an external pressure communication opening. The external pressure communication opening is formed between the substrate and the device layer, or between the device layer and the cap, or between the substrate and the cap.