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1.
公开(公告)号:US10717643B2
公开(公告)日:2020-07-21
申请号:US15716977
申请日:2017-09-27
Applicant: Rockwell Automation Technologies, Inc.
Inventor: Kristin N. Yee , Michael J. Melfi , Zhenhuan Yuan , John A. Balcerak , Arun K. Guru
Abstract: A motor having a circuit board including at least two MEMS sensors. The circuit board is mounted within a housing of the motor using the same fasteners as an encoder of the motor. Mounting the MEMS sensors to the circuit board simplifies assembly of the motor and standardizes the positioning of the MEMS sensors within the housing, while the overall motor footprint is unaffected.
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公开(公告)号:US11178796B2
公开(公告)日:2021-11-16
申请号:US16142791
申请日:2018-09-26
Applicant: ROCKWELL AUTOMATION TECHNOLOGIES, INC.
Inventor: Brijeshkumar Meghpara , Kristin N. Yee , David A. Figie
Abstract: A cooling system is provided for power conversion circuitry. An intake section of a cooling air channeling element is arranged to direct cooling air through an enclosure, and through or around system components to circuit board-mounted circuitry to be cooled. The element has internal structures, such as deflectors that create local pockets of lower velocity and/or higher pressure air to trap airborne particles that can be evacuated through apertures (e.g., in adjacent plates or mounting structures). The intake section leads to a distribution section that is positioned adjacent to the circuit components to be cooled. The element may have an open bottom that cooperates with surrounding structures to channel the cooling air, facilitating molding of a single-piece element that can be easily mounted during system assembly.
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公开(公告)号:US20230170765A1
公开(公告)日:2023-06-01
申请号:US17536891
申请日:2021-11-29
Applicant: Rockwell Automation Technologies, Inc.
Inventor: Zoran Vrankovic , Kristin N. Yee
CPC classification number: H02K9/223 , H02K11/33 , H02K2211/03
Abstract: Power semiconductor switching devices in an integrated motor drive are mounted directly to a circuit board substrate via a “pick and place” assembly process. The circuit board substrate is then mounted within the housing for the integrated motor drive and, preferably, in a generally central orientation within the housing. A potting material is provided within the housing of the integrated motor drive and around the circuit board. The potting material substantially encloses the circuit board and fills the volume within the integrated motor drive. The potting material is selected to provide good thermal conductivity between the circuit board and the housing of the integrated motor drive. The potting material is also selected to provide flexibility such that expansion and contraction of the potting material due to heating and cooling of the material does not damage the circuit board or the electronic components mounted to the circuit board.
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公开(公告)号:US20230010828A1
公开(公告)日:2023-01-12
申请号:US17368003
申请日:2021-07-06
Applicant: Rockwell Automation Technologies, Inc.
Inventor: Kristin N. Yee , Barbara Grosek , Piotr Hilary Krawiec
Abstract: The present disclosure includes drive modules for motor-drive assemblies of an industrial automation system. The drive modules may include a housing having a cavity and may also include power circuitry and control circuitry. The power circuitry may convert input DC power to three-phase controlled frequency AC power and may supply the three-phase controlled frequency AC power to a motor. The control circuitry may apply control signals to control operation of the motor. The drive module may also include an adapter that couples to a first end of the housing and couples the housing to the motor. The adapter may be removable and sized according to a frame size of the motor such that the drive module is compatible with the motor. The housing may be independent of the frame size of the motor. As such, the housing may be interchangeable for any motor frame size and/or motor power.
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公开(公告)号:US11984774B2
公开(公告)日:2024-05-14
申请号:US17368003
申请日:2021-07-06
Applicant: Rockwell Automation Technologies, Inc.
Inventor: Kristin N. Yee , Barbara Grosek , Piotr Hilary Krawiec
CPC classification number: H02K11/33 , H02K11/0094 , H02K11/21
Abstract: The present disclosure includes drive modules for motor-drive assemblies of an industrial automation system. The drive modules may include a housing having a cavity and may also include power circuitry and control circuitry. The power circuitry may convert input DC power to three-phase controlled frequency AC power and may supply the three-phase controlled frequency AC power to a motor. The control circuitry may apply control signals to control operation of the motor. The drive module may also include an adapter that couples to a first end of the housing and couples the housing to the motor. The adapter may be removable and sized according to a frame size of the motor such that the drive module is compatible with the motor. The housing may be independent of the frame size of the motor. As such, the housing may be interchangeable for any motor frame size and/or motor power.
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公开(公告)号:US20230324432A1
公开(公告)日:2023-10-12
申请号:US17717812
申请日:2022-04-11
Applicant: ROCKWELL AUTOMATION TECHNOLOGIES, INC.
Inventor: Zoran Vrankovic , Arun K. Guru , Todd M. Oestreich , Theodore A. Rodriguez, JR. , Kristin N. Yee , Jon P. Vanderpas
Abstract: The present disclosure is directed to an integrated drive module assembly with vibration-based anomaly detection. The integrated drive module assembly may include a motor coupled to a drive module. The drive module may provide electric power to the motor for operation. Moreover, the drive module may provide control signals to control operations of the motor. The drive module may include an accelerometer and a processing circuit. The processing circuit may determine baseline vibration profiles of the motor during operation using the accelerometer. Subsequently, the processing circuit may determine anomaly conditions of the motor based on comparing the vibrations of the motor with the baseline vibration profiles. Accordingly, the integrated drive module assembly may facilitate performing countermeasures with low latency based on detecting the anomaly conditions using the accelerometer when the drive module is coupled to the motor.
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公开(公告)号:US20200100398A1
公开(公告)日:2020-03-26
申请号:US16142791
申请日:2018-09-26
Applicant: ROCKWELL AUTOMATION TECHNOLOGIES, INC.
Inventor: Brijeshkumar Meghpara , Kristin N. Yee , David A. Figie
Abstract: A cooling system is provided for power conversion circuitry. An intake section of a cooling air channeling element is arranged to direct cooling air through an enclosure, and through or around system components to circuit board-mounted circuitry to be cooled. The element has internal structures, such as deflectors that create local pockets of lower velocity and/or higher pressure air to trap airborne particles that can be evacuated through apertures (e.g., in adjacent plates or mounting structures). The intake section leads to a distribution section that is positioned adjacent to the circuit components to be cooled. The element may have an open bottom that cooperates with surrounding structures to channel the cooling air, facilitating molding of a single-piece element that can be easily mounted during system assembly.
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8.
公开(公告)号:US20190092621A1
公开(公告)日:2019-03-28
申请号:US15716977
申请日:2017-09-27
Applicant: Rockwell Automation Technologies, Inc.
Inventor: Kristin N. Yee , Michael J. Melfi , Zhenhuan Yuan , John A. Balcerak , Arun K. Guru
CPC classification number: B81B3/0075 , B81B3/0048 , B81B2201/0242 , G01D11/24 , G01D11/245 , G01D11/30 , H02P1/02
Abstract: A motor having a circuit board including at least two MEMS sensors. The circuit board is mounted within a housing of the motor using the same fasteners as an encoder of the motor. Mounting the MEMS sensors to the circuit board simplifies assembly of the motor and standardizes the positioning of the MEMS sensors within the housing, while the overall motor footprint is unaffected.
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