公开(公告)号：US08963327B2

公开(公告)日：2015-02-24

申请号：US13872012

申请日：2013-04-26

Applicant: Renesas Electronics Corporation

Inventor： Kozo Harada ,  Shinji Baba ,  Masaki Watanabe ,  Satoshi Yamada

IPC: H01L23/498 ,  H01L21/56 ,  H01L23/00 ,  H01L23/367 ,  H01L23/50

CPC classification number: H01L24/81 ,  H01L21/56 ,  H01L21/563 ,  H01L23/3677 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/14152 ,  H01L2224/14154 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/014

Abstract: A semiconductor device includes lands having an NSMD (non-solder mask defined) structure for mounting thereon solder balls placed in an inner area of a chip mounting area. The lands for mounting thereon solder balls are placed in an area of the back surface of a through-hole wiring board overlapping with a chip mounting area in a plan view. The semiconductor device is mounted on a mounting substrate with the balls.

Abstract translation: 半导体器件包括具有用于安装在芯片安装区域的内部区域中的焊球的NSMD（非阻焊掩模限定）结构的焊盘。 用于安装焊锡球的焊盘放置在平面图中与芯片安装区域重叠的通孔布线板的背面的区域中。 半导体器件安装在具有球的安装基板上。