摘要:
This invention relates to improved lightweight, high temperature resistent, electrically conductive, palladium containing, polyimide films and methods of preparing same for use in aerodynamic and space application. A palladium (II) ion-containing polyamic acid solution is prepared by reacting an aromatic dianhydride with an equimolar quantity of a palladium II ion-containing salt or complex and the reactant product is cast as a thin film onto a surface and cured at approximately 300.degree. C. to produce a flexible electrically conductive cyclic palladium containing polyimide. The source of palladium ions is selected from the group of palladium II compounds consisting of LiPdCl.sub.4, Pd[S(CH.sub.3).sub.2 ].sub.2 Cl.sub.2,Na.sub.2 PdCl.sub.4, and PdCl.sub.2.
摘要:
A method for preparing an aluminum ion-filled polyimide adhesive wherein a meta-oriented aromatic diamine is reacted with an aromatic dianhydride and an aluminum compound in the presence of a water or lower alkanol miscible ether solvent to produce an intermediate polyamic acid; and thereafter converting the polyamic acid to the thermally stable, metal ion-filled polyimide by heating in the temperature range of 300.degree. C. to produce a flexible, high temperature adhesive.
摘要:
Polyimides with enhanced electrical conductivity are produced by adding a silver ion-containing additive to the polyamic acid resin formed by the condensation of an aromatic dianhydride with an aromatic diamine. After thermal treatment the resulting polyimides had surface conductivities in the range of 1.7.times.10.sup.-3 4.5 .OMEGA..sup.-1 making them useful in low the electronics industry as flexible, electrically conductive polymeric films and coatings.
摘要:
Disclosed is a thermally-stable SnO.sub.2 -surfaced polyimide film wherein the electrical conductivity of the SnO.sub.2 surface is within the range of about 3.0.times.10.sup.-3 to about 1.times.10.sup.-2 ohms.sup.-1,. Also disclosed is a method of preparing this film from a solution containing a polyamic acid and SnCl.sub.4 (DMSO).sub.2.
摘要:
Self-metallizing, flexible polyimide films with highly reflective surfaces are prepared by an in situ self-metallization procedure involving thermally initiated reduction of polymer-soluble silver(I) complexes. Polyamic acid solutions are doped with silver(I) acetate and solubilizing agents. Thermally curing the silver(I)-doped resins leads to flexible, metallized films which have reflectivities as high as 100%, abrasion-resistant surfaces, thermal stability and, in some cases, electrical conductivity, rendering them useful for space applications.
摘要:
A series of polyimides based on the dianhydride of 1,4-bis(3,4-dicarboxyphenoxy)benzene (HQDEA) or on 2,2-bis[4(3-aminophenoxy)phenyl]hexafluoropropane (3-BDAF) are evolved from high molecular weight polyamic acid solutions yielding flexible free-standing films and coatings in the fully imidized form which have a dielectric constant in the range of 2.5 to 3.1 at 10 GHz.
摘要:
An electrically conductive, thermooxidatively stable poltimide, especially a film thereof, is prepared from an intimate admixture of a particular polyimide and gold (III) ions, in an amount sufficient to provide between 17 and 21 percent by weight of gold (III) ions, based on the weight of electrically conductive, thermooxidatively stable polyimide. The particular polyimide is prepared from a polyamic acid which has been synthesized from a dianhydride/diamine combination selected from the group consisting of 3,3',4,4'-benzophenonetetracarboxylic dianhydride and 2,2-bis[4-(4 -aminophenoxy)phenyl]hexafluoropropane; 3,3',4,4'-benzophenonetetracarboxylic dianhydride and 4,4'-oxydianiline; 2,2'-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride and 4,4'-oxydianiline; and 3,3'4,4'-benzophenonetetracarboxylic dianhydride and 2,2-bis(3-aminophenyl)hexafluoropropane.
摘要:
A high temperature resistant fiber, especially a polyimide fiber, having a dielectric constant less than 3 is prepared by first reacting 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane with 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride in an aprotic solvent to form a polyamic acid resin solution. The polyamic acid resin solution is then extruded into a coagulation medium to form polyamic acid fibers, which are thermally cured to their polyimide form. Alternatively, 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane with 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride to form a polyamic acid, and the polyamic acid is chemically converted to its polyimide form. The polyimide is then dissolved in a solvent to form a polyimide resin solution, and the polyimide resin is extruded into a coagulation medium to form a polyimide wet gel filament. In order to obtain polyimide fibers of increased tensile properties, the polyimide wet gel filaments are stretched at elevated temperatures. Tensile properties of the fibers were measured and found to be in the range of standard textile fibers. Polyimide fibers obtained by either method will have a dielectric constant similar to that of the corresponding polymer, viz., less than 3 at 10 GHz.
摘要:
An assembly of an article and a polyimide is prepared. The assembly resists dimensional change, delamination, or debonding when exposed to changes in temperature. An article is provided. A soluble polyimide resin solution having a low coefficient of thermal expansion (CTE) was prepared by dissolving the polyimide in solvent and adding a metal ion-containing additive to the solution. Examples of this additive are: Ho(OOCCH.sub.3).sub.3, Er(NPPA).sub.3, TmCl.sub.3, and Er(C.sub.5 H.sub.7 O.sub.2).sub.3. The soluble polyimide resin is combined with the article to form the assembly.
摘要翻译:制备制品和聚酰亚胺的组件。 当暴露于温度变化时,组件抵抗尺寸变化,分层或剥离。 提供了一篇文章。 通过将聚酰亚胺溶解在溶液中并向溶液中加入含金属离子的添加剂,制备热膨胀系数(CTE)的可溶性聚酰亚胺树脂溶液。 这种添加剂的实例是:Ho(OOCCH 3)3,Er(NPPA)3,TmCl 3和Er(C 5 H 7 O 2)3。 可溶性聚酰亚胺树脂与制品组合以形成组件。
摘要:
A process was developed to prepare 1,3-diamino-5-pentafluorosulfanylbenzene. This process involved two steps: preparing the dinitro compound, 1,3-dinitro-5-pentafluorosulfanylbenzene, and reducing this compound to form the corresponding diamine. This diamine was reacted with various dianhydrides, diacidchlorides, and epoxy resins to form polyimides, polyamides, and crosslinked epoxies. These polymers were used to prepare semi-permeable membranes, wire coatings, and films.