Reflective silvered polyimide films via in situ thermal reduction silver
(I) complexes
    5.
    发明授权
    Reflective silvered polyimide films via in situ thermal reduction silver (I) complexes 失效
    反射镀银聚酰亚胺膜通过原位热还原银(I)配合物

    公开(公告)号:US6019926A

    公开(公告)日:2000-02-01

    申请号:US26591

    申请日:1998-02-20

    IPC分类号: B29C41/24 B29D11/00

    摘要: Self-metallizing, flexible polyimide films with highly reflective surfaces are prepared by an in situ self-metallization procedure involving thermally initiated reduction of polymer-soluble silver(I) complexes. Polyamic acid solutions are doped with silver(I) acetate and solubilizing agents. Thermally curing the silver(I)-doped resins leads to flexible, metallized films which have reflectivities as high as 100%, abrasion-resistant surfaces, thermal stability and, in some cases, electrical conductivity, rendering them useful for space applications.

    摘要翻译: 具有高反射表面的自金属化柔性聚酰亚胺膜通过原位自金属化方法制备,其涉及聚合物可溶性银(I)络合物的热引发还原。 聚酰胺酸溶液用乙酸银(I)和增溶剂掺杂。 将I(I)掺杂的树脂热固化导致柔性的金属化膜,其反射率高达100%,耐磨损表面,热稳定性,并且在某些情况下导电性可使其适用于空间应用。

    Low dielectric polyimides
    6.
    发明授权
    Low dielectric polyimides 失效
    低介电聚酰亚胺

    公开(公告)号:US5428102A

    公开(公告)日:1995-06-27

    申请号:US237712

    申请日:1994-05-02

    IPC分类号: C08G73/10 C08L79/08

    CPC分类号: C08G73/1007

    摘要: A series of polyimides based on the dianhydride of 1,4-bis(3,4-dicarboxyphenoxy)benzene (HQDEA) or on 2,2-bis[4(3-aminophenoxy)phenyl]hexafluoropropane (3-BDAF) are evolved from high molecular weight polyamic acid solutions yielding flexible free-standing films and coatings in the fully imidized form which have a dielectric constant in the range of 2.5 to 3.1 at 10 GHz.

    摘要翻译: 一系列基于1,4-双(3,4-二羧基苯氧基)苯(HQDEA)二酐或2,2-双[4-(3-氨基苯氧基)苯基]六氟丙烷(3-BDAF)的二酰亚胺衍生自 高分子量聚酰胺酸溶液产生柔性自立膜和完全酰亚胺化形式的涂层,其在10GHz下的介电常数范围为2.5至3.1。

    Electrically conductive polyimide film containing gold (III) ions,
composition, and process of making
    7.
    发明授权
    Electrically conductive polyimide film containing gold (III) ions, composition, and process of making 失效
    含有金(III)离子的导电聚酰亚胺膜,组成和制备方法

    公开(公告)号:US5575955A

    公开(公告)日:1996-11-19

    申请号:US281804

    申请日:1994-07-22

    摘要: An electrically conductive, thermooxidatively stable poltimide, especially a film thereof, is prepared from an intimate admixture of a particular polyimide and gold (III) ions, in an amount sufficient to provide between 17 and 21 percent by weight of gold (III) ions, based on the weight of electrically conductive, thermooxidatively stable polyimide. The particular polyimide is prepared from a polyamic acid which has been synthesized from a dianhydride/diamine combination selected from the group consisting of 3,3',4,4'-benzophenonetetracarboxylic dianhydride and 2,2-bis[4-(4 -aminophenoxy)phenyl]hexafluoropropane; 3,3',4,4'-benzophenonetetracarboxylic dianhydride and 4,4'-oxydianiline; 2,2'-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride and 4,4'-oxydianiline; and 3,3'4,4'-benzophenonetetracarboxylic dianhydride and 2,2-bis(3-aminophenyl)hexafluoropropane.

    摘要翻译: 导电的,热氧化稳定的聚酰亚胺,特别是其膜由特定聚酰亚胺和金(III)离子的紧密混合物制备,其量足以提供17至21重量%的金(III)离子, 基于导电的,热氧稳定的聚酰亚胺的重量。 特定的聚酰亚胺由聚酰胺酸制备,该聚酰胺酸由选自3,3',4,4'-二苯甲酮四羧酸二酐和2,2-双[4-(4-氨基苯氧基) )苯基]六氟丙烷; 3,3',4,4'-二苯甲酮四羧酸二酐和4,4'-氧二苯胺; 2,2'-双(3,4-二羧基苯基)六氟丙烷二酐和4,4'-氧二苯胺; 和3,3'4,4'-二苯甲酮四羧酸二酐和2,2-双(3-氨基苯基)六氟丙烷。

    Low dielectric polyimide fibers
    8.
    发明授权
    Low dielectric polyimide fibers 失效
    低介电聚酰亚胺纤维

    公开(公告)号:US5367046A

    公开(公告)日:1994-11-22

    申请号:US870003

    申请日:1992-04-10

    摘要: A high temperature resistant fiber, especially a polyimide fiber, having a dielectric constant less than 3 is prepared by first reacting 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane with 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride in an aprotic solvent to form a polyamic acid resin solution. The polyamic acid resin solution is then extruded into a coagulation medium to form polyamic acid fibers, which are thermally cured to their polyimide form. Alternatively, 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane with 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride to form a polyamic acid, and the polyamic acid is chemically converted to its polyimide form. The polyimide is then dissolved in a solvent to form a polyimide resin solution, and the polyimide resin is extruded into a coagulation medium to form a polyimide wet gel filament. In order to obtain polyimide fibers of increased tensile properties, the polyimide wet gel filaments are stretched at elevated temperatures. Tensile properties of the fibers were measured and found to be in the range of standard textile fibers. Polyimide fibers obtained by either method will have a dielectric constant similar to that of the corresponding polymer, viz., less than 3 at 10 GHz.

    摘要翻译: 通过首先使2,2-双[4-(4-氨基苯氧基)苯基]六氟丙烷与2,2-双(3,4-二甲氧基苯基)苯基]六氟丙烷反应,制备介电常数小于3的耐高温纤维,特别是聚酰亚胺纤维, 二羧基苯基)六氟丙烷二酐在非质子溶剂中反应形成聚酰胺酸树脂溶液。 然后将聚酰胺酸树脂溶液挤出到凝固介质中以形成热固化为其聚酰亚胺形式的聚酰胺酸纤维。 或者,将2,2-双(4-氨基苯氧基)苯基]六氟丙烷与2,2-双(3,4-二羧基苯基)六氟丙烷二酐反应形成聚酰胺酸,并将聚酰胺酸化学转化成其聚酰亚胺形式 。 然后将聚酰亚胺溶解在溶剂中以形成聚酰亚胺树脂溶液,并将聚酰亚胺树脂挤出到凝固介质中以形成聚酰亚胺湿凝胶长丝。 为了获得拉伸性能增加的聚酰亚胺纤维,聚酰亚胺湿凝胶长丝在升高的温度下拉伸。 测量纤维的拉伸性能,发现其在标准纺织纤维的范围内。 通过任一方法获得的聚酰亚胺纤维将具有类似于相应聚合物的介电常数,即在10GHz下小于3的介电常数。

    Process for preparing an assembly of an article and a soluble polyimide
which resists dimensional change, delamination, and debonding when
exposed to changes in temperature
    9.
    发明授权
    Process for preparing an assembly of an article and a soluble polyimide which resists dimensional change, delamination, and debonding when exposed to changes in temperature 失效
    用于制备制品和可溶性聚酰亚胺组合物的方法,其在暴露于温度变化时抵抗尺寸变化,分层和脱粘

    公开(公告)号:US5248519A

    公开(公告)日:1993-09-28

    申请号:US736667

    申请日:1991-07-26

    摘要: An assembly of an article and a polyimide is prepared. The assembly resists dimensional change, delamination, or debonding when exposed to changes in temperature. An article is provided. A soluble polyimide resin solution having a low coefficient of thermal expansion (CTE) was prepared by dissolving the polyimide in solvent and adding a metal ion-containing additive to the solution. Examples of this additive are: Ho(OOCCH.sub.3).sub.3, Er(NPPA).sub.3, TmCl.sub.3, and Er(C.sub.5 H.sub.7 O.sub.2).sub.3. The soluble polyimide resin is combined with the article to form the assembly.

    摘要翻译: 制备制品和聚酰亚胺的组件。 当暴露于温度变化时,组件抵抗尺寸变化,分层或剥离。 提供了一篇文章。 通过将聚酰亚胺溶解在溶液中并向溶液中加入含金属离子的添加​​剂,制备热膨胀系数(CTE)的可溶性聚酰亚胺树脂溶液。 这种添加剂的实例是:Ho(OOCCH 3)3,Er(NPPA)3,TmCl 3和Er(C 5 H 7 O 2)3。 可溶性聚酰亚胺树脂与制品组合以形成组件。