公开(公告)号：US08000103B2

公开(公告)日：2011-08-16

申请号：US12339583

申请日：2008-12-19

申请人： Robert J. Lipp ,  Phillip P. Hughes

发明人： Robert J. Lipp ,  Phillip P. Hughes

IPC分类号： H05K7/20 ,  G06F1/20

CPC分类号： F28D15/0266 ,  F28D1/05316 ,  F28D15/00 ,  F28D2021/0031 ,  F28F9/002 ,  F28F2255/02 ,  F28F2275/08 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K7/20818 ,  H01L2924/00

摘要： Various embodiments disclose a system and method to provide cooling to electronic components, such as electronic modules or the like. The system includes one or more cold plates that are configured to be thermally coupled to one or more of the electronic components. Internally, each of the cold plates has a cooling fluid flowing inside of at least one passageway. The cooling fluid thus removes heat from the electronic components primarily by conductive heat transfer. An input and an output header are attached to opposite ends of the passageway to allow entry and exit of the cooling fluid. The input and output headers are attached to an external system to circulate the cooling fluid.

摘要翻译： 各种实施例公开了向电子部件（例如电子模块等）提供冷却的系统和方法。 该系统包括被配置为热耦合到一个或多个电子部件的一个或多个冷板。 在内部，每个冷板具有在至少一个通道内流动的冷却流体。 因此，冷却流体主要通过导电热传递从电子部件移除热量。 输入和输出头部附接到通道的相对端，以允许冷却流体的进入和离开。 输入和输出接头连接到外部系统以使冷却液循环。

公开(公告)号：US20120037339A1

公开(公告)日：2012-02-16

申请号：US13210309

申请日：2011-08-15

申请人： Robert J. Lipp ,  Phillip P. Hughes

发明人： Robert J. Lipp ,  Phillip P. Hughes

IPC分类号： F28F13/00

CPC分类号： F28D15/0266 ,  F28D1/05316 ,  F28D15/00 ,  F28D2021/0031 ,  F28F9/002 ,  F28F2255/02 ,  F28F2275/08 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K7/20818 ,  H01L2924/00

摘要： Various embodiments disclose a system and method to provide cooling to electronic components, such as electronic modules or the like. The system includes one or more cold plates that are configured to be thermally coupled to one or more of the electronic components. Internally, each of the cold plates has a cooling fluid flowing inside of at least one passageway. The cooling fluid thus removes heat from the electronic components primarily by conductive heat transfer. An input and an output header are attached to opposite ends of the passageway to allow entry and exit of the cooling fluid. The input and output headers are attached to an external system to circulate the cooling fluid.

摘要翻译： 各种实施例公开了向电子部件（例如电子模块等）提供冷却的系统和方法。 该系统包括被配置为热耦合到一个或多个电子部件的一个或多个冷板。 在内部，每个冷板具有在至少一个通道内流动的冷却流体。 因此，冷却流体主要通过导电热传递从电子部件移除热量。 输入和输出头部附接到通道的相对端，以允许冷却流体的进入和离开。 输入和输出接头连接到外部系统以循环冷却液。

公开(公告)号：US20090159241A1

公开(公告)日：2009-06-25

申请号：US12339583

申请日：2008-12-19

申请人： Robert J. Lipp ,  Phillip P. Hughes

发明人： Robert J. Lipp ,  Phillip P. Hughes

IPC分类号： F28F7/00 ,  F28F3/12

CPC分类号： F28D15/0266 ,  F28D1/05316 ,  F28D15/00 ,  F28D2021/0031 ,  F28F9/002 ,  F28F2255/02 ,  F28F2275/08 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K7/20818 ,  H01L2924/00

摘要： Various embodiments disclose a system and method to provide cooling to electronic components, such as electronic modules or the like. The system includes one or more cold plates that are configured to be thermally coupled to one or more of the electronic components. Internally, each of the cold plates has a cooling fluid flowing inside of at least one passageway. The cooling fluid thus removes heat from the electronic components primarily by conductive heat transfer. An input and an output header are attached to opposite ends of the passageway to allow entry and exit of the cooling fluid. The input and output headers are attached to an external system to circulate the cooling fluid.

摘要翻译： 各种实施例公开了向电子部件（例如电子模块等）提供冷却的系统和方法。 该系统包括被配置为热耦合到一个或多个电子部件的一个或多个冷板。 在内部，每个冷板具有在至少一个通道内流动的冷却流体。 因此，冷却流体主要通过导电热传递从电子部件移除热量。 输入和输出头部附接到通道的相对端，以允许冷却流体的进入和离开。 输入和输出接头连接到外部系统以循环冷却液。

公开(公告)号：US06751238B1

公开(公告)日：2004-06-15

申请号：US09553501

申请日：2000-04-20

申请人： Robert J. Lipp ,  Phillip P. Hughes

发明人： Robert J. Lipp ,  Phillip P. Hughes

IPC分类号： H04J1408

CPC分类号： H04J3/062 ,  H04J3/0691 ,  H04J2203/0005

摘要： A large network switch has switch elements distributed across several chassis separated by perhaps several hundred meters. A generated sync pulse arrives at different switch elements at different times, creating skew. The latency of data through the network switch is set to match the frame period of SONET frames. SONET frames are adjusted at the ingress ports to align the data pointer to the beginning of the frame. The frame is divided along row boundaries into separate cell-packets that are routed across the switch fabric to the egress port. The packets are held in a buffer at the egress port until the next frame begins with the next sync pulse. Upon receiving the next sync pulse, the frame is transmitted. No pointer adjustment is needed by the egress port. A row number is used as a sequence number for the cell-packet to allow the egress port to re-order the cell-packets when transmitting the frame. Since no pointer manipulation is needed at the egress port, pointer management is simplified.

摘要翻译： 一个大型网络交换机的交换机元件分布在几个机架上，分隔几百米。 产生的同步脉冲在不同时间到达不同的开关元件，产生偏斜。 通过网络交换机的数据延迟设置为与SONET帧的帧周期相匹配。 SONET帧在入口端口进行调整，以将数据指针与帧的开头对齐。 该帧沿着行边界划分成分离的单元包，该数据包通过交换结构路由到出口端口。 分组被保存在出口端口的缓冲器中，直到下一帧以下一个同步脉冲开始。 一旦接收到下一个同步脉冲，则发送该帧。 出口端口不需要调整指针。 使用行号作为信元分组的序列号，以允许出口端口在发送帧时重新排序信元分组。 由于在出口端口不需要指针操作，简化了指针管理。