PRESSURE SENSOR ASSEMBLY
    2.
    发明申请

    公开(公告)号:US20210396615A1

    公开(公告)日:2021-12-23

    申请号:US16906194

    申请日:2020-06-19

    Applicant: Rosemount Inc.

    Abstract: A pressure sensor assembly includes a pressure sensor, a pedestal and an electrically conductive header having a header cavity. The pressure sensor includes, an electrically conductive sensing layer having a sensor diaphragm, an electrically conductive backing layer having a bottom surface that is bonded to the sensing layer, an electrically insulative layer having a bottom surface that is bonded to a top surface of the backing layer, and a sensor element having an electrical parameter that changes based on a deflection of the sensor diaphragm in response to a pressure difference. The pedestal is bonded to the electrically insulative layer and attached to the header within the header cavity.

    METHOD FOR FORMING A PATHWAY IN A PRESSURE SENSOR HAVING A GLASS TO METAL SEAL

    公开(公告)号:US20240241005A1

    公开(公告)日:2024-07-18

    申请号:US18153586

    申请日:2023-01-12

    Applicant: Rosemount Inc.

    CPC classification number: G01L13/025 G01L9/0072

    Abstract: A method of manufacturing a pressure sensor for sensing a pressure of a process fluid includes obtaining a sensor body having a sensor cavity formed therein. A metal tube is placed through an opening in the sensor body into the sensor cavity. A rod is placed through the metal tube and into the sensor cavity. The sensor cavity is at least partially filled with a dielectric material and the dielectric material completely covers the metal tube carried in the sensor cavity and a portion of the rod. The rod is removed and thereby forming a dielectric passageway which is fluidically coupled to the metal tube. The sensor cavity is sealed with a deflectable diaphragm which is configured to deflect in response to applied pressure from the process fluid. A differential pressure sensor for sensing a differential pressure of a process fluid includes a sensor body having a sensor cavity formed therein is also provided.

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