METHOD OF MANUFACTURING MULTILAYER CERAMIC ELECTRONIC COMPONENT
    1.
    发明申请
    METHOD OF MANUFACTURING MULTILAYER CERAMIC ELECTRONIC COMPONENT 审中-公开
    制造多层陶瓷电子元件的方法

    公开(公告)号:US20160225524A1

    公开(公告)日:2016-08-04

    申请号:US14981650

    申请日:2015-12-28

    CPC classification number: H01G4/12 H01G4/008 H01G4/1209

    Abstract: A method of manufacturing a multilayer ceramic electronic component includes preparing a multilayer structure in which dielectric layers containing an alumina base material and internal electrode layers containing nickel are alternately stacked, plasticizing the multilayer structure by heating to a temperature of 500 to 900° C. at a first heating rate under a first reducing atmosphere at a first hydrogen concentration, sintering the multilayer structure by heating to a temperature of 1,250° C. to 1,400° C. at a second heating rate greater than the first heating rate under a second reducing atmosphere at a second hydrogen concentration higher than the first hydrogen concentration, and then maintaining the temperature of 1,250° C. to 1,400° C., and annealing the multilayer structure by cooling the multilayer structure to room temperature at a first cooling rate.

    Abstract translation: 一种制造多层陶瓷电子部件的方法包括制备多层结构,其中包含氧化铝基底材料和含有镍的内部电极层的电介质层交替堆叠,通过加热至500至900℃的温度来增塑多层结构 在第一氢气浓度的第一还原气氛下的第一加热速率,通过在第二还原气氛下以大于第一加热速率的第二加热速率加热至1250℃至1400℃的温度来烧结多层结构 在比第一氢浓度高的第二氢浓度下,然后将温度保持在1250℃至1400℃,并通过以多个第一冷却速率将多层结构冷却至室温来退火多层结构。

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