Abstract:
A method of manufacturing a multilayer ceramic electronic component includes preparing a multilayer structure in which dielectric layers containing an alumina base material and internal electrode layers containing nickel are alternately stacked, plasticizing the multilayer structure by heating to a temperature of 500 to 900° C. at a first heating rate under a first reducing atmosphere at a first hydrogen concentration, sintering the multilayer structure by heating to a temperature of 1,250° C. to 1,400° C. at a second heating rate greater than the first heating rate under a second reducing atmosphere at a second hydrogen concentration higher than the first hydrogen concentration, and then maintaining the temperature of 1,250° C. to 1,400° C., and annealing the multilayer structure by cooling the multilayer structure to room temperature at a first cooling rate.
Abstract:
An electronic component includes: a body having electrical insulating properties; an external electrode disposed on an external surface of the body; and a reinforcing layer disposed on a surface of the body and including a metal oxide layer and a graphene oxide layer.
Abstract:
Disclosed herein is a method for surface treating metal nano particles, including: surface treating metal nano particles with an alkanol amine containing solution.