公开(公告)号：US20230199976A1

公开(公告)日：2023-06-22

申请号：US17726896

申请日：2022-04-22

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Guh Hwan LIM ,  Chi Seong KIM ,  Won Seok LEE ,  Jin Oh PARK ,  Yu Mi KIM ,  Sang Yun LEE ,  Eun Sun KIM

IPC: H05K3/46 ,  H05K3/40 ,  H05K1/11

CPC classification number: H05K3/4697 ,  H05K3/4038 ,  H05K3/4644 ,  H05K1/115 ,  H05K2201/09036

Abstract: A printed circuit board includes a first insulating layer having a through cavity and containing an insulating material. A length between one side surface and the other side surface opposite to the one side surface of the through cavity is greater than a thickness of the first insulating layer, and the first insulating layer includes a recess located in each of an upper edge and a lower edge of the one side surface of the through cavity.

公开(公告)号：US20220210921A1

公开(公告)日：2022-06-30

申请号：US17217264

申请日：2021-03-30

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ho Hyung HAM ,  Won Seok LEE ,  Jae Sung SIM

IPC: H05K1/18 ,  H01L23/538 ,  H05K1/11

Abstract: A connection structure-embedded substrate includes: a printed circuit board including a plurality of first insulating layers of which at least one has a cavity provided therein, a plurality of first wiring layers disposed as at least one of an outer portion and an inner portion of the plurality of first insulating layers, and a first build-up insulating layer disposed on an upper surface of the plurality of first insulating layers; and a connection structure at least partially disposed in the cavity. The first build-up insulating layer is disposed in the cavity, and each of a lower surface of the connection structure and a lower surface of the cavity is in contact with at least a portion of the first build-up insulating layer, respectively.